| 1. |
- Abgrall, N., et al.
(författare)
-
The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)
- 2017
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Ingår i: AIP Conference Proceedings. - : Author(s). - 1551-7616 .- 0094-243X. ; 1894
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Konferensbidrag (refereegranskat)abstract
- The observation of neutrinoless double-beta decay (0νββ) would show that lepton number is violated, reveal that neu-trinos are Majorana particles, and provide information on neutrino mass. A discovery-capable experiment covering the inverted ordering region, with effective Majorana neutrino masses of 15 - 50 meV, will require a tonne-scale experiment with excellent energy resolution and extremely low backgrounds, at the level of ∼0.1 count /(FWHM·t·yr) in the region of the signal. The current generation 76Ge experiments GERDA and the Majorana Demonstrator, utilizing high purity Germanium detectors with an intrinsic energy resolution of 0.12%, have achieved the lowest backgrounds by over an order of magnitude in the 0νββ signal region of all 0νββ experiments. Building on this success, the LEGEND collaboration has been formed to pursue a tonne-scale 76Ge experiment. The collaboration aims to develop a phased 0νββ experimental program with discovery potential at a half-life approaching or at 1028 years, using existing resources as appropriate to expedite physics results.
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| 2. |
- Chen, Shujing, et al.
(författare)
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Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
- 2019
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Ingår i: ChemistryOpen. - : Wiley. - 2191-1363. ; 8:1, s. 58-63
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Tidskriftsartikel (refereegranskat)abstract
- Functional fillers, such as Ag, are commonly employed for effectively improving the thermal or electrical conductivity in polymer composites. However, a disadvantage of such a strategy is that the cost and performance cannot be balanced simultaneously. Therefore, the drive to find a material with both a cost efficient fabrication process and excellent performance attracts intense research interest. In this work, inspired by the core-shell structure, we developed a facile manufacturing method to prepare graphene-encapsulated Cu nanoparticles (GCPs) through utilizing an improved chemical vapor deposition (CVD) system with a cold wall reactor. The obtained GCPs could retain their spherical shape and exhibited an outstanding thermal stability up to 179 degrees C. Owing to the superior thermal conductivity of graphene and excellent oxidation resistance of GCPs, the produced GCPs are practically used in a thermally conductive adhesive (TCA), which commonly consists of Ag as the functional filler. Measurement shows a substantial 74.6 % improvement by partial replacement of Ag with GCPs.
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| 3. |
- Cometto, O., et al.
(författare)
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Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics
- 2017
-
Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:8, s. 7456-7464
-
Tidskriftsartikel (refereegranskat)abstract
- High anisotropic thermal materials, which allow heat to dissipate in a preferential direction, are of interest as a prospective material for electronics as an effective thermal management solution for hot spots. However, due to their preferential heat propagation in the in-plane direction, the heat spreads laterally instead of vertically. This limitation makes these materials ineffective as the density of hot spots increases. Here, we produce a new dielectric thin film material at room temperature, named vertically ordered nanocrystalline h-BN (voBN). It is produced such that its preferential thermally conductive direction is aligned in the vertical axis, which facilitates direct thermal extraction, thereby addressing the increasing challenge of thermal crosstalk. The uniqueness of voBN comes from its h-BN nanocrystals where all their basal planes are aligned in the direction normal to the substrate plane. Using the 3 omega method, we show that voBN exhibits high anisotropic thermal conductivity (TC) with a 16-fold difference between through-film TC and in-plane TC (respectively 4.26 and 0.26 W.m(-1).K-1). Molecular dynamics simulations also concurred with the experimental data, showing that the origin of this anisotropic behavior is due to the nature of voBN's plane ordering. While the consistent vertical ordering provides an uninterrupted and preferred propagation path for phonons in the through-film direction, discontinuity in the lateral direction leads to a reduced in-plane TC. In addition, we also use COMSOL to simulate how the dielectric and thermal properties of voBN enable an increase in hot spot density up to 295% compared with SiO2, without any temperature increase.
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| 4. |
- Jing, Lin, et al.
(författare)
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Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays
- 2017
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:17, s. 14555-14560
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Tidskriftsartikel (refereegranskat)abstract
- We demonstrate the thermal conductivity enhancement of the vertically aligned carbon nanotube (CNT) arrays (from ?15.5 to 29.5 W/mK, ?90% increase) by encapsulating outer boron nitride nanotube (BNNT, 0.97 nm-thick with ?3-4 walls). The heat transfer enhancement mechanism of the coaxial C@BNNT was further revealed by molecular dynamics simulations. Because of their highly coherent lattice structures, the outer BNNT serves as additional heat conducting path without impairing the thermal conductance of inner CNT. This work provides deep insights into tailoring the heat transfer of arbitrary CNT arrays and will enable their broader applications as thermal interface material.
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| 5. |
- Liu, Ya, 1991, et al.
(författare)
-
Effect of Boron Nitride Particle Geometry on the Thermal Conductivity of a Boron Nitride Enhanced Polymer Composite Film
- 2019
-
Ingår i: THERMINIC 2019 - 2019 25th International Workshop Thermal Investigations of ICs and Systems.
-
Konferensbidrag (refereegranskat)abstract
- Hexagonal Boron Nitride (h-BN) has been considered as a promising enhancement filler for thermal management due to its high thermal conductivity, structural stability, and super electrical resistivity. Numerus studies have reported using BN as an enhancement filler to achieve high thermally conductive polymer based thermal management materials. However, there are limited data regarding the influence of the flake size of BN sheets to the thermal management property of BN filled composites. In this work, three h-BN size geometries, including microscale h-BN powder, h-BN nanosheets, and a mixture of micro and nanoscale h-BN, were studied regarding its thermal transfer performance. The results show that h-BN nanosheets are able to achieve the highest in-plane thermal conductivity with loading from 0 - 5 wt% while for the through-plane thermal conductivity, all three geometries show similar thermal property when the filler loading less than 5 wt%. Through-plane thermal conductivity exhibits a sudden increase to 5.69 W m-1 K-1 at a loading of 5 wt%..
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| 6. |
- Liu, Ya, 1991, et al.
