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Träfflista för sökning "WFRF:(Liu Johan 1960) "

Sökning: WFRF:(Liu Johan 1960)

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11.
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12.
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13.
  • Chen, Shujing, et al. (författare)
  • Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
  • 2019
  • Ingår i: ChemistryOpen. - 2191-1363. ; 8:1, s. 58-63
  • Tidskriftsartikel (refereegranskat)abstract
    • Functional fillers, such as Ag, are commonly employed for effectively improving the thermal or electrical conductivity in polymer composites. However, a disadvantage of such a strategy is that the cost and performance cannot be balanced simultaneously. Therefore, the drive to find a material with both a cost efficient fabrication process and excellent performance attracts intense research interest. In this work, inspired by the core-shell structure, we developed a facile manufacturing method to prepare graphene-encapsulated Cu nanoparticles (GCPs) through utilizing an improved chemical vapor deposition (CVD) system with a cold wall reactor. The obtained GCPs could retain their spherical shape and exhibited an outstanding thermal stability up to 179 degrees C. Owing to the superior thermal conductivity of graphene and excellent oxidation resistance of GCPs, the produced GCPs are practically used in a thermally conductive adhesive (TCA), which commonly consists of Ag as the functional filler. Measurement shows a substantial 74.6 % improvement by partial replacement of Ag with GCPs.
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14.
  • Cometto, O., et al. (författare)
  • Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics
  • 2017
  • Ingår i: ACS Applied Materials & Interfaces. - 1944-8252 .- 1944-8244. ; 9:8, s. 7456-7464
  • Tidskriftsartikel (refereegranskat)abstract
    • High anisotropic thermal materials, which allow heat to dissipate in a preferential direction, are of interest as a prospective material for electronics as an effective thermal management solution for hot spots. However, due to their preferential heat propagation in the in-plane direction, the heat spreads laterally instead of vertically. This limitation makes these materials ineffective as the density of hot spots increases. Here, we produce a new dielectric thin film material at room temperature, named vertically ordered nanocrystalline h-BN (voBN). It is produced such that its preferential thermally conductive direction is aligned in the vertical axis, which facilitates direct thermal extraction, thereby addressing the increasing challenge of thermal crosstalk. The uniqueness of voBN comes from its h-BN nanocrystals where all their basal planes are aligned in the direction normal to the substrate plane. Using the 3 omega method, we show that voBN exhibits high anisotropic thermal conductivity (TC) with a 16-fold difference between through-film TC and in-plane TC (respectively 4.26 and 0.26 W.m(-1).K-1). Molecular dynamics simulations also concurred with the experimental data, showing that the origin of this anisotropic behavior is due to the nature of voBN's plane ordering. While the consistent vertical ordering provides an uninterrupted and preferred propagation path for phonons in the through-film direction, discontinuity in the lateral direction leads to a reduced in-plane TC. In addition, we also use COMSOL to simulate how the dielectric and thermal properties of voBN enable an increase in hot spot density up to 295% compared with SiO2, without any temperature increase.
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15.
  • Du, Wenhui, et al. (författare)
  • New fast curing isotropic conductive adhesive for electronic packaging application
  • 2010
  • Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. ; :Article number 5582446, s. 199-201
  • Konferensbidrag (refereegranskat)abstract
    • With the rapid development of technologies on high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute of solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, the curing time of most traditional ICA is more than half an hour. The process duration of ICA is 2 or 3 times longer than that of solder. Thus, low efficiencies of energy using and product manufacturing has been one of factors which limits widely application of ICA. Generally, the curing speed of ICA depends on types and amount of curing agent as well as curing temperature. In our previous experiments, the effects of curing temperature and amount of curing agent have been investigated. So, the present work attempts to choose a new kind of curing agent to shorten process duration of ICA. By using new curing agent, the curing duration of ICA could be shortened in 5 minutes with a high curing rate compared with the previous version. In addition, the basic performance including bulk resistivity and viscosity are also investigated in this work. Finally, we present some discussions about the further optimization of performance, for example regarding the ways of achieving better electrical conductivity with lower filler content and improvement of viscosity etc. © 2010 IEEE.
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16.
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17.
  • Fu, Yifeng, 1984, et al. (författare)
  • Graphene related materials for thermal management
  • 2020
  • Ingår i: 2D Materials. - : IOP PUBLISHING LTD. - 2053-1583. ; 7:1
  • Tidskriftsartikel (refereegranskat)abstract
    • Almost 15 years have gone ever since the discovery of graphene as a single atom layer. Numerous papers have been published to demonstrate its high electron mobility, excellent thermal and mechanical as well as optical properties. We have recently seen more and more applications towards using graphene in commercial products. This paper is an attempt to review and summarize the current status of the research of the thermal properties of graphene and other 2D based materials including the manufacturing and characterization techniques and their applications, especially in electronics and power modules. It is obvious from the review that graphene has penetrated the market and gets more and more applications in commercial electronics thermal management context. In the paper, we also made a critical analysis of how mature the manufacturing processes are; what are the accuracies and challenges with the various characterization techniques and what are the remaining questions and issues left before we see further more applications in this exciting and fascinating field.
