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A flexible and stac...
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
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- Jiang, Di, 1983 (author)
- Fingerprint Cards,Chalmers tekniska högskola,Chalmers University of Technology
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- Sun, Shuangxi, 1986 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Edwards, Michael, 1986 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Jeppson, Kjell, 1947 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Wang, Nan, 1988 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Fu, Yifeng, 1984 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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- Liu, Johan, 1960 (author)
- Chalmers tekniska högskola,Chalmers University of Technology
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(creator_code:org_t)
- 2017-05-02
- 2017
- English.
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In: Flexible and Printed Electronics. - : IOP Publishing. - 2058-8585. ; 2:2
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Abstract
Subject headings
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- One of the critical challenges for realizing flexible electronic systems for a wide range of applications is the development of materials for flexible and stackable interconnects. We propose and demonstrate a three-dimensional (3D)interconnect structure embedded in a polymeric substrate using metal-coated carbon nanotube (CNT)scaffolds. By using two different underlayer materials for the catalyst, onestep synthesis of a dual-height CNT interconnect scaffold was realized. The CNT scaffolds serve as flexible cores for both annular metal through-substrate-vias and for horizontal metal interconnect. The 3D-CNT network was fabricated on a silicon substrate, and once the scaffolds were covered by metal, they were embedded in a polymer serving as a flexible substrate after peel-off from the silicon substrate. The 3D-CNT interconnect network was exposed to mechanical bending and stretching tests while monitoring its electrical properties. Even after 300 cycles no significant increase of resistances was found. Electrically there is a trade-off between flexibility and conductivity due to the surface roughness of the scaffold. However, this is to some extent alleviated by the metalized sidewalls giving the horizontal wires a cross-sectional area larger than indicated by their footprint. For gold wires 200 nm thick, measurements indicated a resistivity of 18 μΩ.cm, a value less than one order of magnitude larger than that of bulk gold, and a value that is expected to improve as technology improves. The mechanical properties of the metalized scaffolds were simulated using a finite element model. The potential scale-up capability of the proposed 3D-CNT network was demonstrated by the stacking of two such polymer-embedded interconnect systems.
Subject headings
- TEKNIK OCH TEKNOLOGIER -- Elektroteknik och elektronik (hsv//swe)
- ENGINEERING AND TECHNOLOGY -- Electrical Engineering, Electronic Engineering, Information Engineering (hsv//eng)
Keyword
- flexible electronics
- carbon nanotubes
- interconnect
- 3D integration
Publication and Content Type
- art (subject category)
- ref (subject category)
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- By the author/editor
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Jiang, Di, 1983
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Sun, Shuangxi, 1 ...
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Edwards, Michael ...
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Jeppson, Kjell, ...
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Wang, Nan, 1988
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Fu, Yifeng, 1984
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Liu, Johan, 1960
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- About the subject
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- ENGINEERING AND TECHNOLOGY
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ENGINEERING AND ...
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and Electrical Engin ...
- Articles in the publication
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Flexible and Pri ...
- By the university
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Chalmers University of Technology