| 1. |
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| 2. |
- Aouadi, Samir, et al.
(författare)
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ICMCTF 2017-Preface
- 2017
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Ingår i: Thin Solid Films. - : ELSEVIER SCIENCE SA. - 0040-6090 .- 1879-2731. ; 644
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Tidskriftsartikel (övrigt vetenskapligt/konstnärligt)abstract
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| 3. |
- Greczynski, Grzegorz, et al.
(författare)
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Control of the metal/gas ion ratio incident at the substrate plane during high-power impulse magnetron sputtering of transition metals in Ar
- 2017
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Ingår i: Thin Solid Films. - : ELSEVIER SCIENCE SA. - 0040-6090 .- 1879-2731. ; 642, s. 36-40
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Tidskriftsartikel (refereegranskat)abstract
- High-power impulse magnetron sputtering (HiPIMS) of materials systems with metal/gas-atom mass ratios m(Me)/m(g) near, or less than, unity presents a challenge for precise timing of synchronous substrate-bias pulses to select metal-ion irradiation of the film and, thus, reduce stress while increasing layer density during low-temperature growth. The problem stems from high gas-ion fluxes Fg+(t) at the substrate, which overlap with metal-ion fluxes FMe+(t). We use energy-and time-dependent mass spectrometry to analyze FMe+(t) and Fg+(t) for Group IVb transition-metal targets in Ar and show that the time-and energy-integrated metal/gas ion ratio NMe+/NAr+ at the substrate can be controlled over a wide range by adjusting the HiPIMS pulse length tau(ON), while maintaining the peak target current density J(T,peak) constant. The effect is a consequence of severe gas rarefaction which scales with J(T)(t). For Ti-HiPIMS, terminating the discharge at the maximum J(T)(t), corresponding to tau(ON) = 30 mu s, there is an essentially complete loss of Ar+ ion intensity, yielding NTi+/NAr+ similar to 60. With increasing tau(ON),J(T)(t) decreases and NTi+/NAr+ gradually decays, due to Ar refill, to similar to 1 with tau(ON) = 120 s. Time-resolved ion-energy distribution functions confirm that the degree of rarefaction depends on tau(ON): for shorter pulses, tau ONHTC/SUBTAG amp;lt; FORTITLEHTC_RETAIN 60 [rs, the original sputtered-atom Sigmund-Thompson energy distributions are preserved long after the HiPIMS pulse, which is in distinct contrast to longer pulses, tau(ON) amp;gt;= 60 mu s, for which the energy distributions collapse into narrow ther-malized peaks. Thus, optimizing the HiPIMS pulse width minimizes the gas-ion flux to the substrate independent of m(Me)/m(g).
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| 4. |
- Greczynski, Grzegorz, et al.
(författare)
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Mitigating the geometrical limitations of conventional sputtering by controlling the ion-to-neutral ratio during high power pulsed magnetron sputtering
- 2011
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Ingår i: Thin Solid Films. - : Elsevier Science B.V., Amsterdam.. - 0040-6090 .- 1879-2731. ; 519:19, s. 6354-6361
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Tidskriftsartikel (refereegranskat)abstract
- High power pulsed magnetron sputtering has been used to grow thin chromium layers on substrates facing and orthogonal to the target. It is demonstrated that at low peak target current density, j(T)less than0.6 A/cm(2) corresponding to a low ion-to-neutral flux ratio, films grown on substrates facing the target exhibit in-plane alignment. This is due to the rectangular shape of the target that yields an asymmetry in the off-normal flux of sputtered species. With increasing j(T) the biaxial alignment degrades, as the major portion of the incoming flux (ions) can be effectively steered by the electric field of the substrate to remove asymmetry imposed by geometrical restrictions. Eventually, at j(T)=1.7 A/cm(2) a fiber texture is obtained. For films grown on substrates orthogonal to the target, the large column tilt characteristic for growth at low j(T), decreases with increasing ion content in the flux and almost disappears at the highest value of j(T). The latter indicates that material flux to the substrate is highly ionized so that deposition takes place along substrate normal despite the high nominal inclination angle. Thus, in the limit of high j(T) the artifacts of conventional physical vapor deposition, resulting from the line-of-sight deposition, are effectively eliminated and the film growth proceeds more or less unaffected by the substrate orientation. Samples mounted orthogonally thus possess a similar texture, morphology, and topography as those facing the target.
