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Sökning: WFRF:(Liu Johan 1960)

  • Resultat 461-470 av 551
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461.
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462.
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463.
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464.
  • Yin, Hang, et al. (författare)
  • Analysis of heat dissipation characteristics of three-dimensional graphene-carbon nanotube composite structures
  • 2020
  • Ingår i: 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781728168265
  • Konferensbidrag (refereegranskat)abstract
    • With the rapid development of electronic materials and technologies, the working frequencies of electronic components and devices have been greatly improved and the volume of electronic products has been shrinking. The integration density has increased significantly, which puts forward higher requirements for thermal management. One of the keys to the heat dissipation of electronic components is to transfer the heat rapidly to the radiator through the heat conducting medium. Therefore, the development of high conductive materials has become a research hotspot of high-density integrated devices and systems. Due to their excellent heat transfer properties, carbon nanomaterials such as carbon nanotube and graphene have attracted extensive attention. The thermal conductivities of carbon nanotube and graphene have obvious anisotropy, which limited their applications to some extent. In this paper, three-dimensional composite structures composed of graphene sheets and carbon nanotubes are considered. The heat transfer processes are simulated by molecular dynamics method and the heat transfer characteristics of van der Waals interaction and chemical bond structures are analyzed. The effects of heat flow and nanotube layout on the thermal properties of three-dimensional composite structures are discussed.
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465.
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466.
  • Yu, Chen, et al. (författare)
  • Thermal Properties of Laser Reduced Graphene Oxide Films
  • 2021
  • Ingår i: 2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021.
  • Konferensbidrag (refereegranskat)abstract
    • In recent years, laser-reduced graphene oxide (LRGO) has received widespread interest, however, the thermal properties of graphene films obtained by laser reduction of GO are rarely reported. In this paper, a pulsed laser was used to reduce the prepared GO films. The obtained LRGO films were characterized by scanning electron microscopy (SEM), Raman spectroscopy, X-ray photoelectron spectroscopy (XPS). The thermal diffusivity of the LRGO was measured as 7.3 mm2/s, higher than that of GO measured as 5.9 mm2/s. The heating performance of LRGO was performed under different DC voltages and the results show that the temperature can reach up to 91 ℃ with a response time of 14 s under the voltage of 18 V. The excellent electrothermal performance of LRGO films indicate that the LRGO films are promising as heating elements for various application such as defoggers.
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467.
  • Yuan, G., et al. (författare)
  • A brief overview of atomic layer deposition and etching in the semiconductor processing
  • 2016
  • Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. - 9781509013968 ; , s. 1365-1368
  • Konferensbidrag (refereegranskat)abstract
    • Atomic layer deposition (ALD) and atomic layer etching (ALE) are two important techniques in the semiconductor processing, which focus ultra-Thin film deposition and etching, respectively. Both of them have the self-limiting surface behavior, and could realize the atomic-scale fidelity in the deposition and etching processes. Unlike traditional chemical vapor deposition (CVD) and physical vapor deposition (PVD), ALD has good step coverage, atomic-scale thickness controllability, and composition uniformity at low growth temperature. Compared with traditional continuous-wave plasma etching, ALE has smooth surface, excellent depth uniformity and atomic-scale thickness controllability. In this review, their fundamental and applications have been discussed.
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468.
  • Yuan, G., et al. (författare)
  • Critical atomic-level processing technologies: Remote plasma-enhanced atomic layer deposition and atomic layer etching
  • 2018
  • Ingår i: Micro and Nanosystems. - : Bentham Science Publishers Ltd.. - 1876-4037 .- 1876-4029. ; 10:2, s. 76-83
  • Forskningsöversikt (refereegranskat)abstract
    • As feature sizes of devices shrink every year, deposition and etching processes change to be very challenge, especially for sub-7 nm technology node. The acceptable variability of feature size is expected to be several atoms of silicon/germanium in the future. Therefore, Remote Plasma-Enhanced Atomic Layer Deposition (RPE-ALD) and Atomic Layer Etching (ALE) change to be more and more important in the semiconductor fabrication. Due to their self-limiting behavior, the atomic-scale fidelity could be realized for both of them in the processes. Compared with traditional Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) methods, atomic-scale thickness controllability and good conformality can be achieved by RPE-ALD. Unlike conventional plasma etching, atomicscale precision and excellent depth uniformity can be achieved by ALE. The fundamentals and applications of RPE-ALD and ALE have been discussed in this paper. Using the combination of them, atomic-level deposition/etch-back method is also mentioned for achieving high quality ultra-thin films on three dimensional (3D) features.
