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PBGA Interconnect Behavior under Thermal Effects
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- Zhang, Yan, 1976 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Larsson, Ragnar, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
- (creator_code:org_t)
- 2007
- 2007
- English.
- In: Proceedings of International Conference on Electronics Packaging (ICEP2007), Tokyo, Japan. ; , s. 329-334
- Conference paper (peer-reviewed)
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- TEKNIK OCH TEKNOLOGIER -- Maskinteknik -- Teknisk mekanik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Mechanical Engineering -- Applied Mechanics (hsv//eng)
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