| 21. |
- Ilbäck, Nils-Gunnar, et al.
(författare)
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Selenium and mercury are redistributed to the brain during viral infection in mice
- 2005
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Ingår i: Biological Trace Element Research. - 0163-4984 .- 1559-0720. ; 108:1-3, s. 215-224
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Tidskriftsartikel (refereegranskat)abstract
- As part of the general host response to coxsackievirus B3 (CB3) infection, the concentration of essential and nonessential trace elements changes in different target organs of the infection. Essential (e.g., Se) and nonessential (e.g., Hg) trace elements are known to interact and affect inflammatory tissue lesions induced by CB3 infection. However, it is unknown whether these changes involve the brain. In the present study, the brain Hg and Se contents were measured through inductively coupled plasma-mass spectrometry and their distribution investigated by means of nuclear microscopy in the early phase (d 3) of CB3 infection in normally fed female Balb/c mice. Because of the infection, the concentration of Hg (4.07 +/- 0.46 ng/g wet wt) and Se (340 +/- 16 ng/g wet wt) in the brain increased twofold for Hg (8.77 +/- 1.65 ng/g wet wt, p < 0.05) and by 36% for Se (461 +/- 150 ng/g wet wt, ns). Nuclear microscopy of brain sections from mice having elevated Se and Hg concentrations failed to find localized levels of the elements high enough to make detection possible, indicating approximately homogeneous tissue distribution. Although the pathophysiological interpretation of these findings requires further research, the increase of Hg in the brain during infection might have an influence on the pathogenesis of the disease.
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| 22. |
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| 23. |
- Kvisteroy, Terje, et al.
(författare)
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Far infrared low-cost uncooled bolometer for automotive use
- 2007
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Ingår i: Advanced Microsystems for Automotive Applications 2007. - BERLIN : SPRINGER-VERLAG BERLIN. - 9783540713241 ; , s. 265-278
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Konferensbidrag (refereegranskat)abstract
- A proposed EU regulation requires the automotive industry to develop technologies that will substantially decrease the risk for vulnerable road users such as pedestrians when hit by a vehicle. Automatic brake assist systems, activated by a suitable sensor, will reduce the speed of the vehicle before the impact. Far InfraRed (FIR) detectors are ideal candidates for such sensing systems. In order to enable high volume serial installation, the main development must be focused on cost reduction. Optimizing all aspects of the system, including sensor size, production yield and 3D wafer level vacuum packaging will lower today's "high end" FIR product costs by an order of magnitude. A low-cost FIR infrared bolometer is developed in the Eureka labeled PIMS (Pedestrian Injury Mitigation System) project. In the paper the background and the actual design of the first demonstrator to be finished in 2008 are described in detail.
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| 24. |
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| 25. |
- Källhammer, Jan-Erik, et al.
(författare)
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Fulfilling the pedestrian protection directive using a long-wavelength infrared camera designed to meet both performance and cost targets
- 2006
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Ingår i: Photonics in the Automobile II. - : SPIE. ; , s. 19809-19809
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Konferensbidrag (refereegranskat)abstract
- Pedestrian fatalities are around 15% of the traffic fatalities in Europe. A proposed EU regulation requires the automotive industry to develop technologies that will substantially decrease the risk for Vulnerable Road Users when hit by a vehicle. Automatic Brake Assist systems, activated by a suitable sensor, will reduce the speed of the vehicle before the impact, independent of any driver interaction. Long Wavelength Infrared technology is an ideal candidate for such sensors, but requires a significant cost reduction. The target necessary for automotive serial applications are well below the cost of systems available today. Uncooled bolometer arrays are the most mature technology for Long Wave Infrared with low-cost potential. Analyses show that sensor size and production yield along with vacuum packaging and the optical components are the main cost drivers. A project has been started to design a new Long Wave Infrared system with a ten times cost reduction potential, optimized for the pedestrian protection requirement. It will take advantage of the progress in Micro Electro-Mechanical Systems and Long Wave Infrared optics to keep the cost down. Deployable and pre-impact braking systems can become effective alternatives to passive impact protection systems solutions fulfilling the EU pedestrian protection regulation. Low-cost Long Wave Infrared sensors will be an important enabler to make such systems cost competitive, allowing high market penetration.
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| 26. |
- Lapisa, Martin, et al.