(författare)
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Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors
- 2018
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Ingår i: Journal of Materials Chemistry A. - : Royal Society of Chemistry (RSC). - 2050-7488 .- 2050-7496. ; 6:37, s. 18267-18275
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Tidskriftsartikel (refereegranskat)abstract
- We demonstrate a simple and scalable strategy to obtain N, S and Si co-doped biocompatible graphene foams (GFs) with different shapes using egg albumen as the template. The unique porous structure and element doping endow the GFs with a high charge-discharge rate and good wettability, which largely improve the electrochemical performance of the electrodes, including ultrahigh specific capacitance (534 F g-1at 1 A g-1), and excellent rate capability (308 F g-1at 100 A g-1) and cycling performance (96.1% retention of the initial capacitance after 10000 cycles at a high current density of 10 A g-1). Besides, when used as an electrochemical sensor for dopamine, the GF exhibits a detection limit as low as 1.2 μM with a linear response up to 70 μM, due to the low equivalent series resistance. These reveal great potential for promoting the application of 3D graphene in energy storage and electrochemical sensors.
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| 7. |
- Liu, Ya, 1991, et al.
(författare)
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Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings
- 2019
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Ingår i: Coatings. - : MDPI AG. - 2079-6412. ; 9:11
-
Tidskriftsartikel (refereegranskat)abstract
- Graphene, the typical two-dimensional sp2 hybridized carbon allotrope, is widely used as a filler for improving the mechanical performance of polymers. However, its superhydrophobic surface makes it a big challenge to obtain stable graphene dispersions, especially in water-borne systems. On the contrary, graphene oxide (GO) shows excellent dispersibility in water, but strong oxidants and acids destroy its structure and degrade its mechanical properties. This largely limits its application in water-borne coatings. In this work, graphene from mechanical exfoliation was surface modified by p-aminophenol derived diazonium salt to achieve a homogenous dispersion. Moreover, the hydroxyl groups in p-aminophenol are able to combine with epoxy resins during the curing process to improve mechanical performance of the final coatings. The result shows that functionalized graphene shows a lower coefficient of friction and better abrasion resistance compared to GO.
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| 8. |
- Liu, Ya, 1991, et al.
(författare)
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Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
- 2019
-
Ingår i: Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019. ; , s. 1-5
-
Konferensbidrag (refereegranskat)abstract
- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400-800 W m-1 K-1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
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| 9. |
- Liu, Ya, 1991, et al.
(författare)
-
Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
- 2019
-
Ingår i: Advancing Microelectronics. - 2222-8748. ; 2019:NOR, s. 1-5
-
Tidskriftsartikel (refereegranskat)abstract
- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
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| 10. |
- Middeldorp, Christel M., et al.
(författare)
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The Early Growth Genetics (EGG) and EArly Genetics and Lifecourse Epidemiology (EAGLE) consortia : design, results and future prospects
- 2019
-
Ingår i: European Journal of Epidemiology. - : Springer Science and Business Media LLC. - 0393-2990 .- 1573-7284. ; 34:3, s. 279-300
-
Tidskriftsartikel (refereegranskat)abstract
- The impact of many unfavorable childhood traits or diseases, such as low birth weight and mental disorders, is not limited to childhood and adolescence, as they are also associated with poor outcomes in adulthood, such as cardiovascular disease. Insight into the genetic etiology of childhood and adolescent traits and disorders may therefore provide new perspectives, not only on how to improve wellbeing during childhood, but also how to prevent later adverse outcomes. To achieve the sample sizes required for genetic research, the Early Growth Genetics (EGG) and EArly Genetics and Lifecourse Epidemiology (EAGLE) consortia were established. The majority of the participating cohorts are longitudinal population-based samples, but other cohorts with data on early childhood phenotypes are also involved. Cohorts often have a broad focus and collect(ed) data on various somatic and psychiatric traits as well as environmental factors. Genetic variants have been successfully identified for multiple traits, for example, birth weight, atopic dermatitis, childhood BMI, allergic sensitization, and pubertal growth. Furthermore, the results have shown that genetic factors also partly underlie the association with adult traits. As sample sizes are still increasing, it is expected that future analyses will identify additional variants. This, in combination with the development of innovative statistical methods, will provide detailed insight on the mechanisms underlying the transition from childhood to adult disorders. Both consortia welcome new collaborations. Policies and contact details are available from the corresponding authors of this manuscript and/or the consortium websites.
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| 11. |
- Wang, Nan, et al.
(författare)
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Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability
- 2019
-
Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; 2019-May, s. 1564-1568
-
Konferensbidrag (refereegranskat)abstract
- High density packaging in combination with increased transistor integration inevitably leads to challenging power densities in terms of thermal management. The conventional TIMs that are widely used in the microelectronic industry today are experiencing more and more stress due to their limited thermal performance and poor reliability. Composed by particle laden polymer matrix, thermal conductivity (K) of conventional TIMs is generally limited to 5 W/mK, and such values can be even lower for electrically insulated TIMs. Conventional TIMs also suffer from severe pump-out and dry-out failures, which brought great threat to the performance and lifetime of the electronic devices. Here, we solve these problems by applying a novel highly thermal conductive, electrically insulated and reliable graphene based TIMs (I-GTs). Composed by vertical graphene structures, I-GTs provide a continuous heat pathway from top to bottom, which enables superfast heat dissipation at through-plane direction. The highest bulk through-plane thermal conductivity of the conductive body can reach up to 1000 W/mK, which is orders of magnitude higher than conventional TIMs, and even outperforms the pure indium TIMs by over ten times. The highly flexible and foldable nature of I-GT enables at least 100% compressibility upon small applied pressures. As excellent gap fillers, I-GT can provide complete physical contact between two surfaces and thereby minimize the contact resistance to heat flow. The measured minimum thermal resistance for I-GTs reaches about 30 Kmm2/W. Such values are significantly higher than the randomly dispersed composites presented above. To ensure fully electrical insulation, a smooth and soft adhesive layer with a thickness of few microns was coated on the surface of I-GT. The breakdown voltage of I-GT reaches up to 950 V. Thermal cycling test shows the highly stable nature of I-GT. The good compressibility and elasticity of I-GT ensures continued proper TIM contact with substrates, which counteracts the effect of internal stress induced by the mismatch of coefficient of thermal expansion (CTE) during temperature cycling. In addition, the I-GTs have the advantages of low density and good maintainability. The resulting I-GTs thus opens new opportunities for addressing large heat dissipation issues for form-factor driven electronics and other high power driven systems.
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| 12. |
- Wang, Nan, et al.
