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- Carlberg, Björn, 1983
(författare)
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Integration of Electrospun Materials in Microelectronic and Biomedical Applications
- 2009
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Licentiatavhandling (övrigt vetenskapligt/konstnärligt)abstract
- This thesis demonstrates the use of electrospinning and the novel properties of electrospunmaterials in two fields.The microelectronics industry has identified thermal interface materials as one of themajor bottlenecks hindering further integration at packaging level. New concepts basedon metal-polymer composite architectures are needed to fulfill current and future thermaland thermomechanical requirements on thermal interface materials at maintained costefficiency. In this thesis, an interpenetrating phase polymer-metal composite for thermalinterface material applications has been developed and characterized. Both fabricationand metrology equipment has been developed for the purpose at hand. The composite isbased on a porous electrospun polymer carrier infiltrated with a high thermal conductivitymetal phase. The two phases form two fully interpenetrating networks in the composite.Efficient heat transfer is achieved through the continuous metal phase, while the polymericphase defines geometry and phase composition. The devised composite architecture is believedto be a step towards meeting current and future demands on thermal performanceand thermomechanical reliability in microelectronic products.Furthermore, the thesis presents initial results of human embryonic stem cell proliferationand neural differentiation in co-culture with electrospun scaffolds, of interestin future regenerative medicine based on stem cells. Results indicate that physical cuesemanating from cell-scaffold interactions affect cells towards a neuronal fate during differentiation,a phenomenon consistent with reports in literature on physical cues influencingstem cell fate. To allow for deeper analysis on cell-scaffold interactions of thetype described above, a microfabricated platform was developed for the purpose. A novelmethod for direct photolithographic micropatterning of electrospun polyurethane fibrousfilms over large surfaces has been devised. The method allows for assembly of complexelectrospun microstructures on single substrates via a multilayer approach involving multiplephotolithographic exposures, analogous to conventional photolithography in microfabricationof solid state devices. Indeed, this technique can find application in a variety ofapplications where it is beneficial to integrate micropatterned electrospun structures intomicrofabricated devices, in particular within biomedical engineering applications.
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- Liu, Johan, 1960, et al.
(författare)
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Nanofiber based composites for thermal management
- 2010
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Ingår i: International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference.
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)
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