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| 2. |
- Liu, Cong, et al.
(författare)
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Preparation, crystallization and preliminary X-ray analysis of protein YtlP from Bacillus subtilis
- 2006
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Ingår i: Acta Crystallographica. Section F: Structural Biology and Crystallization Communications. - 2053-230X. ; 62:10, s. 967-969
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Tidskriftsartikel (refereegranskat)abstract
- Bacillus subtilis YtlP is a protein that is predicted to belong to the bacterial and archael 2'-5' RNA-ligase family. It contains 183 residues and two copies of the HXTX sequence motif conserved among proteins belonging to this family. In order to determine the structure of YtlP and to compare it with the paralogue YjcG and identified 2'-5' RNA ligases, the gene ytlP was amplified from B. subtilis genomic DNA and cloned into expression vector pET-21a. The soluble protein was produced in Escherichia coli, purified to homogeneity and crystals suitable for X-ray analysis were obtained. The crystal diffracted to 2.0 angstrom and belonged to space group P2(1)2(1)2(1), with unit-cell parameters a = 34.16, b = 48.54, c = 105.75 angstrom.
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| 3. |
- Nabiollahi, Nabi, 1983, et al.
(författare)
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FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
- 2009
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Ingår i: 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009. - 9789810836948 ; , s. 422-425
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Konferensbidrag (refereegranskat)abstract
- A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.
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| 4. |
- Tian, Haining, et al.
(författare)
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Tuning of phenoxazine chromophores for efficient organic dye-sensitized solar cells.
- 2009
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Ingår i: Chemical Communications. - : Royal Society of Chemistry (RSC). - 1359-7345 .- 1364-548X. ; :41, s. 6288-6290
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Tidskriftsartikel (refereegranskat)abstract
- Through introducing an energy antenna system into a simple phenoxazine dye (TH301), a novel and efficient dye TH305 was designed and synthesized for application in a dye sensitized solar cell with prominent overall conversion efficiency of 7.7%. [on SciFinder(R)]
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| 5. |
- Xu, Li, et al.
(författare)
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Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application
- 2008
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Ingår i: 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008. - 9781424427406
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Konferensbidrag (refereegranskat)abstract
- Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of Polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The Scanning Electron Microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.
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| 6. |
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| 7. |
- Yue, Cong, et al.
(författare)
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Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material
- 2008
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Ingår i: 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008. - 9781424427406 ; , s. C1-10
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Konferensbidrag (refereegranskat)abstract
- Thermal interface materials have been widely adopted in the thermal management for electronics system. Most of the thermal interface materials are made of polymers with thermally conductive particles distributed inside to enhance the thermal conductivity. Thus it is essential to figure out the effective thermal conductivity of this composite material. In the present paper, a parameterized cubic cell model had been developed and implemented by the finite element method. The numerical simulations were carried out to investigate the effect of the filler distributions on the effective thermal conductivity of the thermal interface materials. The volume percentage loadings of the particles ranging from 13% to 74% had been considered, and different particle distribution patterns had also been analyzed. The simulation results were compared with the experimental data as well as other models. A fairly good agreement was obtained for the particle volume percentage loading under consideration, which verified the developed cubic cell model.
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