(författare)
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Highly Thermal Conductive and Light -weight Craphene-based Heatsink
- 2019
-
Ingår i: 2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC). - 2165-2341. - 9780956808660
-
Konferensbidrag (refereegranskat)abstract
- With the developing trend ofminiaturization and integration of modem electronic devices, commercial hearsinks ivaterigh, like copper and ii iv are facing mare and mare challenges, such as inefficient cooling performance, large size turd heavy weight. Here, we salve the probletn by developing a novel highly thermal conductive and 11Mo-weight graphene heatsink. Cornposed by vertically-aligned and continUOUS graphene structures, heat transport was highly efficiero from the base 1o fin Ii: ininside the heatsink, The maximum through-platre thermal catuluctivity ofgraphene heatsink can be up to 1000 1500 Ward( which is over 7 times higher than aluminum, and even outperforms copper about 4 times_ Gmphene heatsink demonstrated outstanding cooling perffrmance which wm superior to copper heatsink with the same dimension and same power input. Noticeably, the graphene hearsink also has anportant advantagas of light-weight and high emissions,. The measured density (1 1 g cmli is only onroeighth of copper and lam than hoor of aluminum and emissivity is about ten times hiher than pure rapper and aluminum. The resulting graphene heatsink thus opertS rim opportunities for addressing large heat dissMatMn issues in weight' driven electronics and othm high power smions.
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| 13. |
- Zhang, Dongsheng, et al.
(författare)
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Thermal properties of TIM using CNTs forest in electronics packaging
- 2016
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Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016; Wuhan Optics Valley Kingdom Hotel Wuhan; China; 16 August 2016 through 19 August 2016. ; , s. 1355-1359
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Konferensbidrag (refereegranskat)abstract
- Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a path for interfacial heat transfer. Owing to the exceptional thermal properties of carbon nanotubes (CNT), TIMs based on CNTs have received much attention in recent years. In this study, heat dissipation performance of vertically aligned carbon nanotubes (VACNT) arrays as TIM in electronic packing was analyzed. Vertically aligned carbon nanotubes with length of 245?m and 763?m were synthesized on a silicon substrate by chemical vapor deposition respectively. Morphology of the vertically aligned carbon nanotubes was characterized by scanning electron microscope. The hotspot temperature of thermal test chip with vertically aligned carbon nanotubes were characterized by resistance temperature detector method and infrared imaging method.
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| 14. |
- Zhang, Maomao, et al.
(författare)
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Effect of pressure during graphitization on mechanical properties of graphene films
- 2019
-
Ingår i: 2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019.
-
Konferensbidrag (refereegranskat)abstract
- Graphene films (GFs) can be used in the field of electronics cooling, owing to many outstanding properties. In the present paper, GFs samples were graphitized at different pressures to study their effect on the mechanical properties. The elastic modulus and hardness of GFs were measured by nanoindentation and the tensile strength of GFs were obtained by stretching GFs in a tensile tester. Meanwhile, GFs were characterized by X-ray diffraction(XRD), Scanning electron microscopy (SEM) and Raman spectroscopy. The results show that the modulus, hardness and tensile strength of GFs were strongly influenced by the defect and wrinkles among other things.
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| 15. |
- Zhang, Q., et al.
(författare)
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Effect of sintering method on properties of nanosilver paste
- 2017
-
Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. ; , s. 186-189
-
Konferensbidrag (refereegranskat)abstract
- Nanoscale silver paste has a good application prospect in heat dissipation of high-power chips due to the characteristics of low temperature sintering and high temperature service. The properties of the nanosilver paste including thermal conductivity, electrical conductivity, and shear strength are affected greatly by the sintering process. The influence of different sintering methods on the performance of the nanosilver paste was studied in this article. The nanosilver paste with 80.5 wt% nano-scale silver particles, 1.5 wt% submicron-scale SiC particles with Ag coating, 0.9 wt% dispersion agent, 10 wt% organic carrier and 7.1 wt% diluting agent was sintered at 260°C for 30 min with three different methods, heating table sintering, heating furnace sintering, and mixed sintering. The samples obtained by mixed sintering process have higher thermal conductivity than the ones obtained by heating furnace sintering method and heating table sintering method. The effect of sintering methods on shear strength of nanosilver paste was also investigated subsequently. Shear testing equipment was used to measure the shear strength of the samples gained by heating table sintering, heating furnace sintering, and air dry oven sintering. The maximum shear strength was obtained for the samples by heating table sintering method. The shear strength of samples by air dry oven sintering method was the minimum one.
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| 16. |
- Zhang, Q., et al.
(författare)
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Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
- 2019
-
Ingår i: Soldering and Surface Mount Technology. - 1758-6836 .- 0954-0911. ; 31:4, s. 193-202
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Tidskriftsartikel (refereegranskat)abstract
- © 2019, Emerald Publishing Limited. Purpose: This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated. Design/methodology/approach: Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively. Findings: Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles. Originality/value: Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.
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| 17. |
- Banerjee, Debashree, et al.
(författare)
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Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process
- 2018
-
Ingår i: Nano Energy. - : Elsevier BV. - 2211-2855 .- 2211-3282. ; 44, s. 89-94
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Tidskriftsartikel (refereegranskat)abstract
- The currently dominant thermoelectric (TE) materials used in low to medium temperature range contain Tellurium that is rare and mild-toxic. Silicon is earth abundant and environment friendly, but it is characterized by a poor TE efficiency with a low figure of merit, ZT. In this work, we report that ZT of amorphous silicon (a-Si) thin films can be enhanced by 7 orders of magnitude, reaching ∼0.64 ± 0.13 at room temperature, by means of arsenic ion implantation followed by low-temperature dopant activation. The dopant introduction employed represents a highly controllable doping technique used in standard silicon technology. It is found that the significant enhancement of ZT achieved is primarily due to a significant improvement of electrical conductivity by doping without crystallization so as to maintain the thermal conductivity and Seebeck coefficient at the level determined by the amorphous state of the silicon films. Our results open up a new route towards enabling a-Si as a prominent TE material for cost-efficient and environment-friendly TE applications at room temperature.
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| 18. |
- Bao, Jie, et al.
(författare)
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Application of two-dimensional layered hexagonal boron nitride in chip cooling
- 2016
-
Ingår i: Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. - 1005-0930. ; 24:1, s. 210-217
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Tidskriftsartikel (refereegranskat)abstract
- © 2016, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5℃ at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability.
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| 19. |
- Bao, Jie, et al.
