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Graphene-CNT hybrid material as potential thermal solution in electronics applications

Darmawan, C. C. (author)
SHT Smart High-Tech AB
Ye, L. (author)
SHT Smart High-Tech AB
Kabiri Samani, Majid, 1976 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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Fu, Yifeng, 1984 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology,Shanghai University
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 (creator_code:org_t)
2017
2017
English.
In: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 190-193
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.

Subject headings

NATURVETENSKAP  -- Kemi -- Materialkemi (hsv//swe)
NATURAL SCIENCES  -- Chemical Sciences -- Materials Chemistry (hsv//eng)

Keyword

Thermal Conductivity
Graphene
CNT
Thermal Management
Covalent bonding

Publication and Content Type

kon (subject category)
ref (subject category)

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