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Träfflista för sökning "WFRF:(Liu Johan 1960) srt2:(2000-2004)"

Sökning: WFRF:(Liu Johan 1960) > (2000-2004)

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  • Andrae, Anders, 1973, et al. (författare)
  • Uncertainty estimation by Monte Carlo Simulation applied to Life Cycle Inventory of Cordless Phones and Microscale Metallization Processes
  • 2004
  • Ingår i: IEEE Transactions on Electronics Packaging Manufacturing. ; 27:4, s. 233-245
  • Tidskriftsartikel (refereegranskat)abstract
    • This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems is modeled. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. This paper addresses the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices. The paper also addresses the environmental compatibility of Electrochemical Pattern Replication (ECPR) compared to classical photolithography based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions. The projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL respectively. The research method used was probabilistic uncertainty modelling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the Electrochemical Pattern Replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes with the highest electricity consumption within the system boundaries have been determined. Based on earlier work a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. The conclusion is that the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if use in an office is considered. Reasonable uncertainty intervals used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system does affect the outcome of calculation of emission of CO2 but not to the degree that conclusions are not valid.Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependence should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database.More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as System-In-a-Package and System-On-a-Chip comparisons.
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  • Mo, Zhimin, et al. (författare)
  • Integrating nano carbon tubes with microchannel cooler
  • 2004
  • Ingår i: Proceedings of The 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP'4). ; 04:EX905, s. pp 373-376
  • Konferensbidrag (refereegranskat)
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  • Zhou, Jiemin, et al. (författare)
  • Heat Transfer Modeling of System in Package (SIP)
  • 2000
  • Ingår i: Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis. ; , s. 107-125
  • Konferensbidrag (refereegranskat)
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  • Andersson, Cristina, 1969, et al. (författare)
  • Low Cycle fatigue of lead-free solders
  • 2001
  • Ingår i: The Fourth International Symposium on Electronic Packaging Technology. ; , s. 462-470
  • Konferensbidrag (refereegranskat)
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  • Andrae, Anders, 1973, et al. (författare)
  • Development of a generic data collection model for upstream processes in life cycle inventory of electronic products
  • 2002
  • Ingår i: Proceedings of First International Conference on Design And Manufacturing for Sustainable Development. - 1860583962 ; , s. 241-253
  • Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
    • Considerations of cost, high speed, high reliability, high manufacturability and environmental compatibility have to be taken into account in future product development of electronic products. To simulate the environmental compatibility, for example a Life Cycle Assessment (LCA) can be performed. An electronic product usually consists of hundreds to thousands of electronic and mechanical components. To perform an LCA is very time consuming if a Life Cycle Inventory (LCI) is done for every single component. This is not needed because the unit processes in the upstream product system in some cases are the same for the ingoing components. In this paper a generic model for LCI is developed and applied to one product system (a business telephone). In this model, the components are divided into main groups and then into sub-groups that result in process modules for unit processes that are similar for the ingoing components. There already exist some models that describe the LCI of electronic products in other ways. This model takes the LCI strategy for the manufacturing phase one step further by identifying which processes constitute part of the common denominator of the upstream product system and proposes which ones should be inventoried first. The developed model makes it possible to obtain a higher resolution and level of understanding compared to earlier models with respect to both components and processes.
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  • Andrae, Anders, 1973, et al. (författare)
  • Life Cycle Assessment of a telecommunications exchange
  • 2000
  • Ingår i: Journal of Electronics Manufacturing. ; 10:3, s. 147-160
  • Tidskriftsartikel (refereegranskat)abstract
    • This paper describes a comparative life cycle assessment (LCA) of a new Business Communication 10 (BC10) and an old Business Communication 8 (BC8) model of the private branch exchange Modular Digital 110 (MD 110), designed and sold by Ericsson Enterprise AB (EE) and produced by Flextronics, in this case for the European Union (EU) market. LCA is a technique for assessing the environmental aspects and potential impact associated with a products whole life cycle from the cradle to the grave. The study meets the requirements of the standards International Organisation for Standardisation (ISO) 14040:1997 English (E), ISO 14041:1998 E and the draft standards ISO/Draft International Standard (DIS) 14042 and ISO/DIS 14043 and was critically reviewed by Henrik Wenzel, Instituttet for ProduktUdvikling (The Institute for Product Development, IPU) in Denmark. The modelling of the system includes manufacturing (hardware and EEs organisation), use stage (electricity consumption), end-of-life (recycling processes) and transports. Electronic devices are modelled in depth (16 groups of components) and data from over 40 suppliers have been collected. EEs organisation (development, marketing & sales, supply, installation, service and maintenance) is modelled for use of offices and business travelling. The following main conclusions of the project are based on results for potential contributions to the environmental impact categories acidification, global warming and eutrophication, which were chosen to be the most relevant. The environmental impact improvements of the new model compared to the old are approximately 10%, and the uncertainty of the results is judged to be smaller than the difference between the systems.The use stage and the manufacturing stage give the largest impacts, both for the new and the old model. In the manufacturing stage, the hardware production clearly dominates. EEs organisation is secondly most important and hardware transport is least important. This is due to more environmental load from service and business travelling in the organisation than environmental load arising from the distribution of the product. The results predominantly reflect energy use, whereas toxicological aspects could not be reliably assessed due to lack of data and reliable methods and needs separate attention. The technology improvements shown for BC10 compared to BC8 only describe design improvements made by EE, and do not take into account potential technology production improvements made by component suppliers.
