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Träfflista för sökning "WFRF:(Liu Johan 1960) srt2:(2005-2009)"

Sökning: WFRF:(Liu Johan 1960) > (2005-2009)

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151.
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156.
  • Zou, C.-D., et al. (författare)
  • Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles
  • 2009
  • Ingår i: Soldering and Surface Mount Technology. - 0954-0911. ; 21:2, s. 9-13
  • Tidskriftsartikel (refereegranskat)abstract
    • Purpose - The purpose of this paper is to study the melting temperature of the nanoparticles of the new developed Sn-0.4Co-0.7Cu (wt%) lead-free solder alloy.Design/methodology/approach - Nanoparticles of Sn-0.4Co-0.7Cu lead-free solder alloy were prepared by the self-developed consumable-electrode direct current arc technique, where ultrasonic vibration was applied during the manufacturing of the particles. X-ray diffraction and field emission scanning electron microscope were employed to analyze the crystal structure and morphology of the nanopartiles, respectively. Differential scanning calorimetry was used to investigate the melting temperature of both the bulk alloy and as-prepared nanoparticles.Findings - The melting temperature of the nanoparticles was approximately 5 degrees C lower compared to that of the bulk alloy.Originality/value - As a novel developed lead-free solder alloy, the Sn-0.4Co0.7Cu (wt%) alloy provides a cost advantage compared to the extensively used Sn-Ag-Cu system. Some limitations still exist, however, mainly due to its relatively higher melting temperature compared to that of eutectic Sn-37Pb solder. In view of this situation, the attempt to lower its melting temperature has recently attracted more attention based on the knowledge that the melting temperature for pure metals is reduced when the particle size is decreased down to a few tens of nanometers.
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159.
  • Zou, Xiangdong, et al. (författare)
  • Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
  • 2009
  • Ingår i: Journal of Electronic Materials. - 0361-5235. ; 38:2, s. 351-355
  • Tidskriftsartikel (refereegranskat)abstract
    • Due to the toxicity of lead (Pb), Pb-containing solder alloys are being phased out from the electronics industry. This has lead to the development and implementation of lead-free solders. Being an environmentally compatible material, the lead-free Sn-3.0Ag-0.5Cu (wt.%) solder alloy is considered to be one of the most promising alternatives to replace the traditionally used Sn-Pb solders. This alloy composition possesses, however, some weaknesses, mainly as a result of its higher melting temperature compared with the Sn-Pb solders. A possible way to decrease the melting temperature of a solder alloy is to decrease the alloy particle size down to the nanometer range. The melting temperature of Sn-3.0Ag-0.5Cu lead-free solder alloy, both as bulk and nanoparticles, was investigated. The nanoparticles were manufactured using the self-developed consumable-electrode direct current arc (CDCA) technique. The melting temperature of the nanoparticles, with an average size of 30 nm, was found to be 213.9°C, which is approximately 10°C lower than that of the bulk alloy. The developed CDCA technique is therefore a promising method to manufacture nanometer-sized solder alloy particles with lower melting temperature compared with the bulk alloy.
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