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Sökning: WFRF:(Ericsson G) > RISE

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1.
  • Forsberg, Fredrik, et al. (författare)
  • CMOS-integrated Si/SiGe quantum-well infrared microbolometer focal plane arrays manufactured with very large-scale heterogeneous 3-d integration
  • 2015
  • Ingår i: IEEE Journal of Selected Topics in Quantum Electronics. - : Institute of Electrical and Electronics Engineers Inc.. - 0792-1233 .- 1077-260X .- 1558-4542. ; 21:4
  • Tidskriftsartikel (refereegranskat)abstract
    • We demonstrate infrared focal plane arrays utilizing monocrystalline silicon/silicon-germanium (Si/SiGe) quantum-well microbolometers that are heterogeneously integrated on top of CMOS-based electronic read-out integrated circuit substrates. The microbolometers are designed to detect light in the long wavelength infrared (LWIR) range from 8 to 14 μm and are arranged in focal plane arrays consisting of 384 × 288 microbolometer pixels with a pixel pitch of 25 μm × 25 μm. Focal plane arrays with two different microbolometer designs have been implemented. The first is a conventional single-layer microbolometer design and the second is an umbrella design in which the microbolometer legs are placed underneath the microbolometer membrane to achieve an improved pixel fill-factor. The infrared focal plane arrays are vacuum packaged using a CMOS compatible wafer bonding and sealing process. The demonstrated heterogeneous 3-D integration and packaging processes are implemented at wafer-level and enable independent optimization of the CMOS-based integrated circuits and the microbolometer materials. All manufacturing is done using standard semiconductor and MEMS processes, thus offering a generic approach for integrating CMOS-electronics with complex miniaturized transducer elements
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2.
  • Bag, G., et al. (författare)
  • Experiments on Approaches of Virtualization for Industrial Internet of Things applications
  • 2019
  • Ingår i: 2019 24th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA). ; , s. 1226-1229
  • Konferensbidrag (refereegranskat)abstract
    • New technologies that comes with recent trends like Internet of Things, Cloud and 5G are promoting new platforms and communication solutions. These trends have also started to impact traditional industrial automation systems, since end customers are starting to expect new services, such as, business intelligence and diagnostic information anywhere at any time. Moreover, the cloud providers lease their infrastructure to be used for deployment of applications using virtualization. Therefore, this paper aims at exploring the possibilities of different virtualization platforms offered by various cloud providers and benchmark the technologies with platforms frequently used within industry. The platform performance was evaluated by conducting experiments with an industrial application, focusing on typical industrial aspect such as latency, jitter and availability. In addition to more industrial focused metrics, the findings in comparison with other related experiments indicate that specific application requirements have an effect on performance. Hence, application specific evaluations may be necessary before taking any decision on where an industrial application may be deployed.
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