| 1. |
- Chen, S., et al.
(författare)
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An overview of carbon nanotubes based interconnects for microelectronic packaging
- 2017
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Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 113-119
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Konferensbidrag (refereegranskat)abstract
- Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.
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| 2. |
- Daon, J., et al.
(författare)
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Chemically enhanced carbon nanotubes based Thermal Interface Materials
- 2015
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Ingår i: THERMINIC 2015 - 21st International Workshop on Thermal Investigations of ICs and Systems 2015. - 9781467397056
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Konferensbidrag (refereegranskat)abstract
- With progress in microelectronics the component density on a device increases drastically. As a consequence the power density reaches levels that challenge device reliability. New heat dissipation strategies are needed to efficiently drain heat. Thermal Interface Materials (TIMs) are usually used to transfer heat across interfaces, for example between a device and its packaging. Vertically Aligned Carbon Nanotubes (VACNTs) can be used to play this role. Indeed, carbon nanotubes are among the best thermal conductors (similar to 3.000 W/mK) and in the form of VACNT mats, show interesting mechanical properties. On one side, VACNTs are in contact with their growth substrate and there is a low thermal resistance. On the other side, good contact must be created between the opposite substrate and the VACNTs in order to decrease the contact thermal resistance. A thin-film deposition of an amorphous material can be used to play this role. This paper reports a chemically enhanced carbon nanotube based TIM with creation of chemical bonds between the polymer and VACNTs. We show that these covalent bonds enhance the thermal transfer from VACNTs to a copper substrate and can dramatically decrease local resistances. Implementation processes and thermal characterizations of TIMs are studied and reported.
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| 3. |
- Darmawan, C. C., et al.
(författare)
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Graphene-CNT hybrid material as potential thermal solution in electronics applications
- 2017
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Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 190-193
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Konferensbidrag (refereegranskat)abstract
- Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.
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| 4. |
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| 5. |
- Fu, Yifeng, 1984, et al.
(författare)
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Carbon nanotube growth on different underlayers for thermal interface material application
- 2016
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Ingår i: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Konferensbidrag (refereegranskat)abstract
- Thermal interface material (TIM) is a critical component in thermal management of high density packaging systems since both the reliability and lifetime of microsystems are dependent on how the heat is dissipated. Carbon nanotubes (CNTs) are promising candidate for development of TIMs due to their excellent thermal and mechanical properties. The thermal conductivity of CNTs can be up to 3000 W/mK in the longitudinal direction which acts as ideal heat transfer path. However, the huge interfacial thermal resistance between CNTs and contact surface hinders the exploitation of CNTs as TIMs. In this paper, we will focus on the growth of CNTs on various substrates and underlayers and analyze the interaction between catalyst and underlayer materials. Microscopic analysis is performed to characterize the quality of the CNT materials and monitor the diffusion of Fe particles into different barrier layers. Thermal conductivity of the CNT TIMs will be measured to examine the performance of the materials.
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| 6. |
- Fu, Yifeng, 1984, et al.
(författare)
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Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review
- 2016
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Ingår i: 2016 6th Electronic System-Integration Technology Conference (Estc). - 9781509014026 ; , s. Article no 7764713-
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Konferensbidrag (refereegranskat)abstract
- Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various post-growth processing of CNTs, such as doping, densification, transfer, metallization, etc., for the improvement of their performance will be reviewed.
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| 7. |
- Huang, S., et al.
(författare)
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Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
- 2017
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Ingår i: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 143-146
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Konferensbidrag (refereegranskat)abstract
- Graphene protection barrier was introduced to the interface between the ECAs and Cu-plated wire to enhance the reliability of the ECAs joints on Cu-Plated PCB substrate due to its excellent properties of impermeability to all gases/salts as well as its thermal/chemical stability. The results of shear test indicated graphene protection barrier can improve the shear strength of the ECAs joints on Cu-plated PCB substrate by almost 22% after 500 hours high temperature and high humidity cyclic test. Characterizations by optical microscope and XPS were further performed to explain the mechanism. To sum up, it can be believed that the graphene protection barrier can dramatically enhance the reliability of the ECAs joints on Cu-Plated PCB substrate.
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| 8. |
- Huang, Shirong, et al.
(författare)
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Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging
- 2016
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Ingår i: 6th Electronic System-integration Technology Conference (ESTC 2016). - 9781509014026 ; , s. Article no 7764696-
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Konferensbidrag (refereegranskat)abstract
- Vertically-aligned multiwall carbon nanotubes were deposited on silicon substrate by low pressure chemical vapor deposition (LPCVD), which can be utilized as heat spreaders in high power electronic packaging due to their remarkable thermal conductivity. The infrared emissivity of the vertically aligned multiwall carbon nanotubes was then characterized based on the FLIR SC600 infrared imaging system. The average infrared emissivity of the multiwall carbon nanotubes sample was about 0.92, which agrees well with experimental results reported before. Scanning electron microscopy (SEM) images of the multiwall carbon nanotubes were further analyzed to explain its high emissivity, and the reason can be attributed to the homogeneous sparseness and aligned structure of the vertically aligned multiwall carbon nanotubes
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| 9. |
- Huang, Shirong, et al.
(författare)
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Reliability of Graphene-based Films Used for High Power Electronics Packaging
- 2015
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Ingår i: 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015. - 9781467379991 ; , s. 852-855
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Konferensbidrag (refereegranskat)abstract
- Graphene-base film was fabricated with chemical conversion process, including graphene oxide (GO) prepared by Hummer's method, graphene oxide reduced with L-ascorbic acid (LAA), graphene based film deposited by vacuum filtration process. Meanwhile, the functionalization of the graphene-based film was performed to decrease the thermal interface resistance between the graphene-based film and substrate. Characterization data showed that the graphene-based film possessed high reliability after 500 hours under 85°C aging test. In summary, the graphene-based film can be a promising solution in thermal management of high power electronics.
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| 10. |
- Huang, Shirong, et al.
(författare)
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The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
- 2016
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Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. - 9781509013968 ; , s. Art no 7583272; Pages 889-892
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Konferensbidrag (refereegranskat)abstract
- Graphene-based films (GBF) were fabricated using a chemical conversion process including graphene oxide (GO) preparation by use of Hummer’s method, graphene oxide reduction using L-ascorbic acid (LAA), and finally film formation by vacuum filtration. GBF is considered as a candidate material for thermal management, i.e. for removing heat from hotspots in power electronic packaging, due to its high thermal conductivity. In this work, the GBF heat spreading performance in 3D TSV packaging was analysed using finite element methods (FEM) implemented in the COMSOL software. Both size effects and the influence of the thermal conductivity of the GBF heat spreader on the thermal performance of the 3D TSV package were evaluated. Furthermore, the size effects of the thermal conductive adhesive (TCA) underfill between the chip and the printed circuit board (PCB) were analysed. The results obtained are critical for proper design of graphene-based lateral heat spreaders in high power electronic packaging.
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