| 51. |
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| 52. |
- Jeppson, Kjell, 1947, et al.
(författare)
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Through-Silicon Vias Filled With Densified and Transferred Carbon Nanotube Forests
- 2012
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Ingår i: IEEE Electron Device Letters. - 0741-3106 .- 1558-0563. ; 33:3, s. 420-422
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Tidskriftsartikel (refereegranskat)abstract
- Through-silicon vias (TSVs) filled with densified and transferred carbon nanotube (CNT) forests are experimentally demonstrated. The filling is achieved by a postgrowth low-temperature transfer process at 200oC instead of direct CNT growth in the vias normally requiring high temperature. A vapor densification method is also applied to densify the as-grown CNT forests, which allows for packing more CNTs in the vias to reduce their resistances. CNT-filled TSVs fabricated based on these two key steps show CMOS compatibility and roughly one order of magnitude reduction in resistivity compared to the TSVs filled with as-grown undensified CNT forests.
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| 53. |
- Jiang, Di, 1983, et al.
(författare)
-
Carbon nanotube/solder hybrid structure for interconnect applications
- 2014
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Ingår i: Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. - 9781479940264 ; , s. Art. no. 6962751-
-
Konferensbidrag (refereegranskat)abstract
- A carbon nanotube (CNT)/Solder hybrid bump structure is proposed in this work in order to overcome the drawbacks of high CNT resistivity while retaining the advantages of CNTs in terms of interconnect reliability. Lithographically defined hollow CNT moulds are grown by thermal chemical vapor deposition (TCVD). The space inside the CNT moulds is filled up with Sn-Au-Cu (SAC) solder spheres of around 10 μm in diameter. This CNT/Solder hybrid material is then reflowed and transferred onto target indium coated substrate. The reflow melts the small solder spheres into large single solder balls thus forming a hybrid interconnect bump together with the surrounding densified CNT walls, which the CNT and the solder serve as resistors in parallel. The electrical resistance of such a CNT/Solder structure is measured to be around 6 folds lower than pure CNT bumps.
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| 54. |
- Jiang, Di, 1983, et al.
(författare)
-
Carbon Nanotubes in Electronics Interconnect Applications with a Focus on 3D-TSV Technology
- 2012
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Ingår i: ECS Transactions. - : The Electrochemical Society. - 1938-5862 .- 1938-6737. - 9781607683186 ; 44:1, s. 683-692
-
Konferensbidrag (refereegranskat)abstract
- High density electronics integration at the system level, supported by advanced packaging solutions, is expected to be the main driving force for the future shrinking of electronics. One recent focus in the field of electronics packaging is the use of through-silicon-via (TSV) to form three-dimensional (3D) integration. A central task in developing 3D-TSV integration is to build reliable and efficient electrical interconnects for signal transfer and power distribution among the stacked layers. Carbon nanotubes (CNTs) are supposed to be a promising material to build future interconnects due to their many attractive electrical and mechanical properties. This paper reviews the state-of-art in CNT integration technology, with a focus on the 3D-TSV interconnect. The simplicity and manufacturability of fabricating and stacking CNT TSVs presented in this paper indicate a great application potential of CNTs as an interconnection material in future 3D integrated electronics.
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| 55. |
- Jiang, Di, 1983, et al.
(författare)
-
Electrical Interconnects Made of Carbon Nanotubes: Applications in 3D Chip Stacking
- 2012
-
Ingår i: IMAPS Nordic Annual Conference Proceedings 2012, Helsingor, 2 - 4 September 2012. - 9781622763160 ; , s. 150-159
-
Konferensbidrag (refereegranskat)abstract
- High density electronics integration at the system level, supported by advanced packaging solutions, is expected to be the driving force for the future down-scaling of semiconductor electronics. One recent focus in the field of electronic packaging is the use of through-silicon-vias (TSVs) to form three-dimensional (3D) integration. A central task in developing 3D chip integration is to build reliable and efficient 3D electrical interconnects for signal transfer and power distribution among the stacked layers. Carbon nanotubes (CNTs) are proposed to be a promising material to build future interconnects due to their many attractive electrical and mechanical properties. This paper reviews the state-of-art in CNT integration technology, with a focus on the application of 3D chip stacking TSV interconnects. The simplicity and manufacturability of fabricating CNT TSVs presented in this paper indicate a great application potential of CNTs as an interconnection material in future 3D integrated electronics.
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| 56. |
- Jiang, Di, 1983, et al.
(författare)
-
Paper-mediated controlled densification and low temperature transfer of carbon nanotube forests for electronic interconnect application
- 2013
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Ingår i: Microelectronic Engineering. - : Elsevier BV. - 0167-9317. ; 103, s. Pages 177-180
-
Tidskriftsartikel (refereegranskat)abstract
- We report on the fabrication and characterization of densified and transferred carbon nanotube forests for electronic interconnect application. A simple, low cost and quality method is developed for densifying vertically-aligned carbon nanotube (VA-CNTs) forests at room temperature. Commercially available paper is utilized in this work to serve as a solvent carrier. Highly densified CNT bundles are formed by the sorption of evaporative liquid from the paper into carbon nanotube forests. An average Young’s modulus increase from approximately 15.8 to 111.9 MPa is extrapolated from the measured load–displacement curves in the compression tests of the as-densified VA-CNTs. Subsequent low temperature transfer method is used to transfer the VA-CNT bundles onto the target substrate. Four-probe measurement of the transferred VA-CNTs shows resistance of 3.70 ± 0.04 Ω of each CNT bundle.
