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Träfflista för sökning "WFRF:(Fu Yifeng 1984) "

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41.
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42.
  • Huang, Shirong, et al. (författare)
  • Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
  • 2013
  • Ingår i: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). ; , s. 347-352
  • Konferensbidrag (refereegranskat)abstract
    • Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader for chip cooling. Platinum (Pt) serpentine functioned as hot spot on the thermal testing chip. The thermal testing chip with monolayer graphene film attached was bonded using flip-chip technology. The temperature at the hot spot with a monolayer graphene film as heat spreader was decreased by about 12°C and had a more uniform temperature compared to those without graphene heat spreader when driven by a heat flux of about 640W/cm 2 . Further improvements to the cooling performance of graphene heat spreader could be made by optimizing the synthesis parameters and transfer process of graphene films. © 2013 IEEE.
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43.
  • Huang, S., et al. (författare)
  • Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
  • 2017
  • Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. ; , s. 143-146
  • Konferensbidrag (refereegranskat)abstract
    • Graphene protection barrier was introduced to the interface between the ECAs and Cu-plated wire to enhance the reliability of the ECAs joints on Cu-Plated PCB substrate due to its excellent properties of impermeability to all gases/salts as well as its thermal/chemical stability. The results of shear test indicated graphene protection barrier can improve the shear strength of the ECAs joints on Cu-plated PCB substrate by almost 22% after 500 hours high temperature and high humidity cyclic test. Characterizations by optical microscope and XPS were further performed to explain the mechanism. To sum up, it can be believed that the graphene protection barrier can dramatically enhance the reliability of the ECAs joints on Cu-Plated PCB substrate.
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44.
  • Huang, Shirong, et al. (författare)
  • Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging
  • 2016
  • Ingår i: 6th Electronic System-integration Technology Conference (ESTC 2016). ; , s. Article no 7764696-
  • Konferensbidrag (refereegranskat)abstract
    • Vertically-aligned multiwall carbon nanotubes were deposited on silicon substrate by low pressure chemical vapor deposition (LPCVD), which can be utilized as heat spreaders in high power electronic packaging due to their remarkable thermal conductivity. The infrared emissivity of the vertically aligned multiwall carbon nanotubes was then characterized based on the FLIR SC600 infrared imaging system. The average infrared emissivity of the multiwall carbon nanotubes sample was about 0.92, which agrees well with experimental results reported before. Scanning electron microscopy (SEM) images of the multiwall carbon nanotubes were further analyzed to explain its high emissivity, and the reason can be attributed to the homogeneous sparseness and aligned structure of the vertically aligned multiwall carbon nanotubes
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45.
  • Huang, Shirong, et al. (författare)
  • Reliability of Graphene-based Films Used for High Power Electronics Packaging
  • 2015
  • Ingår i: 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015. ; , s. 852-855
  • Konferensbidrag (refereegranskat)abstract
    • Graphene-base film was fabricated with chemical conversion process, including graphene oxide (GO) prepared by Hummer's method, graphene oxide reduced with L-ascorbic acid (LAA), graphene based film deposited by vacuum filtration process. Meanwhile, the functionalization of the graphene-based film was performed to decrease the thermal interface resistance between the graphene-based film and substrate. Characterization data showed that the graphene-based film possessed high reliability after 500 hours under 85°C aging test. In summary, the graphene-based film can be a promising solution in thermal management of high power electronics.
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46.
  • Huang, Shirong, et al. (författare)
  • The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
  • 2016
  • Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. ; , s. Art no 7583272; Pages 889-892
  • Konferensbidrag (refereegranskat)abstract
    • Graphene-based films (GBF) were fabricated using a chemical conversion process including graphene oxide (GO) preparation by use of Hummer’s method, graphene oxide reduction using L-ascorbic acid (LAA), and finally film formation by vacuum filtration. GBF is considered as a candidate material for thermal management, i.e. for removing heat from hotspots in power electronic packaging, due to its high thermal conductivity. In this work, the GBF heat spreading performance in 3D TSV packaging was analysed using finite element methods (FEM) implemented in the COMSOL software. Both size effects and the influence of the thermal conductivity of the GBF heat spreader on the thermal performance of the 3D TSV package were evaluated. Furthermore, the size effects of the thermal conductive adhesive (TCA) underfill between the chip and the printed circuit board (PCB) were analysed. The results obtained are critical for proper design of graphene-based lateral heat spreaders in high power electronic packaging.
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47.
