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Sökning: WFRF:(Vesterinen T) > (2020-2022)

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1.
  • Mannila, E. T., et al. (författare)
  • A superconductor free of quasiparticles for seconds
  • 2021
  • Ingår i: Nature Physics. - : Springer Science and Business Media LLC. - 1745-2473 .- 1745-2481.
  • Tidskriftsartikel (refereegranskat)abstract
    • Superconducting devices, based on the Cooper pairing of electrons, play an important role in existing and emergent technologies, ranging from radiation detectors1,2 to quantum computers3. Their performance is limited by spurious quasiparticle excitations formed from broken Cooper pairs4–12. Efforts to achieve ultra-low quasiparticle densities have reached time-averaged numbers of excitations on the order of one in state-of-the-art devices2,12–15. However, the dynamics of the quasiparticle population as well as the timescales for adding and removing individual excitations remain largely unexplored. Here, we experimentally demonstrate a superconductor completely free of quasiparticles for periods lasting up to seconds. We monitor the quasiparticle number on a mesoscopic superconductor in real time by measuring the charge tunnelling to a normal metal contact. Quiet, excitation-free periods are interrupted by random-in-time Cooper pair breaking events, followed by a burst of charge tunnelling within a millisecond. Our results demonstrate the possibility of operating devices without quasiparticles with potentially improved performance. In addition, our experiment probes the origins of nonequilibrium quasiparticles in our device. The decay of the Cooper pair breaking rate over several weeks following the initial cooldown rules out processes arising from cosmic or long-lived radioactive sources16–19.
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2.
  • Grigoras, K., et al. (författare)
  • Qubit-Compatible Substrates With Superconducting Through-Silicon Vias
  • 2022
  • Ingår i: IEEE Transactions on Quantum Engineering. - 2689-1808. ; 3
  • Tidskriftsartikel (refereegranskat)abstract
    • We fabricate and characterize superconducting through-silicon vias and electrodes suitable for superconducting quantum processors. We measure internal quality factors of a million for test resonators excited at single-photon levels, on chips with superconducting vias used to stitch ground planes on the front and back sides of the chips. This resonator performance is on par with the state of the art for silicon-based planar solutions, despite the presence of vias. Via stitching of ground planes is an important enabling technology for increasing the physical size of quantum processor chips, and is a first step toward more complex quantum devices with three-dimensional integration.
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