| 111. |
- Morris, James E., et al.
(författare)
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Electrically Conductive Adhesives
- 2007
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Ingår i: Micro- and Opto-Electronic Materials and Structures – Physics, Mechanics, Design, Reliability, Packaging, Volume II: Physics Design – Reliability and Packaging. - 0387279741 ; , s. 527-570
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Bokkapitel (övrigt vetenskapligt/konstnärligt)
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| 112. |
- Nabiollahi, Nabi, 1983, et al.
(författare)
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FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
- 2009
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Ingår i: 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009. - 9789810836948 ; , s. 422-425
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Konferensbidrag (refereegranskat)abstract
- A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.
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| 113. |
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| 114. |
- Raugi, Fabien, et al.
(författare)
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Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly
- 2006
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Ingår i: 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 1424405521 ; 2, s. 828-833
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Konferensbidrag (refereegranskat)abstract
- Anisotropic conductive adhesives have emerged as an important joining technology in a number of significant application areas, such as fine pitched driver IC for flat panel display assembly and smart cards. In the past research work in this field, it has been shown that the pressure distribution and adhesive compression flow predicted using the Newtonian and non-Newtonian FV models both agree closely with those from the previously developed analytical model. This gives confidence in the FV modelling approach and therefore the results predicted more complex situations which the analytical model cannot address. These results further confirm that a more sophisticated modelling approach is required in order to allow a full understanding about the effects of the assembly process on its final properties when the adhesive flows. An analytical model has been proposed in this paper which takes into account more complex bump geometry and can be used to predict the velocity and pressure drop distribution through the entire chip during the COG bonding process. The analytical solution is followed by the finite element modelling, which agrees well with the analytically predicted solution.
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| 115. |
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| 116. |
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| 117. |
- Sun, Peng, 1979, et al.
(författare)
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High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization
- 2006
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Ingår i: Journal of Alloys and Compounds. - : Elsevier BV. - 0925-8388. ; 425:1-2, s. 191-199
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Tidskriftsartikel (refereegranskat)abstract
- The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on Au/electroless Ni(P) metallization exhibited different interfacial morphologies after high temperature storage (HTS) at 150 °C. Ni 3 Sn 4 intermetallic compounds (IMCs) were found in the Sn-Ag system, while for the Sn-Ag-Cu system the IMCs consisted of two kinds of interfacial reactions. For the Sn-3.5Ag solder, the Ni 3 Sn 4 IMC particles lost adhesion/contact to the electroless Ni(P) layer and clear gap was observed in the samples after high temperature storage (HTS) aging for 1000 h. In the Sn-4.0Ag-0.5Cu solder joint, both (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 compounds were observed after HTS aging. Since the difference in nucleation site and growth rate for kinds of IMCs, (Cu,Ni) 6 Sn 5 was observed at top and (Ni,Cu) 3 Sn 4 at bottom when the interfacial compound layer became thicker as a function of thermal aging. Some voids were found between the electroless Ni(P) interface and the Sn-Ag solder after 168 and 500 h of thermal aging, while the clear gap between the solder and the Ni layer existed after 1000 h aging. The formation mechanism for this gap could be the interconnection and growth of the voids. In the Sn-Ag-Cu system, voids were found inside the Sn-Ni-Cu ternary interfacial compounds after 500 and 1000 h. The formation mechanism for these voids was thought to be Kirkendall effect or etching process. The interfacial layer of Sn-Ag-Cu solder on electroless Ni(P) coating showed the better thermal stable than eutectic Sn-Ag solder. © 2006 Elsevier B.V. All rights reserved.
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| 118. |
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| 119. |
- Sun, Peng, 1979, et al.
(författare)
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Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
- 2006
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Ingår i: Materials Science & Engineering B: Solid-State Materials for Advanced Technology. - : Elsevier BV. - 0921-5107. ; 135:2, s. 134-140
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Tidskriftsartikel (refereegranskat)abstract
- The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260 °C for 2 min. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn 2 and finer Cu 6 Sn 5 particles, while only one ternary (Cu, Ni) 6 Sn 5 interfacial compound was detected between the solder alloy and the electroless nickel and immersion gold (ENIG) coated substrate. The same trend was also observed for the Sn-Ag-Cu and Sn-Cu solder joints. Compared with the CoSn 2 particles found in the Sn-Co-Cu solder and the Ag 3 Sn particles found in the Sn-Ag-Cu solder, the Cu 6 Sn 5 particles found in both solder systems exhibited finer structure and more uniform distribution. It was noted that the thickness of the interfacial IMCs for the Sn-Co-Cu, Sn-Ag-Cu and Sn-Cu alloys was 3.5 μm, 4.3 μm and 4.1 μm, respectively, as a result of longer reflow time above the alloy's melting temperature since the Sn-Ag-Cu solder alloy has the lowest melting point. © 2006 Elsevier B.V. All rights reserved.
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| 120. |
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