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| 57. |
- Jiang, Di, 1983, et al.
(författare)
-
Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate
- 2012
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Ingår i: Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012. - 9782355000225 ; , s. 213-216
-
Konferensbidrag (refereegranskat)abstract
- In this paper we report a novel method of transferring thermally grown vertically aligned carbon nanotubes (VA-CNTs) onto flexible substrates at room temperature with a single-step process. The transfer process is carried out by placing the CNT forests upside down on a double sided thermal release adhesive tape and peeling off the silicon substrate. Scanning electron microscope (SEM) is used to observe the transfer results. Also a second transfer using the same method but a thermal tape with higher release temperature is repeated on the as-transferred CNTs forests. The results show that this method is able to provide a novel process for transferring CNT forests at room temperature. This process will help to bring close the low cost fabrication of vertically aligned CNT structures for electronics.
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| 58. |
- Lai, H., et al.
(författare)
-
A novel isotropic conductive adhesive with Ag flakes, BN and SiC nanoparticles
- 2010
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Ingår i: 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. - 9781424467563 ; , s. 49-53
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Isotropic conductive adhesives (ICAs) with lower bonding temperature, higher resolution and environmental friendly have been used extensively in packaging process. In order to improve the electrical and thermal conductive properties of ICAs, two kinds of bimodal high temperature stable ICAs with matrix SHT6 and fillers with composition of macro silver flakes and boron nitride nanoparticles or macro silver flakes and silicon carbide nanoparticles were studied. In these two kinds of adhesives, the silver flakes were 75wt%, and the contents of nanoparticles were Owt%, 0.5wt%, 1.5wt%, 2.5wt%, 3wt%, 5wt% in weight. All the samples were cured at 150°C for 1 hour. SEM images and EDS results show the nanoparticles disperse randomly in the ICA. The electrical resistivity of these ICAs depends on the contents of silver flakes and is hardly affected by BN nanoparticles and SiC nanoparticles. The thermal conductivity of these ICAs increases firstly with the weight increase of the BN nanoparticles and SiC nanoparticles. And then it decreases when the content of the nanoparticles beyond a certain point. ©2010 IEEE.
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| 59. |
- Li, Dongsheng, et al.
(författare)
-
A highly conductive bimodal isotropic conductive adhesive and its reliability
- 2011
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Ingår i: ECS Transactions. ; 34:1, s. 583 - 588
-
Konferensbidrag (refereegranskat)abstract
- In this paper, micro silver flakes and micro spherical particles were incorporated into the matrix resin of isotropic conductive adhesives (ICAs). Their electrical properties were investigated. The total weight ratio of silver fillers was kept at 75 wt% for all samples. When the content of micro spherical particles was 8 wt%, the bulk resistivity of the bimodal ICAs reduced dramatically to as low as 1.26×10-4 Ω.cm and its viscosity was 24,289 cP under 5rpm at 25°. Scanning electronic microscopy (SEM) images of the bimodal ICAs showed silver fillers well distributed in the matrix resin. In addition, the lap shear strength of different metal surfaces, and the bulk resistivity shifts during aging time under85°/85% RH for more than 500 hours were also measured. The results showed that bulk resistivity shifts of bimodal ICAs remained stable after further cured and the bond strength on the copper surface was the greatest among the three metal surfaces tested.
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| 60. |
- Li, D., et al.
(författare)
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Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives
- 2011
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Ingår i: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 430-435
-
Konferensbidrag (refereegranskat)abstract
- Isotropic conductive adhesives (ICAs) with stable contact resistance and high thermal conductivity are highly desirable. In this paper, a new ICA filled with silver fillers and single-wall carbon nanotubes (SCNTs) was developed. SCNTs were acidified in a mixture of 98% H2S04 and 68% HN03 with a volume rate of 3:1 at 50 °C for 3 h. Carboxyl and hydroxyl groups were produced on SCNTs, and the purity of SCNTs also greatly improved. To prepare the ICAs, acidified SCNTs were firstly ultrasonically dispersed in acetone, then added into the matrix resin, and finally mixed with silver fillers. The bulk resistivity of the fabricated ICAs filled with silver fillers and acidified SCNTs was larger, their lap shear strength lower, their contact resistance stability improved, and their moisture absorption remained almost unchanged. In the curing process, the released heat was greatly reduced and transferred to the surroundings for good thermal conductivity of SCNTs, but the curing temperature was not affected. Therefore, acidified SCNTs can be used in ICAs, and in general, will create a good effect on ICAs.
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