(författare)
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Measurement of Dielectric Properties of Ultrafine BaTiO3 Using an Organic-Inorganic Composite Method
- 2015
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Ingår i: Journal of Electronic Materials. - : Springer Science and Business Media LLC. - 1543-186X .- 0361-5235. ; 44:7, s. 2300-2307
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Tidskriftsartikel (refereegranskat)abstract
- Ultrafine BaTiO3, unlike traditional ferroelectric materials, demonstrates some interesting dielectric properties, such as a gradual transition from paraelectric to ferroelectric phase, which is similar to dielectric relaxation ferroelectrics. Although several methods have been recently proposed to measure the dielectric properties of ultrafine BaTiO3, the problem still remains unsolved. This paper proposes a new method to estimate the dielectric properties of ultrafine BaTiO3 by measuring and analyzing the dielectric properties of BaTiO3-epoxy composites. The Novocontrol dielectric measuring system was employed to measure the dielectric response of the composites. The dielectric behavior and relaxation characteristics of the BaTiO3 filler were estimated by modeling and calculating the dielectric constant based on different mixture theories. Results reveal that the effect of surface states yields dielectric relaxation in ultrafine BaTiO3.
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| 20. |
- Bao, Jie, et al.
(författare)
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Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing
- 2016
-
Ingår i: Electronic Materials Letters. - : Springer Science and Business Media LLC. - 1738-8090 .- 2093-6788. ; 12:1, s. 1-16
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Forskningsöversikt (refereegranskat)abstract
- In similarity to graphene, two-dimensional (2D) hexagonal boron nitride (hBN) has some remarkable properties, such as mechanical robustness and high thermal conductivity. In addition, hBN has superb chemical stability and it is electrically insulating. 2D hBN has been considered a promising material for many applications in electronics, including 2D hBN based substrates, gate dielectrics for graphene transistors and interconnects, and electronic packaging insulators. This paper reviews the synthesis, transfer and fabrication of 2D hBN films, hBN based composites and hBN-based van der Waals heterostructures. In particular, this review focuses on applications in manufacturing electronic devices where the insulating and thermal properties of hBN can potentially be exploited. 2D hBN and related composite systems are emerging as new and industrially important materials, which could address many challenges in future complex electronics devices and systems.
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| 21. |
- Bao, Jie, 1982, et al.
(författare)
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Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging
- 2016
-
Ingår i: Journal of Physics D: Applied Physics. - : IOP Publishing. - 1361-6463 .- 0022-3727. ; 49:July 2016, s. 265501-
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Tidskriftsartikel (refereegranskat)abstract
- The need for electrically insulating materials with a high in-plane thermal conductivity for lateral heat spreading applications in electronic devices has intensified studies of layered hexagonal boron nitride (h-BN) films. Due to its physicochemical properties, h-BN can be utilised in power dissipating devices such as an electrically insulating heat spreader material for laterally redistributing the heat from hotspots caused by locally excessive heat flux densities. In this study, two types of boron nitride based heat spreader test structures have been assembled and evaluated for heat dissipation. The test structures separately utilised a few-layer h-BN film with and without graphene enhancement drop coated onto the hotspot test structure. The influence of the h-BN heat spreader films on the temperature distribution across the surface of the hotspot test structure was studied at a range of heat flux densities through the hotspot. It was found that the graphene-enhanced h-BN film reduced the hotspot temperature by about 8–10°C at a 1000 W/cm2 heat flux density, a temperature decrease significantly larger than for h-BN film without graphene enhancement. Finite element simulations of the h-BN film predict that further improvements in heat spreading ability are possible if the thermal contact resistance between the film and test chip are minimised.
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| 22. |
- Bistarelli, Silvia, et al.
(författare)
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Evaluating CNT-Based Interconnects : A Nummerical Tool to Characterize Hybrid CNT-Copper Interconnects
- 2017
-
Ingår i: IEEE Microwave Magazine. - 1527-3342 .- 1557-9581. ; 18:4, s. 124-129
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Tidskriftsartikel (refereegranskat)abstract
- Nanotechnologies offer a vast number of applications due to the unique features of nanostructured materials [1]. In the electronics field, this new technology could open innovative ways to go beyond Moore's law [2], but progress in manufacturing technology still limits the wide dispersion of nanotechnology-based circuits. The bridge between nanoscience and realized devices can be achieved by modeling the multiphysics phenomena at the nanoscale, which will aid in the development of the technology.
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| 23. |
- Casa, Marcello, et al.
(författare)
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Conductive adhesive based on mussel-inspired graphene decoration with silver nanoparticles
- 2018
-
Ingår i: Journal of Nanoscience and Nanotechnology. - : American Scientific Publishers. - 1533-4880. ; 18:2, s. 1176-1185
-
Tidskriftsartikel (refereegranskat)abstract
- Decoration with silver nanoparticles was obtained by coating graphene with a polydopamine layer, able to induce spontaneous metallic nanoparticles formation without any specific chemical interfacial modifier, neither using complex instrumentation. The choice of dopamine was inspired by the composition of adhesive proteins in mussels, related to their robust attach to solid surfaces. The synthesis procedure started from graphite and involved eco-friendly compounds, such as Vitamin C and glucose as reducing agent and water as reaction medium. Silver decorated graphene was inserted as secondary nanofiller in the formulation of a reference conductive adhesive based on epoxy resin and silver flakes. A wide characterization of the intermediate materials obtained along the step procedure for the adhesive preparation was carried out by several techniques. We have found that the presence of nanofiller yields, in addition to an improvement of the thermal conductivity (up to 7.6 W/m· K), a dramatic enhancement of the electrical conductivity of the adhesive. In particular, starting from 3 · 10 2 S/cm of the reference adhesive, we obtained a value of 4 · 10 4 S/cm at a nanofiller concentration of 11.5 wt%. The combined double filler conductivity was evaluated by Zallen’s model. The effect of the temperature on the resistivity of the adhesive has been also studied.
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| 24. |
- Casa, Marcello, et al.
(författare)
-
Silver decorated graphene-polyvinyl alcohol hybrid hydrogel as catalyst for benzonitrile conversion
- 2017
-
Ingår i: Advanced Science Letters. - : American Scientific Publishers. - 1936-7317 .- 1936-6612. ; 23:6, s. 5980-5983
-
Tidskriftsartikel (refereegranskat)abstract
- In this work, we have synthetized a reduced graphene oxide functionalized with silver nanoparticles (G/Ag) by a method developed in our previous study and incorporated it in a hydrogel based on polyvinyl alcohol (PVA) as gelator through a freezing/thawing method. The hydrogel has been tested to catalyze the reduction at room temperature of nitrile group of benzonitrile in water by using glucose as a natural and mild reducing agent.
