Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier

• Graphene protection barrier was introduced to the interface between the ECAs and Cu-plated wire to enhance the reliability of the ECAs joints on Cu-Plated PCB substrate due to its excellent properties of impermeability to all gases/salts as well as its thermal/chemical stability. The results of shear test indicated graphene protection barrier can improve the shear strength of the ECAs joints on Cu-plated PCB substrate by almost 22% after 500 hours high temperature and high humidity cyclic test. Characterizations by optical microscope and XPS were further performed to explain the mechanism. To sum up, it can be believed that the graphene protection barrier can dramatically enhance the reliability of the ECAs joints on Cu-Plated PCB substrate.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Kemiteknik -- Polymerteknologi (hsv//swe)

ENGINEERING AND TECHNOLOGY  -- Chemical Engineering -- Polymer Technologies (hsv//eng)

Keyword

Cu-Plated PCB

Graphene protection barrier

Reliability

Publication and Content Type

kon (subject category)

ref (subject category)