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469.
  • Yuan, G., et al. (författare)
  • Graphene-based heat spreading materials for electronics packaging applications
  • 2017
  • Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 172-174
  • Konferensbidrag (refereegranskat)abstract
    • Graphene-based heat spreading materials, including graphene-based film (GBF) and graphene-based electrically conductive adhesive (G-CA), were applied to electronics packaging. The thermal performances of GBF and G-CA were analyzed by resistance temperature detector (RTD) and thermal infrared imager. When the chip was covered by GBF and G-CA, the temperature of hotspot could be reduced by 3.1°C, at heat flux of 580 W/cm2. To analyze the thermal performances of G-CA and GBF in 3D electronics packaging, the distribution of temperature and temperature profiles on the top surface of chip were analyzed by COMSOL. Both of GBF and G-CA could obviously reduce the temperature of hotspot on the top surface of chip, compared with that on the bare chip. With G-CA and GBF, the temperature of hotspot could be reduced by 8°C. It suggests that both of G-CA and GBF are good heat spreading materials for electronics packaging application.
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470.
  • Yuan, G., et al. (författare)
  • Thermal interface materials based on vertically aligned carbon nanotube arrays: A review
  • 2019
  • Ingår i: Micro and Nanosystems. - : Bentham Science Publishers Ltd.. - 1876-4037 .- 1876-4029. ; 11:1, s. 3-10
  • Forskningsöversikt (refereegranskat)abstract
    • As the feature size of integrated circuit devices is shrinking to sub-7 nm node, the chip power dissipation significantly increases and mainly converted to the heat. Vertically Aligned Carbon Nanotube arrays (VACNTs) have a large number of outstanding properties, such as high axial thermal conductivity, low expansion coefficient, light-weight, anti-aging, and anti-oxidation. With a dramatic increment of chip temperature, VACNTs and their composites will be the promising materials as Thermal Interface Materials (TIMs), especially due to their high thermal conductivity. In this review, the synthesis, transfer and potential applications of VACNTs have been mentioned. Thermal Chemical Vapor Deposition (TCVD) has been selected for the synthesis of millimeter-scale VACNTs. After that, they are generally transferred to the target substrate for the application of TIMs in the electronics industry, using the solder transfer method. Besides, the preparation and potential applications of VACNTs-based composites are also summarized. The gaps of VACNTs are filled by the metals or polymers to replace the low thermal conductivity in the air and make them free-standing composites films. Compared with VACNTs- metal composites, VACNTs-polymer composites will be more suitable for the next generation TIMs, due to their lightweight, low density and good mechanical properties.
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  • Resultat 461-470 av 551
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Liu, Johan, 1960 (543)
Fu, Yifeng, 1984 (95)
Ye, L (69)
Wang, Teng, 1983 (46)
Andersson, Cristina, ... (44)
Ye, Lilei (41)
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Cheng, Zhaonian, 194 ... (37)
Zhang, Yong, 1982 (37)
Lai, Zonghe, 1948 (34)
Lu, Xiuzhen (34)
Jeppson, Kjell, 1947 (32)
Zhang, Yan, 1976 (30)
Zhang, Yan (29)
Wang, Nan, 1988 (29)
Zandén, Carl, 1984 (29)
Carlberg, Björn, 198 ... (27)
Chen, Si, 1981 (26)
Sun, Shuangxi, 1986 (25)
Jiang, Di, 1983 (25)
Edwards, Michael, 19 ... (23)
Zhang, Y. (22)
Zehri, Abdelhafid, 1 ... (19)
Mu, Wei, 1985 (19)
Ye, Lilei, 1970 (18)
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Luo, Xin, 1983 (16)
Hu, Zhili, 1983 (16)
Chen, S. (15)
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Sun, Peng, 1979 (13)
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Yuan, G. (11)
Liu, Ya, 1991 (11)
Gao, Yulai (10)
Zhai, Qijie (10)
Andrae, Anders, 1973 (10)
Inoue, Masahiro (10)
Lu, X. (9)
Cao, Liqiang, 1974 (9)
Cui, H (9)
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