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- Jiang, Di, 1983, et al.
(författare)
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Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate
- 2012
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Ingår i: Proceedings of the 18th Therminic International Workshop on Thermal Investigations of ICs and Systems, Budapest, 25-27 September 2012. - 9782355000225 ; , s. 213-216
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Konferensbidrag (refereegranskat)abstract
- In this paper we report a novel method of transferring thermally grown vertically aligned carbon nanotubes (VA-CNTs) onto flexible substrates at room temperature with a single-step process. The transfer process is carried out by placing the CNT forests upside down on a double sided thermal release adhesive tape and peeling off the silicon substrate. Scanning electron microscope (SEM) is used to observe the transfer results. Also a second transfer using the same method but a thermal tape with higher release temperature is repeated on the as-transferred CNTs forests. The results show that this method is able to provide a novel process for transferring CNT forests at room temperature. This process will help to bring close the low cost fabrication of vertically aligned CNT structures for electronics.
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| 3. |
- Li, X., et al.
(författare)
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Reliability of Carbon Nanotube Bumps for Chip on Film Application
- 2013
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Ingår i: Proceedings of the IEEE Conference on Nanotechnology. - 1944-9399 .- 1944-9380. - 9781479906758 ; , s. 845-848
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Konferensbidrag (refereegranskat)abstract
- Carbon nanotubes (CNTs) are an ideal candidate for electrical interconnects due to their extraordinary thermal, electrical and mechanical properties. In this work, as-densified CNT bumps were applied as chip on film (COF) interconnection material. A silicon chip with patterned CNT bumps was bonded onto a flexible substrate using anisotropic conductive adhesive (ACA) with bonding pressure, at 127.4 MPa, 170 °C and for 8 seconds. The electrical properties of this structure were evaluated by measuring the contact resistance of each bump using the four-point probe method. Thermal cycling (-40∼85°C, 1000 cycles) and damp heat tests (85°C/85% RH, 1000 hours) were conducted to evaluate the reliabilities of the CNT-COF structure bonded with ACA. The average contact resistances of two samples used for the reliability tests were 226 mΩ and 260mΩ. No electrical failure was observed after the damp heat test and only two were observed after the thermal cycling test. The average contact resistance was increased only 15.7% and 13.8%, respectively, after the thermal cycling and the damp heat tests. © 2013 IEEE.
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| 4. |
- Zhang, Yan, 1976, et al.
(författare)
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Experimental study of Electrical properties and stability of CNT bumps in high density interconnects
- 2013
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Ingår i: Proceedings of the IEEE Conference on Nanotechnology. - 1944-9399 .- 1944-9380. - 9781479906758 ; , s. 1085-1088
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Konferensbidrag (refereegranskat)abstract
- With the minimization development of electronic devices and products, nanotechnology and nanomaterials are widely applied in different fields of electronic packaging. Carbon nanotube (CNT) is an ideal material due to its excellent electrical and thermal conductivities. In the present paper, the application of CNT bundles as chip bumps was experimentally investigated. The electrical resistances of the CNT interconnects were measured, and the thermal and humidity test were conducted. In addition, the CNT forests on fine pitch copper lines under various environmental test conditions were observed to evaluate the stability. © 2013 IEEE.
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