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  • Andrae, Anders, 1973, et al. (författare)
  • Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processes
  • 2004
  • Ingår i: IEEE transactions on electronics packaging manufacturing (Print). - 1521-334X .- 1558-0822. ; 27:4, s. 233-245, s. 206-217
  • Tidskriftsartikel (refereegranskat)abstract
    • This paper focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. The present paper addresses the question whether there is an environmental advantage of using digital enhanced cordless telecommunications (DECT) phones instead of global system for mobile (GSM) phones in offices. This paper also addresses the environmental compatibility of electrochemical pattern replication (ECPR) compared to classical photolithography-based microscale metallization (CL) for pattern transfer. Both environmental assessments in this paper consider electricity consumption and CO2 emissions and the projects undertaken are two comparative studies of DECT phone/GSM phone and ECPR/CL, respectively. The research method used was probabilistic uncertainty modeling with a limited number of inventory parameters used in the MATLAB tool. For the DECT/GSM study the results reflects the longer DECT technical life which is an environmental advantage. For the electrochemical pattern replication (ECPR)/classical photolithography based microscale metallization (CL) study the results reflects the fewer number of process steps and the lower electricity consumption needed by the ECPR to reach the functional unit. The difference in results is large enough to be able to draw conclusions, as the processes, having the highest electricity consumption within the system boundaries have been determined. Based on an earlier work, a straightforward method to include uncertainty for input life cycle inventory data is used to quantify the influence of realistic errors for input data in two microelectronic applications. The conclusion is that the ECPR technology is more electricity efficient than CL in producing one layer of copper on a silicon wafer having a diameter of 20.32 cm. Furthermore, the longer technical life of a cordless DECT phone is reflected in an electricity/CO2 comparison with a GSM phone, if office use is considered. Reasonable uncertainty intervals, used for the input life cycle inventory data for the studied DECT/GSM and ECPR/CL system, does affect the outcome of calculation of emission of CO2, but not to the degree that conclusions are not valid. Different uncertainty intervals and probability distributions could apply for different types of data and the interrelated input data dependencies should be investigated. Today there exist very few life cycle inventory (LCI) data with the range of uncertainty for input and output elements. It must be emphasized that the upcoming LCI databases should have standard deviation characterized LCI data just as the Swiss ecoinvent LCI database. More inventory parameters and probability distributions characteristic for microsystems could be included and error analysis should be applied to future life inventory methodology, especially for future packaging concepts such as system-in-a-package and system-on-a-chip comparisons.
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  • Fu, Ying, 1964, et al. (författare)
  • Conductive adhesives
  • 2004
  • Ingår i: Lead free electronics. ; , s. pp 285-351
  • Bokkapitel (övrigt vetenskapligt/konstnärligt)
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  • Fu, Ying, 1964, et al. (författare)
  • Electron conduction through nano particles in electrically conductive adhesives
  • 2004
  • Ingår i: Micromaterials and Nanomaterials. ; 3, s. 104-
  • Tidskriftsartikel (övrigt vetenskapligt/konstnärligt)abstract
    • We have studied the electron transmission of an electrically conductive adhesive (ECA) composed of micro-size and nano-size metal fillers. By quantum mechanics, it has been shown that due to the quantization of electron states in the nano particle, energy barriers are formed at interconnects between the microfillers and nano particles. The energy barriers effectively reduce the electron transmission through the nano particles. For an ECA consisting of 50-nm-diameter nano particles, the electron conduction is reduced by a factor of 2, and the time for the electron to transmit through the nano particle is about 100 ps.
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  • Liu, Johan, 1960, et al. (författare)
  • A General Weibull Model For Reliability Analysis Under Different Failure Criteria –Application on Anisotropic conductive adhesive joining technology
  • 2004
  • Ingår i: 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics; Portland, OR; United States; 12 September 2004 through 15 September 2004. - 9780780387447 ; , s. 191-197
  • Konferensbidrag (refereegranskat)abstract
    • In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joining technology for electronics packaging applications. The model can also be used to predict any minimum failure cycles if the maximum acceptable failure criterion (in this case, a preset electrical resistance value) is set. The original reliability testing from which the test data was obtained was carried out on Flip-Chip anisotropically conductive adhesive joints on an FR-4 substrate. In the study, nine types of anisotropic conductive adhesive (ACA) and one non-conductive film (NCF) were used. In total, nearly one thousand single joints were subjected to reliability tests in terms of temperature cycling between -40°C and 125°C with a dwell time of 15 minutes and a ramp rate of 110°C/min. The reliability was characterized by single contact resistance measured using the four-probe method during temperature cycling testing up to 3000 cycles. A single Weibull model is used for two failure definitions defined as larger than 50mΩ and larger than 100 mΩ respectively using the in-situ electrical resistance measurement technique. The failure criteria are incorporated into this Weibull model. This study shows the flexibility and usefulness of Weibull distribution in this type of applications.
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  • Resultat 1-50 av 84

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