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| 5. |
- Greczynski, Grzegorz, et al.
(författare)
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Strain-free, single-phase metastable Ti0.38Al0.62N alloys with high hardness: metal-ion energy vs. momentum effects during film growth by hybrid high-power pulsed/dc magnetron cosputtering
- 2014
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Ingår i: Thin Solid Films. - : Elsevier. - 0040-6090 .- 1879-2731. ; 556, s. 87-98
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Tidskriftsartikel (refereegranskat)abstract
- A hybrid deposition process consisting of reactive high-power pulsed and dc magnetron cosputtering (HIPIMS and DCMS) from Ti and Al targets is used to grow Ti1-xAlxN alloys, with x similar to 0.6, on Si(001) at 500 degrees C. Two series of films are deposited in which the energy and momentum of metal ions incident at the growing film are individually varied. In both sets of experiments, a negative bias V-s ranging from 20 to 280 V is applied to the substrate in synchronous, as determined by in-situ mass spectrometry, with the metal-ion-rich part of the HIPIMS pulse. Ion momentum is varied by switching the HIPIMS and dc power supplies to change the mass m and average charge of the primary metal ion. Al-HIPIMS/Ti-DCMS layers grown under Al+ (m(Al) = 26.98 amu) bombardment with 20 less than= V-s less than= 160 V are single-phase NaCl-structure alloys, while films deposited with V-s greater than 160 V are two-phase, cubic plus wurtzite. The corresponding critical average metal-ion momentum transfer per deposited atom for phase separation is less than p(d)*greater than greater than= 135 [eV-amu](1/2). In distinct contrast, layers deposited in the Ti-HIPIMS/Al-DCMS configuration with Ti+/Ti2+ (m(Ti) = 47.88 amu) ion irradiation are two-phase even with the lowest bias, V-s = 20 V, for which less than p(d)*greater than greater than 135 [eV-amu](1/2). Precipitation of wurtzite-structure AlN is primarily determined by the average metal-ion momentum transfer to the growing film, rather than by the deposited metal-ion energy. Ti-HIPIMS/Al-DCMS layers grown with V-s= 20 V are two-phase with compressive stress sigma= -2 GPa which increases to -6.2 GPa at V-s= 120 V; hardness H values range from 17.5 to 27 GPa and are directly correlated with sigma. However, for Al-HIPIMS/Ti-DCMS, the relatively low mass and single charge of the Al+ ion permits tuning properties of metastable cubic Ti0.38Al0.62 N by adjusting V-s to vary, for example, the hardness from 12 to 31 GPa while maintaining sigma similar to 0.
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| 6. |
- Lai, Chung-Chuan, et al.
(författare)
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Synthesis and characterization of Zr2Al3C4 thin films
- 2015
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Ingår i: Thin Solid Films. - : ELSEVIER SCIENCE SA. - 0040-6090 .- 1879-2731. ; 595, s. 142-147
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Tidskriftsartikel (refereegranskat)abstract
- Zr2Al3C4 is an inherently nanolaminated carbide where layers of ZrC alternate with layers of Al3C2. Characterization of bulk samples has shown it has improved damage tolerance and oxidation resistance compared to its binary counterpart ZrC. Though a potential candidate for coatings applied for use in harsh environments, thin films of Zr2Al3C4 have not been reported. We have synthesized epitaxial Zr2Al3C4 thin films by pulsed cathodic arc deposition from three elemental cathodes, and have studied the effect of incident atomic flux ratio, deposition temperature, and choice of substrate on material quality. X-ray diffraction analysis showed that Zr2Al3C4 of the highest structural quality was obtained for growth on 4 H-SiC(001) substrate at 800 degrees C. Also, suppression of competing phases could be achieved on alpha-Al2O3(001) at elevated substrate temperatures. Very similar growth behavior to that of the well-known M(n+1)AX(n) phases - Al supersaturation, binary carbide intergrowth and high sensitivity to choice of substrate - indicates a strong connection between the two families of materials, despite their differences in structure and in chemistry. (C) 2015 Elsevier B.V. All rights reserved.
