| 61. |
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| 62. |
- Adolfsson, J., et al.
(författare)
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SAMPA Chip : The New 32 Channels ASIC for the ALICE TPC and MCH Upgrades
- 2017
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Ingår i: Journal of Instrumentation. - 1748-0221. ; 12:4
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Tidskriftsartikel (refereegranskat)abstract
- This paper presents the test results of the second prototype of SAMPA, the ASIC designed for the upgrade of read-out front end electronics of the ALICE Time Projection Chamber (TPC) and Muon Chamber (MCH). SAMPA is made in a 130 nm CMOS technology with 1.25 V nominal voltage supply and provides 32 channels, with selectable input polarity, and three possible combinations of shaping time and sensitivity. Each channel consists of a Charge Sensitive Amplifier, a semi-Gaussian shaper and a 10-bit ADC; a Digital Signal Processor provides digital filtering and compression capability. In the second prototype run both full chip and single test blocks were fabricated, allowing block characterization and full system behaviour studies. Experimental results are here presented showing agreement with requirements for both the blocks and the full chip.
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| 63. |
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| 64. |
- Berggren de Verdier, P. J., et al.
(författare)
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Prognostic significance of homozygous deletions and multiple duplications at the CDKN2A (p16INK4a)/ARF (p14ARF) locus in urinary bladder cancer
- 2006
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Ingår i: Scand J Urol Nephrol. - : Informa UK Limited. - 0036-5599 .- 1651-2065. ; 40:5, s. 363-9
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Tidskriftsartikel (refereegranskat)abstract
- OBJECTIVE: The 9p21 locus is a major target in the pathogenesis of human urinary bladder cancer. This locus harbours the CDKN2A/ARF tumour suppressor gene, which encodes two cell-cycle regulatory proteins: p16INK4a and p14ARF. We studied how homozygous deletions and multiple duplications at this locus affect prognosis and survival in patients with bladder cancer. MATERIAL AND METHODS: Real-time quantitative polymerase chain reaction (QPCR), based on simultaneous amplification of ARF and a reference gene, glyceraldehyde-3-phosphate dehydrogenase, was used to measure homozygous deletions and multiple duplications in a population-based material consisting of 478 patients with urinary bladder cancer. Results from real-time QPCR were compared with clinico-pathological parameters and survival curves were generated using the Kaplan-Meier method. RESULTS: Real-time QPCR analysis showed 71 (15%) homozygous deletions and 8 (2%) multiple duplications. We were unable to find any association between either stage or grade and urinary neoplasms with homozygous deletions. However, although there were only a limited number of patients with multiple duplications, 7/8 of them had highly malignant tumours (G2b-G4 or > or = T1; p = 0.02). CONCLUSIONS: Urinary bladder cancers constitute a spectrum of neoplasms with varying clinical manifestations. We were unable to establish a prognostic relevance for patients with tumours harbouring homozygous deletions at the CDKN2A/ARF locus. However, our data did indicate that patients with multiple duplications at the CDKN2A/ARF locus had poor survival. This suggests that multiple duplications, in combination with other genetic changes, have cooperative effects which have a negative outcome on urinary bladder cancer prognosis.
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| 65. |
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| 66. |
- Berggren, P, et al.
(författare)
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p53 mutations in urinary bladder cancer
- 2001
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Ingår i: British journal of cancer. - : Springer Science and Business Media LLC. - 0007-0920 .- 1532-1827. ; 84:11, s. 1505-1511
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Tidskriftsartikel (refereegranskat)
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| 67. |
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| 68. |
- Brinkfeldt, Klas, et al.
(författare)
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Simulations of a high temperature pressure sensor packaging and interconnection
- 2012
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Ingår i: EuroSimE 2012. - 9781467315128
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Konferensbidrag (refereegranskat)abstract
- Modeling and thermal cycling of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed by sintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961°C). It has shown operational in temperature cycling above 600°C for more than 1800 hours. Modeling of the package show that the stress in the electrical interconnections are close to the yield stress of silver at 20°C. The stress free temperature in the modeling was set to 850°C. Temperature induced stress and strains in the packaging and a fatigue simulation are performed. The package is generic and can be converted to fit most geometries and high temperature applications. © 2012 IEEE.
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| 69. |
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| 70. |
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