- Chen, L., et al.
Process development and reliability for system-in-a-package using liquid crystal polymer substrate
Ingår i: Proc Electron Compon Technol Conf. ; , s. 24-28
- In this study, embedded chip technology for system-in-a-package (SiP) application using liquid crystal polymer (LCP) substrate was developed and the reliability issue for embedded structure was evaluated. To this end two test chips with daisy chain joints were used with one copper layer. After assembly, modules were exposed to thermal cycling. The failure was investigated by SEM, and compared with finite element method (FEM) simulation results. Passive components as inductors were also fabricated on the LCP during the embedded technology. Their inductance and quality factors were simulated and discussed.