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| 7. |
- Linder, Clara, et al.
(författare)
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Effect of Mo content on the corrosion resistance of (CoCrFeNi)1−xMox thin films in sulfuric acid
- 2024
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Ingår i: Thin Solid Films. - : Elsevier B.V.. - 0040-6090 .- 1879-2731. ; 790
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Tidskriftsartikel (refereegranskat)abstract
- (CoCrFeNi)1−xMox thin films with various Mo content (0–10 at.%) were grown by magnetron sputtering on a stainless steel substrate. The films with 0–2 at.% presented two crystal structures: one FCC phase and one sigma phase, while films with higher Mo content only had the FCC structure. All films have a (111) texture and follow the topography of the substrate. The corrosion resistance of the films was evaluated in 0.05 M H2SO4 at room temperature and at 80 °C. It was observed that the corrosion current densities considerably decreased for Mo > 2 at%, and that the current densities were higher at the elevated temperature. Scanning Kelvin Probe Force Microscopy showed a large potential difference between the main FCC phase and sigma phase for the Mo0–2 films. This would suggest that preferential dissolution of the FCC phase occurs over the sigma and reduces the corrosion resistance. Such preferential dissolution does not occur for the higher Mo content films with only the FCC phase. The high corrosion resistance was also attributed to the inhibition of Fe and Cr dissolution by Mo and the stabilisation of the Cr enriched oxide by incorporating Mo oxides into the passive film, identified by X-ray photoelectron spectroscopy. The low corrosion current densities (below 1 µA/cm2) make these thin films possible candidates for protective coatings of bipolar plates in PEM fuel cells.
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| 8. |
- Magnuson, Martin, 1965-, et al.
(författare)
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Chemical Bonding in Epitaxial ZrB2 Studied by X-ray Spectroscopy
- 2018
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Ingår i: Thin Solid Films. - : Elsevier. - 0040-6090 .- 1879-2731. ; 649, s. 89-96
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Tidskriftsartikel (refereegranskat)abstract
- The chemical bonding in an epitaxial ZrB2 film is investigated by Zr K-edge (1s) X-ray absorption near-edge structure (XANES) and extended X-ray absorption fine structure (EXAFS) spectroscopies and compared to the ZrB2 compound target from which the film was synthesized as well as a bulk α-Zr reference. Quantitative analysis of X-ray Photoelectron Spectroscopy spectra reveals at the surface: ~5% O in the epitaxial ZrB2 film, ~19% O in the ZrB2 compound target and ~22% O in the bulk α-Zr reference after completed sputter cleaning. For the ZrB2 compound target, X-ray diffraction (XRD) shows weak but visible 11, 111, and 220 peaks from monoclinic ZrO2 together with peaks from ZrB2 and where the intensity distribution for the ZrB2 peaks show a randomly oriented target material. For the bulk α-Zr reference no peaks from any crystalline oxide were visible in the diffractogram recorded from the 0001-oriented metal. The Zr K-edge absorption from the two ZrB2 samples demonstrate more pronounced oscillations for the epitaxial ZrB2 film than in the bulk ZrB2 attributed to the high atomic ordering within the columns of the film. The XANES exhibits no pre-peak due to lack of p-d hybridization in ZrB2, but with a chemical shift towards higher energy of 4 eV in the film and 6 eV for the bulk compared to α-Zr (17.993 keV) from the charge-transfer from Zr to B. The 2 eV larger shift in bulk ZrB2 material suggests higher oxygen content than in the epitaxial film, which is supported by XPS. In EXAFS, the modelled cell-edge in ZrB2 is slightly smaller in the thin film (a=3.165 Å, c=3.520 Å) in comparison to the bulk target material (a=3.175 Å, c=3.540 Å) while in hexagonal closest-packed metal (α-phase, a=3.254 Å, c=5.147 Å). The modelled coordination numbers show that the EXAFS spectra of the epitaxial ZrB2 film is highly anisotropic with strong in-plane contribution, while the bulk target material is more isotropic. The Zr-B distance in the film of 2.539 Å is in agreement with the calculated value from XRD data of 2.542 Å. This is slightly shorter compared to that in the ZrB2 compound target 2.599 Å, supporting the XANES results of a higher atomic order within the columns of the film compared to bulk ZrB2.