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| 25. |
- Chen, Si, 1981, et al.
(författare)
-
A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material
- 2015
-
Ingår i: Materials Today: Proceedings. - : Elsevier BV. - 2214-7853. ; 2:2, s. 610-619
-
Konferensbidrag (refereegranskat)abstract
- A silver alloyed n-type bismuth telluride (Bi2Te3) thermoelectric (TE) bulk material with nano crystalline structure was studied and characterized in this paper. The Bi2Te3 nanopowders used in this study were first fabricated via a patented explosion based process. Then, the various concentrations of Ag nanoparticles (0-20 wt. %) were added into the Bi2Te3 nanopowders in order to increase the electrical conductivity. Combining the benefits of high electrical conductivity (1.51x10(5) S.m(-1)) and low thermal conductivity (0.441 W.m(-1).K-1), the dimensionless figure of merit (ZT value) of 1.48 for this n-type Bi2Te3 TE material is achieved at 300 K temperature.
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| 26. |
- Chen, S., et al.
(författare)
-
An overview of carbon nanotubes based interconnects for microelectronic packaging
- 2017
-
Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 113-119
-
Konferensbidrag (refereegranskat)abstract
- Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.
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| 27. |
- Chen, Si, 1981, et al.
(författare)
-
Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles
- 2015
-
Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - : Institute of Electrical and Electronics Engineers (IEEE). - 2156-3985 .- 2156-3950. ; 5:8, s. 1186-1196
-
Tidskriftsartikel (refereegranskat)abstract
- Nanocomposite solders are regarded as one of the most promising interconnect materials for the high-density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. The compatibility issue will lead to a huge loss of nanoparticles from the solder matrix after the reflow soldering process. The thermal fatigue resistance of solder joint will also become degraded. Therefore, aiming to solve this problem, a novel nanocomposite solder consisting of Bi2Te3 semiconductor nanoparticles and Sn-3.0Ag-0.5Cu (SAC305) solder is presented. The effect of nanoparticles on the viscosity of solder paste and the void content of solder bump was first studied. Then, a series of analysis on the composition and microstructure of the solder bump were completed using transmission electron microscopy, X-ray diffraction, inductively coupled plasma-mass spectrometry, scanning electron microscopy, and energy dispersive X-ray spectroscopy. The survival rate of nanoparticles in the solder bump after reflow soldering process reaches as high as 80%. The refined microstructure was observed from the cross section of the nanocomposite solders. The shear test showed that the average mechanical strength of SAC305 solder after the addition of Bi2Te3 nanoparticles was higher. Meanwhile, no thermal fatigue resistance degradation was detected in the nanocomposite solder after 1000 thermal cycles in the range of -40 degrees C to 115 degrees C.
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| 28. |
- Chen, W. H., et al.
(författare)
-
Nanophotonics-based low-temperature PECVD epitaxial crystalline silicon solar cells
- 2016
-
Ingår i: Journal of Physics D: Applied Physics. - : IOP Publishing. - 1361-6463 .- 0022-3727. ; 49:12
-
Tidskriftsartikel (refereegranskat)abstract
- The enhancement of light absorption via nanopatterning in crystalline silicon solar cells is becoming extremely important with the decrease of wafer thickness for the further reduction of solar cell fabrication cost. In order to study the influence of nanopatterning on crystalline silicon thin-film solar cells, we applied two lithography techniques (laser interference lithography and nanoimprint lithography) combined with two etching techniques (dry and wet) to epitaxial crystalline silicon thin films deposited via plasma-enhanced chemical vapor deposition at 175 degrees C. The influence of nanopatterning with different etching profiles on solar cell performance is studied. We found that the etching profiles (pitch, depth and diameter) have a stronger impact on the passivation quality (open circuit voltage and fill factor) than on the optical performance (short circuit current density) of the solar cells. We also show that nanopatterns obtained via wet-etching can improve solar cell performance; and in contrast, dry-etching leads to poor passivation related to the etching profile, surface damage, and/ or contamination introduced during the etching process.
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| 29. |
- Daon, J., et al.
(författare)
-
Chemically enhanced carbon nanotubes based Thermal Interface Materials
- 2015
-
Ingår i: THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems 2015. - 9781467397056
-
Konferensbidrag (refereegranskat)abstract
- With progress in microelectronics the component density on a device increases drastically. As a consequence the power density reaches levels that challenge device reliability. New heat dissipation strategies are needed to efficiently drain heat. Thermal Interface Materials (TIMs) are usually used to transfer heat across interfaces, for example between a device and its packaging. Vertically Aligned Carbon Nanotubes (VACNTs) can be used to play this role. Indeed, carbon nanotubes are among the best thermal conductors (similar to 3.000 W/mK) and in the form of VACNT mats, show interesting mechanical properties. On one side, VACNTs are in contact with their growth substrate and there is a low thermal resistance. On the other side, good contact must be created between the opposite substrate and the VACNTs in order to decrease the contact thermal resistance. A thin-film deposition of an amorphous material can be used to play this role. This paper reports a chemically enhanced carbon nanotube based TIM with creation of chemical bonds between the polymer and VACNTs. We show that these covalent bonds enhance the thermal transfer from VACNTs to a copper substrate and can dramatically decrease local resistances. Implementation processes and thermal characterizations of TIMs are studied and reported.
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| 30. |
- Darmawan, C. C., et al.
(författare)
-
Graphene-CNT hybrid material as potential thermal solution in electronics applications
- 2017
-
Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 190-193
-
Konferensbidrag (refereegranskat)abstract
- Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.
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| 31. |
- Edwards, Michael, 1986, et al.
(författare)
-
Finite element simulation of 2D-based materials as heat spreaders
- 2016
-
Ingår i: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
-
Konferensbidrag (refereegranskat)abstract
- Since the discovery of graphene, the first discovered 2D material, by Novoselov and Geim in 2004, the field of 2D materials has taken off and about 20 further 2D materials have been found. One of the most promising of these materials for the passive cooling of chips is hBN. HBN has the very unusual combination of being electrically insulating and thermally conductive, which potentially makes it an ideal material for both laterally spreading heat and passivating hotspots on chips. This gives hBN an advantage over graphene, where the chip requires a SiO2 passivation layer to prevent short circuits. To help evaluate the performance of these heat spreading films, a finite element model has been devised to support the experimental work undertaken in various publications. This model has been validated with experimental data and suggests that both graphene-And hBN-based materials have significant potential in lateral heat spreading applications.
