| 521. |
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| 522. |
- Zhang, Yan, et al.
(författare)
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MDS Investigation on the Heat Transfer Properties of CNT Micro-Channel Cooler
- 2010
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Ingår i: IEEE CPMT Electronics System Integration Conference (ESTC). - 9781424485536
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- With the continuously increasing packaging density, the corresponding techniques for heat dissipation are vital to high performance components. During the system operation, the heat generated by components must be efficiently transferred outside of the electronic package. To meet the heat removal requirement of the electronic devices with a high power, several liquid cooling schemes have been suggested, among which the micro-channel cooler have gained the most attention. Simultaneously, the carbon nanotube (CNT) has attracted a significant interest in the material properties and exploratory application. Some studies have been recently conducted to evaluate the thermal performance of the CNTs and their applicability for heat removal in integrated circuit (IC) devices. By utilizing the adhesive transfer process to form the CNT bundles as the fins during the micro-channel development, the devices can be immune from the high temperature required by the CNT growth process. In the present paper, the interface heat transfer in the CNT-based micro-channel cooler has been investigated. The thermal resistances introduced by the interface between the CNT and the epoxy due to adhesive transfer and the interface between the CNT and water have been simulated by molecular dynamics simulation (MDS) method. And the thermal resistance at the interface between the CNT and the epoxy is about 1.0-1.5 × 10 -8 Km 2 /W. The obtained MDS results are likely to provide the microscopic understanding of the thermal performance of the CNT micro-channel cooler as well as provide references to the macroscopic evaluation of the thermal efficiency for the micro-channel cooler design and optimization.
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| 523. |
- Zhang, Yan, et al.
(författare)
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MDS Investigation on the Melting and Solidification of Silver Nanoparticles
- 2018
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Ingår i: 2018 19th International Conference on Electronic Packaging Technology (ICEPT). - 9781538663868 - 9781538663868 ; , s. 5-9
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Konferensbidrag (refereegranskat)abstract
- Nano-silver pastes have been widely used in electronic packaging because of its outstanding characteristics in the electrical, thermal and mechanical aspects. The sintering process of silver nanoparticles has a great impact on the material features, performances and reliabilities. In the present paper, molecular dynamics (MD) simulations have been carried out, and the melting and solidification process of silver nanoparticles are studied. The phase transformation processes of nanoparticles were analyzed, and various temperature ranges has been considered. The relationship between the temperature and the system energy reflects the melting process, and the atom distributions at characteristic temperature points were observed. The structural development during the sintering of nanoparticles was studied, and there appears the coexistence of different structures in the crystallization.
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| 524. |
- Zhang, Y., et al.
(författare)
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MDS study on tensile properties of defective graphene sheet
- 2021
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Ingår i: 2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021.
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Konferensbidrag (refereegranskat)abstract
- Low-dimensional materials such as graphene exhibit superior electrical, mechanical and thermal properties. However, structural defects occur during the growth or treatment process of carbon nanomaterial and greatly affect the material properties. In this paper, molecular dynamics simulation methods are used to study the effects of atomic defects in graphene sheets on the tensile strength, and the vacancy type and defect orientation are considered in the cases of graphene sheets under various mechanical loadings. The simulation results show that for the graphene sheets with structural defects, the fracture starts near the original vacancy position. The tensile strength of the graphene sheets with X1-type vacancy defects under zigzag direction is reduced by about 26.9% compared with that of the defect-free graphene sheet, while the graphene sheet with X2-type vacancy defects shows the least decrease in magnitude, which is 9.5% lower than that of the perfect graphene sheet. When stretched in the armchair direction, the tensile strength of the graphene sheet with H2 vacancy defects was greatly reduced by 27.1%, and the X1 vacancy defects shows the least influence, where tensile strength of the graphene sheets was reduced by 11.2%.
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| 525. |
- Zhang, Y., et al.
(författare)
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Molecular dynamics simulation for the bonding energy of metal-SWNT interface
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 506-509
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Konferensbidrag (refereegranskat)abstract
- For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.
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| 526. |
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| 527. |
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| 528. |
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| 529. |
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| 530. |
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