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- Sourikopoulos, Ilias, et al.
(författare)
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The H2020-SPACE-SIPHODIAS project: Space-grade optoelectronic interfaces for photonic digital and analogue very-high-throughput satellite payloads
- 2021
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Ingår i: Proceedings of SPIE - The International Society for Optical Engineering. - : SPIE. - 0277-786X .- 1996-756X. ; 11852
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Konferensbidrag (refereegranskat)abstract
- The EU-SIPhoDiAS project deals with the development of critical photonic building blocks needed for high-performance and low size, weight, and power (SWaP) photonics-enabled Very High Throughput Satellites (VHTS). In this presentation, we report on the design and fabrication activities during the first year of the project concerning the targeted family of digital and microwave photonic components. This effort aims to demonstrate components of enhanced reliability at technology readiness level (TRL) 7. Specifically, with respect to microwave photonic links, we report: (i) the design of Ka and Q-bands analogue photodetectors that will be assembled in compact packages, allowing for very high bandwidth per unit area and (ii) on the design of compact V-band GaAs electro-optic modulator arrays, which use a folded-path optical configuration to manage all fiber interfaces packaged opposite direct in-line RF feeds for ease of board layouts and mass/size benefits. With respect to digital links, we report on the development of 100 Gb/s (4 x 25 Gb/s) digital optical transceiver sub-assemblies developed using flip-chip mounting of electronic and opto-parts on a high-reliability borosilicate substrate. The transceiver chipset developed specifically for this project refers to fully-custom 25 Gb/s radiation hard (RH) VCSEL driver and TIA ICs designed in IHP’s 130 nm SiGe BiCMOS Rad-Hard process.
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- Stampoulidis, Leontios, et al.
(författare)
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High-speed low-power and board-mountable optical transceivers for scalable & energy efficient advanced on-board digital processors
- 2018
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Ingår i: Proceedings of SPIE - The International Society for Optical Engineering. - : SPIE. - 0277-786X .- 1996-756X. ; 11180
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Konferensbidrag (refereegranskat)abstract
- We present the development and verification testing of a high speed multimode, multicore transceiver technology for intra-satellite optical interconnects. We report the fabrication and functional testing of opto-parts including 25 Gb/s 850 nm VCSEL/PD as well as the verification testing of the VCSELs against radiation and lifetime performance. In addition we report the development and evaluation testing of a multi-core cable assembly that was fabricated and mated with MiniAVIM multi-core connectors to develop hi-rel multi-core optical patchcords for pigtailing the transceiver modules. The fiber optic, electronic and opto-parts were used to assemble the first ever fully packaged and pigtailed, six-core optical transceiver prototype module that operates at 25 Gb/s channel bit rate at an energy consumption of ∠4.5 mW/Gb/s.
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- Stampoulidis, Leontios, et al.
(författare)
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The European project Merlin on multi-gigabit, energy-efficient, ruggedized lightwave engines for advanced on-board digital processors
- 2017
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Ingår i: Proceedings of SPIE - The International Society for Optical Engineering. - : SPIE. - 0277-786X .- 1996-756X. ; 10563
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Konferensbidrag (refereegranskat)abstract
- Modern broadband communication networks rely on satellites to complement the terrestrial telecommunication infrastructure. Satellites accommodate global reach and enable world-wide direct broadcasting by facilitating wide access to the backbone network from remote sites or areas where the installation of ground segment infrastructure is not economically viable. At the same time the new broadband applications increase the bandwidth demands in every part of the network - and satellites are no exception. Modern telecom satellites incorporate On-Board Processors (OBP) having analogue-to-digital (ADC) and digital-to-analogue converters (DAC) at their inputs/outputs and making use of digital processing to handle hundreds of signals; as the amount of information exchanged increases, so do the physical size, mass and power consumption of the interconnects required to transfer massive amounts of data through bulk electric wires.
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