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| 32. |
- Fu, Yifeng, 1984, et al.
(författare)
-
Carbon nanotube growth on different underlayers for thermal interface material application
- 2016
-
Ingår i: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
-
Konferensbidrag (refereegranskat)abstract
- Thermal interface material (TIM) is a critical component in thermal management of high density packaging systems since both the reliability and lifetime of microsystems are dependent on how the heat is dissipated. Carbon nanotubes (CNTs) are promising candidate for development of TIMs due to their excellent thermal and mechanical properties. The thermal conductivity of CNTs can be up to 3000 W/mK in the longitudinal direction which acts as ideal heat transfer path. However, the huge interfacial thermal resistance between CNTs and contact surface hinders the exploitation of CNTs as TIMs. In this paper, we will focus on the growth of CNTs on various substrates and underlayers and analyze the interaction between catalyst and underlayer materials. Microscopic analysis is performed to characterize the quality of the CNT materials and monitor the diffusion of Fe particles into different barrier layers. Thermal conductivity of the CNT TIMs will be measured to examine the performance of the materials.
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| 33. |
- Fu, Yifeng, 1984, et al.
(författare)
-
Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
- 2016
-
Ingår i: 2016 6th Electronic System-Integration Technology Conference (Estc). - 9781509014026 ; , s. Article no 7764713-
-
Konferensbidrag (refereegranskat)abstract
- Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various post-growth processing of CNTs, such as doping, densification, transfer, metallization, etc., for the improvement of their performance will be reviewed.
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| 34. |
- Grammatikos, Sotirios, 1985, et al.
(författare)
-
Concrete setting and hardening monitoring using a novel graphene-based sensor
- 2017
-
Ingår i: ICF 2017 - 14th International Conference on Fracture. ; 2, s. 1204-1205
-
Konferensbidrag (refereegranskat)abstract
- This paper presents the procedure towards the development of a durable structural sensor based on graphene and other carbon fillers, for the monitoring of structural performance of concrete. The sensor captures electrical resistivity as a strength development and durability index during the whole service life of concrete. To date, performance monitoring systems usually fail in the long-run before the failure of the actual structure. The proposed sensor is embedded in the interrogated structure and ensures sustainable consolidation via appropriate physico-chemical adherence and mechanical interlocking. This allows for an efficient performance monitoring 'build-up' expected to surpass the service life of the parent concrete structure. The effects of different concentrations of graphene and other fillers on the electrical properties of concrete were studied. After an initial investigation to select the appropriate synthesis, the ability of the sensor to monitor the development of resistivity during setting and hardening was tested and the results are presented herein.
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| 35. |
- Gutierrez, Martí, 1993, et al.
(författare)
-
Sintering of SiC enhanced copper paste for high power applications
- 2017
-
Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 151-156
-
Konferensbidrag (refereegranskat)abstract
- In this work a Cu paste consisting in both micro and nanoparticles was produced. The copper paste was produced with different additive weight percentages of Ag coated SiC and sintered for 30min at 500°C under 6,5MPa in N2 atmosphere. The thermal resistance and composition of the resulting joints was studied. XPS and EDX measurements show no significant oxidation of the Cu after sintering, which is attributed to the combination of reductive agents in the paste and the inert atmosphere. SEM images of cross sections show contacts with no voids between the SiC particles and the copper matrix. Thermal conductivity measurements with laser flash analysis (LFA) show that the additive increases the effective thermal conductivity to more than double of that of the pure copper paste at 2% additive weight percentage, but bigger amounts yield smaller improvements and presumably would eventually worsen it.
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| 36. |
- Han, H. X., et al.
(författare)
-
Functionalization mediates heat transport in graphene nanoflakes
- 2016
-
Ingår i: Nature Communications. - : Springer Science and Business Media LLC. - 2041-1723 .- 2041-1723. ; 7
-
Tidskriftsartikel (refereegranskat)abstract
- The high thermal conductivity of graphene and few-layer graphene undergoes severe degradations through contact with the substrate. Here we show experimentally that the thermal management of a micro heater is substantially improved by introducing alternative heat-escaping channels into a graphene-based film bonded to functionalized graphene oxide through amino-silane molecules. Using a resistance temperature probe for in situ monitoring we demonstrate that the hotspot temperature was lowered by similar to 28 degrees C for a chip operating at 1,300 Wcm(-2). Thermal resistance probed by pulsed photothermal reflectance measurements demonstrated an improved thermal coupling due to functionalization on the graphene-graphene oxide interface. Three functionalization molecules manifest distinct interfacial thermal transport behaviour, corroborating our atomistic calculations in unveiling the role of molecular chain length and functional groups. Molecular dynamics simulations reveal that the functionalization constrains the cross-plane phonon scattering, which in turn enhances in-plane heat conduction of the bonded graphene film by recovering the long flexural phonon lifetime.
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| 37. |
- Hansson, Josef, 1991, et al.
(författare)
-
A review of recent progress of thermal interface materials: from research to industrial applications
- 2016
-
Ingår i: IMAPS Nordic Annual Conference 2016 Proceedings; Tonsberg; Norway; 5 - 7 June 2016. - 9781510827226
-
Konferensbidrag (refereegranskat)abstract
- The increasing trend of further scaling down electronic components put an increasing demand for more efficient cooling. A significant part of the thermal resistance from source to ambient occurs at the interface between materials, and thermal interface materials are crucial for efficient heat transfer. Recent years have seen a significant amount of progress various types of thermal interface materials. In this review, the field of thermal interface materials (TIMs) development is summarized and analyzed, focusing on three topics which have received attention at a research level, and their road towards market applicability. The first topic is development in particle laden polymers, which uses thermally conductive filler particles in a polymer matrix. New development is focused on novel fillers such as h-BN or carbon based fillers, and hybrid filler combinations. The next topic is continuous metal phase TIMs, which includes solder and liquid metal TIMs. The thermal performance is already very good, and development is largely focused on improving the mechanical properties. Finally, the last topic is carbon nanotube array TIMs, which used chemical vapor deposition-grown carbon nanotube arrays as bridging material. The concept has promise for great performance in both handling, mechanical stability and thermal performance, but is still at a research stage. In addition to these topics, a quantitative study on the progress of thermal interface materials development is made, both in terms of research papers published and in terms of patents filed. The study shows a stable trend of continuous development on all levels and concludes that significant improvements can be expected to continue in the future.