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| 9. |
- Magnuson, Martin, 1965-, et al.
(författare)
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Reactive magnetron sputtering of tungsten target in krypton/trimethylboron atmosphere
- 2019
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Ingår i: Thin Solid Films. - : Elsevier. - 0040-6090 .- 1879-2731. ; 688
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Tidskriftsartikel (refereegranskat)abstract
- W-B-C films were deposited on Si(100) substrates held at elevated temperature by reactive sputtering from a W target in Kr/trimethylboron (TMB) plasmas. Quantitative analysis by Xray photoelectron spectroscopy (XPS) shows that the films are W-rich between ~ 73 and ~ 93 at.% W. The highest metal content is detected in the film deposited with 1 sccm TMB. The C and B concentrations increase with increasing TMB flow to a maximum of ~18 and ~7 at.%, respectively, while the O content remains nearly constant at 2-3 at.%. Chemical bonding structure analysis performed after samples sputter-cleaning reveals C-W and B-W bonding and no detectable W-O bonds. During film growth with 5 sccm TMB and 500 o C or with 10 sccm TMB and 300-600 o C thin film X-ray diffraction shows the formation of cubic 100-oriented WC1-x with a possible solid solution of B. Lower flows and lower growth temperatures favor growth of W and W2C, respectively. Depositions at 700 and 800 o C result in the formation of WSi2 due to a reaction with the substrate. At 900 o C, XPS analysis shows ~96 at.% Si in the film due to Si interdiffusion. Scanning electron microscopy images reveal a fine-grained microstructure for the deposited WC1-x films. Nanoindentation gives hardness values in the range from ~23 to ~31 GPa and reduced elastic moduli between ~220 and 280 GPa in the films deposited at temperatures lower than 600 o C. At higher growth temperatures the hardness decreases by a factor of 3 to 4 following the formation of WSi2 at 700-800 o C and Si-rich surface at 900 o C.
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| 10. |
- Nyberg, Tomas, et al.
(författare)
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A simple model for non-saturated reactive sputtering processes
- 2019
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Ingår i: Thin Solid Films. - : Elsevier BV. - 0040-6090 .- 1879-2731. ; 688
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Tidskriftsartikel (refereegranskat)abstract
- Reactive sputtering processes are quite complex processes and therefore difficult to understand in detail. However, a number of attempts to clearify the behaviour of reactive sputtering of oxides and nitrides have been made. Several process modelling results for such processes have been published that reasonable well mirrors the actual experimental findings. All of these models indicate that the processes normally exhibit hysteresis effects and that the oxides/nitrides will saturate at the stoichiometric compound values. We therefore call these processes saturated reactive sputtering processes. Carrying out reactive sputtering in a hydrocarbon gas like CH4 instead of in oxygen or nitrogen cannot be described with the previously suggested models for oxide or nitride formations. Decomposition of the CH4 molecule in the plasma may result both in carbide formation with the target metal as well as plasma deposited carbon. Depending on the supply of the CH4 the deposited film composition may vary from 0 to 100% of carbon. In the extreme case of very high supply of CH4 a pure carbon film will be deposited. We expect that similar behaviour will be found when carrying out reactive sputtering in other solid material containing gases like e.g. silane or diborane. We have chosen to call such processes non-saturated reactive sputtering processes. In order to understand the behaviour of non-saturated reactive sputtering processes we have developed a new model that enables the user to find the response to individual processing parameters and thus obtain a tool for process optimization. In order to limit the number of parameters our model is outlined for reactive sputtering of Ti in a mixture of argon and CH4. In this article we report that the simulation results reasonable well correlate with our experimental findings.
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