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Improving Thermal T...
Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds
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- Kabiri Samani, Majid, 1976 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Sun, Shuangxi, 1986 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Fu, Yifeng, 1984 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Xu, T (author)
- Southeast University
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- Lilei, Ye (author)
- SHT Smart High-Tech AB
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- Satwara, Maulik, 1990 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Jeppson, Kjell, 1947 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Nilsson, Torbjörn, 1962 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Sun, L (author)
- Southeast University
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2018-06-10
- 2018
- English.
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In: Advanced Materials Interfaces. - : Wiley. - 2196-7350. ; 2018:5
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https://doi.org/10.1...
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Abstract
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- Graphene and carbon nanotubes have received much attention for thermal management application due to their unique thermal performance. Theoretical work suggests that a covalent bond can combine 1D carbon nanotubes with 2D graphene together to extend the excellent thermal property to three dimensions for heat dissipation. This paper experimentally demonstrates the high heat dissipation capability of a freestanding 3D multiwall carbon nanotube (MWCNT) and graphene hybrid material. Using high-resolution transmission electron microscopy and pulsed photothermal reflection measurement method, the covalent bonds between MWCNT and planar graphene are microscopically and numerically demonstrated. Thermal resistance at the junction with covalent bonds is 9×10^−10 Kelvin square meter per watt, which is three orders of magnitude lower than van der Waals contact. Joule heating method is used to verify the extra cooling effect of this 3D hybrid material compared to graphite film. A demonstrator using high power chip is developed to demonstrate the applicability of this hybrid material in thermal application. Temperature at hot spots can be decreased by around 10°C with the assistance of this hybrid material. These findings are very significant for understanding the thermal conduction during combining 1D and 2D carbon material together for future thermal management application.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
- TEKNIK OCH TEKNOLOGIER -- Nanoteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Nano-technology (hsv//eng)
Keyword
- heat dissipation
- thermal management
- Multiwall carbon nanotubes
- Graphene
Publication and Content Type
- art (subject category)
- ref (subject category)
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Kabiri Samani, M ...
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Sun, Shuangxi, 1 ...
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Fu, Yifeng, 1984
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Xu, T
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Lilei, Ye
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Satwara, Maulik, ...
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show more...
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Jeppson, Kjell, ...
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Nilsson, Torbjör ...
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Sun, L
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Liu, Johan, 1960
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- About the subject
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Materials Engine ...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Nano technology
- Articles in the publication
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Advanced Materia ...
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Chalmers University of Technology