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| 38. |
- Hansson, Josef, 1991, et al.
(författare)
-
Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material
- 2019
-
Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - 2156-3985 .- 2156-3950. ; 9:6, s. 1045-1053
-
Tidskriftsartikel (refereegranskat)abstract
- Increased demand on the mechanical and thermal properties on the thermal interface and die attach material creates a demand for materials with tailored material properties. Solder matrix fiber composites (SMFCs) have been shown to address these challenges, but have, so far, required complicated procedures and components. In this paper, we present the fabrication of a new type of SMFC based on commercially available fiber networks infiltrated with Sn-Ag-Cu alloy (SAC305) or indium using equipment for large-volume production. The composite material exhibits similar thermal properties compared to pure solder, and mechanical properties that can be tailored toward specific applications. We also show that the handling properties of the SMFC allows it to be used in process flows where multiple reflow cycles are required and can achieve a well-defined bond line thickness (BLT) and good bonding using fluxless reflow under pressure.
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| 39. |
- Hansson, Josef, 1991, et al.
(författare)
-
Fabrication and characterization of a carbon fiber solder composite thermal interface material
- 2017
-
Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 97-100
-
Konferensbidrag (refereegranskat)abstract
- One of the significant bottlenecks in thermal management is to develop thermal interface materials (TIMs) with lower thermal interface resistance while retaining good reliability, mechanical properties and handling capabilities. Recently, the combination of electrospun polymer fibers and solder matrix has gathered interest, combining the excellent thermal properties of metal with the mechanical properties of polymers. Carbon fibers are increasingly common as reinforcement in composites, owing to their high strength and thermal conductivity. Utilizing carbon fibers in a similar composite could allow for the fabrication of TIMs with so far unexplored properties such as increased thermal conductivity, strength and tunable CTE. In this work, we have fabricated and characterized a TIM based on a carbon fiber network infiltrated by an alloy of Sn-Ag-Cu, (CF-TIM). Commercially available carbon fibers are coated with a thin layer of Ag and infiltrated by molten alloy under high pressure. The result is a preform TIM, easy to handle and compatible with standard SMT assembly. A thermal interface resistance lower than 2 Kmm2/W between two ENIG coated Cu substrates was measured with laser flash. Comparing total thermal interface resistance to bond line thickness indicates a very low contact resistance consistent with good metallurgical bonding and a bulk thermal conductivity of 24 W/mK for the TIM. X-ray inspection and SEM of cross section of the assembled structure indicates good adhesion between fiber and matrix, and a very low degree of voiding. To demonstrate the handling capabilities of CF-TIM, a variety of reflow conditions were investigated. A consistent bond line thickness (BLT) of 45±5μm was achieved independent on applied pressure during reflow, and decreased less than 20% after 10 additional reflow cycles, without additional material leakage. This demonstrates the possibility of CF-TIM use in assembly line processes requiring additional reflow steps. Solder preforms are common in industry, and due to similar handling characteristics of the CF-TIM, it should be easily integrated into existing electronics assembly lines. The usage of commercial fibers not reliant on slow and expensive processes such as electrospinning further opens up the potential for mass production.
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| 40. |
- Hansson, Josef, 1991, et al.
(författare)
-
Novel nanostructured thermal interface materials: a review
- 2018
-
Ingår i: International Materials Reviews. - : Informa UK Limited. - 0950-6608 .- 1743-2804. ; 63:1, s. 22-45
-
Forskningsöversikt (refereegranskat)abstract
- The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.
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| 41. |
- Hansson, Josef, 1991, et al.
(författare)
-
Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications
- 2016
-
Ingår i: 2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano). - 9781509014934 ; , s. 371-374
-
Konferensbidrag (refereegranskat)abstract
- Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at the interface between two materials, greatly increasing the thermal conductance when solid surface are attached together. The last decade has provided significant development on high-performing TIMs, and this paper makes a summarized review on recent progress on the topic. Current state of the art commercial TIM types are presented, and discussed in regards to their advantages and disadvantages. Two main categories of TIMs with high interest are then reviewed: continuous metal phase TIMs and carbon nanotube array TIMs.
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| 42. |
- Hansson, Josef, 1991, et al.
(författare)
-
Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications
- 2018
-
Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; 2018-May
-
Konferensbidrag (refereegranskat)abstract
- Hybrid films based on vertically aligned carbon nanotubes (CNTs) on graphene or graphite sheets have been proposed for application as thermal interface materials and micro heat sinks. However, the fabrication of these materials are limited to small scale, expensive and complicated chemical vapor deposition (CVD) for CNT synthesis. We present a new method for direct growth of CNTs on one or both sides of a thin graphene film (GF) using joule self-heating of the graphene film to provide the necessary heat for the thermal breakdown of carbon feedstock in a CVD process. The resulting CNT forests show good density and alignment consistent with regular CVD synthesis processes on silicon surfaces. The resulting double sided GF/CNT hybrid film is directly applicable as a thermal pad. The CNT forest has a thermal conductivity of 30 W/mK, measured by pulsed photothermal reflectance, and the total thermal interface resistance between aluminum blocks was measured to be 60 Kmm 2 /W using an ASTM D5470 compliant 1-D measurement setup. This method of directly synthesizing CNTs on graphene films is more energy efficient and capable of larger volume production compared to traditional CVD methods. It is also compatible with scaling up towards continuous roll-to-roll production for large scale commercial production, one of the major limitations preventing CVD-grown CNTs from commercial applications
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| 43. |
- Hill, Sandra Malmgren, 1987, et al.
(författare)
-
Asymmetric Inheritance of Aggregated Proteins and Age Reset in Yeast Are Regulated by Vac17-Dependent Vacuolar Functions
- 2016
-
Ingår i: Cell Reports. - : Elsevier BV. - 2211-1247. ; 16:3, s. 826-838
-
Tidskriftsartikel (refereegranskat)abstract
- Age can be reset during mitosis in both yeast and stem cells to generate a young daughter cell from an aged and deteriorated one. This phenomenon requires asymmetry-generating genes (AGGs) that govern the asymmetrical inheritance of aggregated proteins. Using a genome-wide imaging screen to identify AGGs in Saccharomyces cerevisiae, we discovered a previously unknown role for endocytosis, vacuole fusion, and the myosin-dependent adaptor protein Vac17 in asymmetrical inheritance of misfolded proteins. Overproduction of Vac17 increases deposition of aggregates into cytoprotective vacuole-associated sites, counteracts age-related breakdown of endocytosis and vacuole integrity, and extends replicative lifespan. The link between damage asymmetry and vesicle trafficking can be explained by a direct interaction between aggregates and vesicles. We also show that the protein disaggregase Hsp104 interacts physically with endocytic vesicle-associated proteins, such as the dynamin-like protein, Vps1, which was also shown to be required for Vac17-dependent sequestration of protein aggregates. These data demonstrate that two physiognomies of aging-reduced endocytosis and protein aggregation-are interconnected and regulated by Vac17.
