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In-situ chemical po...
In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate
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- Li, Jiujuan (författare)
- University of Electronic Science and Technology of China
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- Zhou, Guoyun (författare)
- University of Electronic Science and Technology of China
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- Hong, Yan (författare)
- University of Electronic Science and Technology of China
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- He, Wei (författare)
- University of Electronic Science and Technology of China
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- Wang, Shouxu (författare)
- University of Electronic Science and Technology of China
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- Wang, Chong (författare)
- University of Electronic Science and Technology of China
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- Chen, Yuanming (författare)
- University of Electronic Science and Technology of China
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- Zhou, Jinqun (författare)
- Shennan Circuits Co. Ltd
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- Miao, Hua (författare)
- Shennan Circuits Co. Ltd
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- Weng, Zesheng (författare)
- Ganzhou Sun&Lynn Circuits Co. LTD
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- Andersson, Martin (författare)
- Lund University,Lunds universitet,Värmeöverföring,Institutionen för energivetenskaper,Institutioner vid LTH,Lunds Tekniska Högskola,Heat Transfer,Department of Energy Sciences,Departments at LTH,Faculty of Engineering, LTH
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University of Electronic Science and Technology of China Shennan Circuits Co Ltd (creator_code:org_t)
- Elsevier BV, 2020
- 2020
- Engelska.
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Ingår i: Electrochimica Acta. - : Elsevier BV. - 0013-4686. ; 330
- Relaterad länk:
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http://dx.doi.org/10...
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https://lup.lub.lu.s...
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https://doi.org/10.1...
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Abstract
Ämnesord
Stäng
- Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtaining porous-networked PT containing homogeneously distributed Cu. the Cu-PT composite film serve as a feasible seed layer for subsequent metallization on the insulating substrate. The deposition conditions for the optimized migration rate of copper during the electroplating process of the composite film were obtained by multiple groups of single factor experiments. Notably, electroplated textile fabrics with the Cu-PT composite film demonstrate a wide stretch-resistant working range (0–50% applied strain) maintaining stable conductivity.
Ämnesord
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik -- Annan elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering -- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Nyckelord
- Composite
- Cu
- Electroplating
- Polythiophenes
- Textile fabrics
Publikations- och innehållstyp
- art (ämneskategori)
- ref (ämneskategori)
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- Av författaren/redakt...
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Li, Jiujuan
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Zhou, Guoyun
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Hong, Yan
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He, Wei
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Wang, Shouxu
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Wang, Chong
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Chen, Yuanming
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Zhou, Jinqun
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Miao, Hua
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Weng, Zesheng
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Andersson, Marti ...
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- Om ämnet
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- TEKNIK OCH TEKNOLOGIER
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TEKNIK OCH TEKNO ...
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och Elektroteknik oc ...
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och Annan elektrotek ...
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Electrochimica A ...
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Lunds universitet