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Reliability Characterization of Graphene Enhanced Thermal Interface Material for Electronics Cooling Applications

Enmark, Markus, 1991 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Murugesan, Murali (author)
SHT Smart High-Tech AB
Nkansah, Amos (author)
SHT Smart High-Tech AB
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Fu, Yifeng, 1984 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Nilsson, Torbjörn M.J. (author)
Saab AB,Saab
Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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 (creator_code:org_t)
2022
2022
English.
In: 2022 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2022.
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • Graphene-based products are gaining popularity in thermal management applications in high performance electronics systems. The ultra-high thermal conductivity of graphene together with its relatively low density makes it a suitable material for reaching high cooling capability in lightweight applications. An example of products that are starting to enter the market is graphene enhanced thermal interface materials (TIMs). Pristine graphene enhanced TIMs are well characterized and show high thermal conductivity and low thermal interface resistance. Before these TIMs can take the next step from being a niche product to reach high volume sales on the market, it needs to be proven that they have stable performance over time when conditioned and aged according to industry reliability standards. In this work, a set of customized test rigs was designed, and graphene enhanced TIMs of three different thicknesses were tested. The TIMs were compressed by 30% and then subjected to three different industry standard reliability tests; thermal aging, temperature cycling and damp heat. The thermal resistance was measured sequentially during each test to monitor change over time. The reliability tests are still ongoing and so far the tested graphene enhanced TIMs have stable performance over time with some observable trends for the different tests. At the current test time the maximum degradation in thermal resistance is 13%, measured after 511 cycles in the thermal cycling test. The used test method is deemed promising for reliability comparison and future requirement standardization on thermal pads.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Maskinteknik -- Produktionsteknik, arbetsvetenskap och ergonomi (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Mechanical Engineering -- Production Engineering, Human Work Science and Ergonomics (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Bearbetnings-, yt- och fogningsteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Manufacturing, Surface and Joining Technology (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Materialteknik -- Annan materialteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Materials Engineering -- Other Materials Engineering (hsv//eng)
TEKNIK OCH TEKNOLOGIER  -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
NATURVETENSKAP  -- Fysik -- Den kondenserade materiens fysik (hsv//swe)
NATURAL SCIENCES  -- Physical Sciences -- Condensed Matter Physics (hsv//eng)

Keyword

thermal interface material
reliability testing
electronics cooling
graphene

Publication and Content Type

kon (subject category)
ref (subject category)

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