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| 44. |
- Huang, S., et al.
(författare)
-
Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
- 2017
-
Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 143-146
-
Konferensbidrag (refereegranskat)abstract
- Graphene protection barrier was introduced to the interface between the ECAs and Cu-plated wire to enhance the reliability of the ECAs joints on Cu-Plated PCB substrate due to its excellent properties of impermeability to all gases/salts as well as its thermal/chemical stability. The results of shear test indicated graphene protection barrier can improve the shear strength of the ECAs joints on Cu-plated PCB substrate by almost 22% after 500 hours high temperature and high humidity cyclic test. Characterizations by optical microscope and XPS were further performed to explain the mechanism. To sum up, it can be believed that the graphene protection barrier can dramatically enhance the reliability of the ECAs joints on Cu-Plated PCB substrate.
|
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| 45. |
- Huang, Shirong, et al.
(författare)
-
Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging
- 2016
-
Ingår i: 6th Electronic System-integration Technology Conference (ESTC 2016). - 9781509014026 ; , s. Article no 7764696-
-
Konferensbidrag (refereegranskat)abstract
- Vertically-aligned multiwall carbon nanotubes were deposited on silicon substrate by low pressure chemical vapor deposition (LPCVD), which can be utilized as heat spreaders in high power electronic packaging due to their remarkable thermal conductivity. The infrared emissivity of the vertically aligned multiwall carbon nanotubes was then characterized based on the FLIR SC600 infrared imaging system. The average infrared emissivity of the multiwall carbon nanotubes sample was about 0.92, which agrees well with experimental results reported before. Scanning electron microscopy (SEM) images of the multiwall carbon nanotubes were further analyzed to explain its high emissivity, and the reason can be attributed to the homogeneous sparseness and aligned structure of the vertically aligned multiwall carbon nanotubes
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| 46. |
- Huang, Shirong, et al.
(författare)
-
Reliability of Graphene-based Films Used for High Power Electronics Packaging
- 2015
-
Ingår i: 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015. - 9781467379991 ; , s. 852-855
-
Konferensbidrag (refereegranskat)abstract
- Graphene-base film was fabricated with chemical conversion process, including graphene oxide (GO) prepared by Hummer's method, graphene oxide reduced with L-ascorbic acid (LAA), graphene based film deposited by vacuum filtration process. Meanwhile, the functionalization of the graphene-based film was performed to decrease the thermal interface resistance between the graphene-based film and substrate. Characterization data showed that the graphene-based film possessed high reliability after 500 hours under 85°C aging test. In summary, the graphene-based film can be a promising solution in thermal management of high power electronics.
|
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| 47. |
- Huang, Shirong, et al.
(författare)
-
The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
- 2016
-
Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. - 9781509013968 ; , s. Art no 7583272; Pages 889-892
-
Konferensbidrag (refereegranskat)abstract
- Graphene-based films (GBF) were fabricated using a chemical conversion process including graphene oxide (GO) preparation by use of Hummer’s method, graphene oxide reduction using L-ascorbic acid (LAA), and finally film formation by vacuum filtration. GBF is considered as a candidate material for thermal management, i.e. for removing heat from hotspots in power electronic packaging, due to its high thermal conductivity. In this work, the GBF heat spreading performance in 3D TSV packaging was analysed using finite element methods (FEM) implemented in the COMSOL software. Both size effects and the influence of the thermal conductivity of the GBF heat spreader on the thermal performance of the 3D TSV package were evaluated. Furthermore, the size effects of the thermal conductive adhesive (TCA) underfill between the chip and the printed circuit board (PCB) were analysed. The results obtained are critical for proper design of graphene-based lateral heat spreaders in high power electronic packaging.
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| 48. |
- Janeczek, K., et al.
(författare)
-
Investigation of thermal interface materials reinforced with micro- and nanoparticles
- 2017
-
Ingår i: China Semiconductor Technology International Conference 2017, CSTIC 2017. - 9781509066940
-
Konferensbidrag (refereegranskat)abstract
- Heat management is one of the major challenges in modern electronic devices. The higher performance results in a production of greater amount of heat which needs to be efficiently dissipated so as to ensure the electronic devices operational during the period of lifetime. This paper discusses the application of micro- and nano-materials in thermal interface materials (TIM) used for heat management. Effects of type, size and geometry of different fillers were experimentally investigated. The results showed that it is recommended to utilize silver particles compared to copper ones to achieve higher heat dissipation. And the particles of smaller size may enhance the thermal conductivity of elaborated materials.
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| 49. |
- Jeong, Seung Hee, et al.
(författare)
-
Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment
- 2015
-
Ingår i: Scientific Reports. - : Springer Science and Business Media LLC. - 2045-2322. ; 5
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Tidskriftsartikel (refereegranskat)abstract
- Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.
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- Jeong, Seung Hee, 1978-, et al.
(författare)
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Stretchable Thermoelectric Generators Metallized with Liquid Alloy
- 2017
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:18, s. 15791-15797
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Tidskriftsartikel (refereegranskat)abstract
- Conventional thermoelectric generators (TEGs) are normally hard, rigid, and flat. However, most objects have curvy surfaces, which require soft and even stretchable TEGs for maximizing efficiency of thermal energy harvesting. Here, soft and stretchable TEGs using conventional rigid Bi2Te3 pellets metallized with a liquid alloy is reported. The fabrication is implemented by means of a tailored layer-by-layer fabrication process. The STEGs exhibit an output power density of 40.6 ?W/cm2 at room temperature. The STEGs are operational after being mechanically stretched-and-released more than 1000 times, thanks to the compliant contact between the liquid alloy interconnects and the rigid pellets. The demonstrated interconnect scheme will provide a new route to the development of soft and stretchable energy-harvesting avenues for a variety of emerging electronic applications.
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