| 1. |
- Fu, Yifeng, 1984, et al.
(författare)
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A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity
- 2012
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Ingår i: Nanotechnology. - : IOP Publishing. - 1361-6528 .- 0957-4484. ; 23:4
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Tidskriftsartikel (refereegranskat)abstract
- Heat dissipation is one of the factors limiting the continuous miniaturization of electronics. In the study presented in this paper, we designed an ultra-thin heat sink using carbon nanotubes (CNTs) as micro cooling fins attached directly onto a chip. A metal-enhanced CNT transfer technique was utilized to improve the interface between the CNTs and the chip surface by minimizing the thermal contact resistance and promoting the mechanical strength of the microfins. In order to optimize the geometrical design of the CNT microfin structure, multi-scale modeling was performed. A molecular dynamics simulation (MDS) was carried out to investigate the interaction between water and CNTs at the nanoscale and a finite element method (FEM) modeling was executed to analyze the fluid field and temperature distribution at the macroscale. Experimental results show that water is much more efficient than air as a cooling medium due to its three orders-of-magnitude higher heat capacity. For a hotspot with a high power density of 5000 W cm(-2), the CNT microfins can cool down its temperature by more than 40 degrees C. The large heat dissipation capacity could make this cooling solution meet the thermal management requirement of the hottest electronic systems up to date.
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| 2. |
- Fu, Yifeng, 1984, et al.
(författare)
-
Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene
- 2012
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Ingår i: Advanced Materials. - : Wiley. - 0935-9648 .- 1521-4095. ; 24:12, s. 1576-1581
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Tidskriftsartikel (refereegranskat)abstract
- A template-assisted method that enables the growth of covalently bonded three-dimensional carbon nanotubes (CNTs) originating from graphene at a large scale is demonstrated. Atomic force microscopy-based mechanical tests show that the covalently bonded CNT structure can effectively distribute external loading throughout the network to improve the mechanical strength of the material.
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| 3. |
- Fu, Yifeng, 1984, et al.
(författare)
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Thick film patterning by lift-off process using double-coated single photoresists
- 2012
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Ingår i: Materials Letters. - : Elsevier BV. - 1873-4979 .- 0167-577X. ; 76, s. 117-119
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Tidskriftsartikel (refereegranskat)abstract
- A novel method using lift-off process for patterning very thick materials is developed and demonstrated. Unlike conventional lift-off processes, no special lift-off resist is used in this method. Instead, only a double-coated single photoresist is needed. Demonstrations using two commercial photoresists show that good patterning morphology and obvious undercuts as high as 15 mu m are obtained for lift-off, which is very difficult to achieve by existing methods. The application and feasibility of this approach is demonstrated by a carbon nanotube transfer process. This simple and effective method offers wider option to pattern very thick materials in high quality which are in strong demands.
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| 4. |
- Liu, Johan, 1960, et al.
(författare)
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Use of carbon nanotubes in potential electronics packaging applications
- 2010
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Ingår i: 2010 10th IEEE Conference on Nanotechnology, NANO 2010. - 9781424470334 ; , s. 160-166
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Konferensbidrag (övrigt vetenskapligt/konstnärligt)abstract
- Packaging of electronics is an important technology to interconnect, power, cool and protect the components in highly integrated systems. Continuous size shrinking and function integration of future electronics are expected to be driven mainly by the advances in packaging technology. Carbon nanotubes (CNTs) are proposed for many novel packaging solutions thanks to their unique electrical, thermal, and mechanical properties. This paper introduces potential use of CNTs in electronics packaging, in both interconnection and thermal management applications. The challenges of fully exploiting the great potential of CNTs in this field are also discussed.
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| 5. |
- Hu, Zhili, 1983, et al.
(författare)
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Detecting single molecules inside a carbon nanotube to control molecular sequences using inertia trapping phenomenon
- 2012
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Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 101:13, s. Art. no. 133105-
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Tidskriftsartikel (refereegranskat)abstract
- Here we show the detection of single gas molecules inside a carbon nanotube based on the change inresonance frequency and amplitude associated with the inertia trapping phenomenon. As its directimplication, a method for controlling the sequence of small molecule is then proposed to realize theconcept of manoeuvring of matter atom by atom in one dimension. The detection as well as theimplication is demonstrated numerically with the molecular dynamics method. It is theoreticallyassessed that it is possible for a physical model to be fabricated in the very near future.
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| 6. |
- Zhang, Yong, 1982, et al.
(författare)
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Use of graphene-based films for hot spot cooling
- 2014
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Ingår i: Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. - 9781479940264 ; , s. Art. no. 6962834-
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Konferensbidrag (refereegranskat)abstract
- Efficient heat dissipation is becoming an urgent demand in electronics and optoelectronics because of increasing power density, which is generating more heat than ever. Graphene, an atomic layer of carbon, has been shown to have high thermal conductivity, which makes this material a promising candidate for heat dissipation in electronics. Here, we demonstrate a new type of graphene-based film on a test platform to alleviate the thermal issues. Taking advantage of its high in-plane thermal conductivity, CVD-grown graphene has been observed to possess a strong heat-spreading ability. In this paper, a chemical conversion process, including chemical oxidation, exfoliation and reduction, is utilised to fabricate the graphene-based films. Additionally, functionalisation of the film was also performed to diminish the interface thermal resistance between the chip surface and the graphene-based films. Thermal characterisation showed a capacity for effective heat removal, which was indicated by the decrease in the hot spot temperature at the same power loading. In summary, this facile approach may technologically enable large-scale fabrication of graphene-based films for thermal management in high power density devices.
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