  • Jeppson, Kjell, 1947, et al. (författare)
  • Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders
  • 2016
  • Ingår i: 29th IEEE International Conference on Microelectronic Test Structures (ICMTS), Yokohama, Japan, Mar 28-31, 2016. - 1071-9032. ; , s. 32-36
  • Konferensbidrag (refereegranskat)abstract
    • The design, fabrication, and use of a hotspot-producing and temperature-sensing test structure for evaluating the thermal properties of carbon nanotubes, graphene and boron nitride for cooling of electronic devices in applications like 3D integrated chip-stacks, power amplifiers and light-emitting diodes is described. The test structure is a simple meander-shaped metal resistor serving both as the hotspot and the temperature thermo-meter. By use of this test structure, the influence of emerging materials like those mentioned above on the temperature of the hotspot has been evaluated with good accuracy).
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48.
  • Jiang, Di, 1983, et al. (författare)
  • A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
  • 2017
  • Ingår i: Flexible and Printed Electronics. - 2058-8585. ; 2:2
  • Tidskriftsartikel (refereegranskat)abstract
    • One of the critical challenges for realizing flexible electronic systems for a wide range of applications is the development of materials for flexible and stackable interconnects. We propose and demonstrate a three-dimensional (3D)interconnect structure embedded in a polymeric substrate using metal-coated carbon nanotube (CNT)scaffolds. By using two different underlayer materials for the catalyst, onestep synthesis of a dual-height CNT interconnect scaffold was realized. The CNT scaffolds serve as flexible cores for both annular metal through-substrate-vias and for horizontal metal interconnect. The 3D-CNT network was fabricated on a silicon substrate, and once the scaffolds were covered by metal, they were embedded in a polymer serving as a flexible substrate after peel-off from the silicon substrate. The 3D-CNT interconnect network was exposed to mechanical bending and stretching tests while monitoring its electrical properties. Even after 300 cycles no significant increase of resistances was found. Electrically there is a trade-off between flexibility and conductivity due to the surface roughness of the scaffold. However, this is to some extent alleviated by the metalized sidewalls giving the horizontal wires a cross-sectional area larger than indicated by their footprint. For gold wires 200 nm thick, measurements indicated a resistivity of 18 μΩ.cm, a value less than one order of magnitude larger than that of bulk gold, and a value that is expected to improve as technology improves. The mechanical properties of the metalized scaffolds were simulated using a finite element model. The potential scale-up capability of the proposed 3D-CNT network was demonstrated by the stacking of two such polymer-embedded interconnect systems.
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49.
  • Jiang, Di, 1983, et al. (författare)
  • Carbon nanotube/solder hybrid structure for interconnect applications
  • 2014
  • Ingår i: Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. ; , s. Art. no. 6962751-
  • Konferensbidrag (refereegranskat)abstract
    • A carbon nanotube (CNT)/Solder hybrid bump structure is proposed in this work in order to overcome the drawbacks of high CNT resistivity while retaining the advantages of CNTs in terms of interconnect reliability. Lithographically defined hollow CNT moulds are grown by thermal chemical vapor deposition (TCVD). The space inside the CNT moulds is filled up with Sn-Au-Cu (SAC) solder spheres of around 10 μm in diameter. This CNT/Solder hybrid material is then reflowed and transferred onto target indium coated substrate. The reflow melts the small solder spheres into large single solder balls thus forming a hybrid interconnect bump together with the surrounding densified CNT walls, which the CNT and the solder serve as resistors in parallel. The electrical resistance of such a CNT/Solder structure is measured to be around 6 folds lower than pure CNT bumps.
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50.
  • Jiang, Di, 1983, et al. (författare)
  • Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors
  • 2016
  • Ingår i: Small. - 1613-6810 .- 1613-6829. ; 12:11, s. 1521-1526
  • Tidskriftsartikel (refereegranskat)abstract
    • In this paper, an embedded fin-like metal-coated carbon nanotube (Fin-M/CNT) structure is demonstrated for flexible and transparent conductor wire applications. Embedded in a polydimethylsiloxane polymeric substrate, Fin-M/CNT wires with a minimum width of 5 μm and a minimum pitch of 10 μm have been achieved. Direct current resistances of single Fin-M/CNT wires, where the supporting CNT structures have been covered by Ti/Al/Au metal coatings of different thicknesses, have been measured. The high aspect ratio of the fin-like structures not only improves the adhesion between the wires and the polymeric substrate, but also yields a low resistance at a small surface footprint. In addition, transparent Fin-M/CNT grid lines with hexagonal patterns, with a sheet resistance of as low as 45 Ω sq−1, have been achieved at an optical transmittance of 88%. The robustness of the Fin-M/CNT structures has been demonstrated in bending tests up to 500 cycles and no significant changes in wire resistances are observed.
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