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18.
  • Fu, Yifeng, 1984, et al. (författare)
  • Selective growth of double-walled carbon nanotubes on gold films
  • 2012
  • Ingår i: Materials Letters. - 0167-577X. ; 72, s. 78-80
  • Tidskriftsartikel (refereegranskat)abstract
    • Growth of high-quality vertical aligned carbon nanotube (CNT) structures on silicon supported gold (Au) films by thermal chemical vapor deposition (TCVD) is presented. Transmission electron microscopy (TEM) images show that the growth is highly selective. Statistical study reveals that 79.4% of the as-grown CNTs are double-walled. The CNTs synthesized on Au films are more porous than that synthesized on silicon substrates under the same conditions. Raman spectroscopy and electrical characterization performed on the as-grown double-walled CNTs (DWNTs) indicate that they are competitive with those CNTs grown on silicon substrates. Field emission tests show that closed-ended DWNTs have lower threshold field than those open-ended.
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19.
  • Fu, Yifeng, 1984, et al. (författare)
  • Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene
  • 2012
  • Ingår i: Advanced Materials. - 0935-9648 .- 1521-4095. ; 24:12, s. 1576-1581
  • Tidskriftsartikel (refereegranskat)abstract
    • A template-assisted method that enables the growth of covalently bonded three-dimensional carbon nanotubes (CNTs) originating from graphene at a large scale is demonstrated. Atomic force microscopy-based mechanical tests show that the covalently bonded CNT structure can effectively distribute external loading throughout the network to improve the mechanical strength of the material.
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20.
  • Jing, Lin, et al. (författare)
  • Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays
  • 2017
  • Ingår i: ACS Applied Materials & Interfaces. - 1944-8252 .- 1944-8244. ; 9:17, s. 14555-14560
  • Tidskriftsartikel (refereegranskat)abstract
    • We demonstrate the thermal conductivity enhancement of the vertically aligned carbon nanotube (CNT) arrays (from ?15.5 to 29.5 W/mK, ?90% increase) by encapsulating outer boron nitride nanotube (BNNT, 0.97 nm-thick with ?3-4 walls). The heat transfer enhancement mechanism of the coaxial C@BNNT was further revealed by molecular dynamics simulations. Because of their highly coherent lattice structures, the outer BNNT serves as additional heat conducting path without impairing the thermal conductance of inner CNT. This work provides deep insights into tailoring the heat transfer of arbitrary CNT arrays and will enable their broader applications as thermal interface material.
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Författare/redaktör
Liu, Johan, 1960 (521)
Fu, Yifeng, 1984 (89)
Ye, L. (69)
Wang, Teng, 1983 (46)
Andersson, Cristina, ... (44)
Ye, Lilei (43)
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Cheng, Zhaonian, 194 ... (37)
Lai, Zonghe, 1948 (34)
Jeppson, Kjell, 1947 (31)
Zhang, Yan, 1976 (31)
Zandén, Carl, 1984 (30)
Wang, Nan, 1988 (29)
Lu, Xiuzhen (28)
Zhang, Yong, 1982 (27)
Carlberg, Björn, 198 ... (27)
Zhang, Yan (26)
Sun, Shuangxi, 1986 (25)
Jiang, Di, 1983 (25)
Chen, Si, 1981 (24)
Edwards, Michael, 19 ... (23)
Zhang, Y. (19)
Mu, Wei, 1985 (19)
Ye, Lilei, 1970 (18)
Luo, Xin, 1983 (17)
Wang, Nan (16)
Kabiri Samani, Majid ... (16)
Zehri, Abdelhafid, 1 ... (16)
Chen, S. (15)
Hu, Zhili, 1983 (15)
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Huang, S. (14)
Larsson, Ragnar, 196 ... (14)
Hansson, Josef, 1991 (14)
Huang, Shirong (13)
Wang, Xitao (12)
Sun, Peng, 1979 (12)
Shangguan, Dongkai (12)
Bao, Jie (12)
Liu, Ya, 1991 (12)
Yuan, G. (11)
Gao, Yulai (10)
Zhai, Qijie (10)
Andrae, Anders, 1973 (10)
Lu, X. (9)
Cao, Liqiang, 1974 (9)
Tegehall, Per-Erik (8)
Fu, Ying (8)
Shan, B. (8)
Cui, H (8)
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