(författare)
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CMOS-integrable piston-type micro-mirror array for adaptive optics made of mono-crystalline silicon using 3-D integration
- 2009
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Ingår i: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems. - : IEEE conference proceedings. - 9781424429783 - 9781424429776 ; , s. 1007-1010
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Konferensbidrag (refereegranskat)abstract
- This paper presents a novel CMOS-compatible fabrication process and evaluations of a micro mirror array (MMA) made of mono-crystalline silicon (m-Si) for adaptive optic (AO) applications. The m-Si mirror layer is transfer bonded from a silicon-on-insulator (SOI) donor wafer with adhesive wafer bonding towards an intermediate patterned polymer spacer layer and clamped with metal plating. We present a CMOS compatible, bond alignment-free fabrication scheme offering the potential for high air gap distances between substrate and mirrors and we show first measurements of the fabricated mirrors.
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| 27. |
- Lapisa, Martin, et al.
(författare)
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Room-temperature wafer-level hermetic sealing for liquid reservoirs by gold ring embossing
- 2009
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Ingår i: TRANSDUCERS 2009. - 9781424441938 - 9781424441907 ; , s. 833-836
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Konferensbidrag (refereegranskat)abstract
- In this paper, we present a novel room temperature wafer-level sealing process for hermetic sealing of reservoirs filled with liquids. This technique can be used for e.g. drug delivery devices or thermo pneumatic devices. The sealing mechanism is based on plastic deformation of metal squeeze rings and embossing of target structures. Epoxy based underfill is used for mechanical stabilization of the wafer bond. We present experimental results from room-temperature bonding of glass wafers to silicon wafers with encapsulation of liquids in reservoirs.
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| 28. |
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| 29. |
- Mircea, M, et al.
(författare)
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Importance of the organic aerosol fraction for modeling aerosol hygroscopic growth and activation: a case study in the Amazon Basin
- 2005
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Ingår i: Atmospheric Chemistry and Physics. - 1680-7324. ; 5, s. 3111-3126
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Tidskriftsartikel (refereegranskat)abstract
- The aerosol in the Amazon basin is dominated throughout the year by organic matter, for the most part soluble in water. In this modeling study, we show how the knowledge of water-soluble organic compounds (WSOC) and the associated physical and chemical properties (e.g. solubility, surface tension, dissociation into ions) affect the hygroscopic growth and activation of the aerosol in this area. The study is based on data obtained during the SMOCC field experiment carried out in Rondonia, Brazil, over a period encompassing the dry (biomass burning) season to the onset of the wet season (September to mid-November, 2002). The comparison of predicted and measured cloud condensation nuclei (CCN) number concentration shows that the knowledge of aerosol WSOC composition in terms of classes of compounds and of their relative molecular weights and acidic properties may be sufficient to predict aerosol activation, without any information on solubility. Conversely, the lack of knowledge on WSOC solubility leads to a high overestimation of the observed diameter growth factors (DGF) by the theory. Moreover, the aerosol water soluble inorganic species fail to predict both DGFs and CCN number concentration. In fact, this study shows that a good reproduction of the measured DGF and CCN concentration is obtained if the chemical composition of aerosol, especially that of WSOC, is appropriately taken into account in the calculations. New parameterizations for the computed CCN spectra are also derived which take into account the variability caused by chemical effects (surface tension, molecular composition, solubility, degree of dissociation of WSOC).
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| 30. |
- Niklaus, Frank, et al.
(författare)
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Adhesive wafer bonding
- 2006
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Ingår i: Journal of Applied Physics. - : AIP Publishing. - 0021-8979 .- 1089-7550. ; 99:3
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Forskningsöversikt (refereegranskat)abstract
- Wafer bonding with intermediate polymer adhesives is an important fabrication technique for advanced microelectronic and microelectromechanical systems, such as three-dimensional integrated circuits, advanced packaging, and microfluidics. In adhesive wafer bonding, the polymer adhesive bears the forces involved to hold the surfaces together. The main advantages of adhesive wafer bonding include the insensitivity to surface topography, the low bonding temperatures, the compatibility with standard integrated circuit wafer processing, and the ability to join different types of wafers. Compared to alternative wafer bonding techniques, adhesive wafer bonding is simple, robust, and low cost. This article reviews the state-of-the-art polymer adhesive wafer bonding technologies, materials, and applications.
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