Search: id:"swepub:oai:research.chalmers.se:fb74cdfb-226d-4473-b347-13450e87b2db" >
Electrically conduc...
Electrically conductive thermal interface materials based on vertically aligned carbon nanotubes mats
-
- Daon, J. (author)
- Thales Group,Ecole Centrale Paris
-
- Sun, Shuangxi, 1986 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
-
- Jiang, Di, 1983 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
-
show more...
-
- Cibien, G. (author)
- Thales Group
-
- Leveugle, E.M. (author)
- Thales Group
-
- Galindo, C. (author)
- Thales Group
-
- Ziaei, A. (author)
- Thales Group
-
- Ye, L. (author)
- SHT Smart High-Tech AB
-
- Fu, Yifeng, 1984 (author)
- SHT Smart High-Tech AB
-
- Bai, J. (author)
- Ecole Centrale Paris
-
- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
-
show less...
-
(creator_code:org_t)
- ISBN 9781479954155
- 2014
- 2014
- English.
-
In: IEEE 20th International Workshop on Thermal Investigation of ICs and Systems (Therminic). Greenwich, London, United Kingdom, 24-26 September 2014. - 9781479954155
- Related links:
-
https://doi.org/10.1...
-
show more...
-
https://research.cha...
-
show less...
Abstract
Subject headings
Close
- In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. In most electronic assembly, thermal interface materials (TIM) help provide a path for heat dissipation but still represent a bottleneck in the total thermal resistance of the system. VA-CNTs mats are typically grown on HR silicon substrate with Al2O3 diffusion barrier layer using Thermal CVD process. In many cases, 'die attach' thermal interface materials need to be electrically conductive and the growth of dense VA-CNT mats on an electrically conductive substrate remains a challenge. This paper presents the growth of dense VA-CNT mats on doped silicon with Al2O3 and TiN diffusion barrier layer. Processes, thermal and electrical characterization of VA-CNTs based thermal interface materials are studied and reported.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Materialteknik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Materials Engineering (hsv//eng)
Publication and Content Type
- kon (subject category)
- ref (subject category)
Find in a library
To the university's database
- By the author/editor
-
Daon, J.
-
Sun, Shuangxi, 1 ...
-
Jiang, Di, 1983
-
Cibien, G.
-
Leveugle, E.M.
-
Galindo, C.
-
show more...
-
Ziaei, A.
-
Ye, L.
-
Fu, Yifeng, 1984
-
Bai, J.
-
Liu, Johan, 1960
-
show less...
- About the subject
-
- ENGINEERING AND TECHNOLOGY
-
ENGINEERING AND ...
-
and Materials Engine ...
- Articles in the publication
-
IEEE 20th Intern ...
- By the university
-
Chalmers University of Technology