| 1. |
- Chen, S., et al.
(author)
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An overview of carbon nanotubes based interconnects for microelectronic packaging
- 2017
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In: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 113-119
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Conference paper (peer-reviewed)abstract
- Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.
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| 2. |
- Darmawan, C. C., et al.
(author)
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Graphene-CNT hybrid material as potential thermal solution in electronics applications
- 2017
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In: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 190-193
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Conference paper (peer-reviewed)abstract
- Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.
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| 3. |
- Huang, S., et al.
(author)
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Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
- 2017
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In: 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017. - 9781538630556 ; , s. 143-146
-
Conference paper (peer-reviewed)abstract
- Graphene protection barrier was introduced to the interface between the ECAs and Cu-plated wire to enhance the reliability of the ECAs joints on Cu-Plated PCB substrate due to its excellent properties of impermeability to all gases/salts as well as its thermal/chemical stability. The results of shear test indicated graphene protection barrier can improve the shear strength of the ECAs joints on Cu-plated PCB substrate by almost 22% after 500 hours high temperature and high humidity cyclic test. Characterizations by optical microscope and XPS were further performed to explain the mechanism. To sum up, it can be believed that the graphene protection barrier can dramatically enhance the reliability of the ECAs joints on Cu-Plated PCB substrate.
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| 4. |
- NYLANDER, ANDREAS, 1988, et al.
(author)
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Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications
- 2017
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In: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). - 9781538630556 ; , s. 175-181
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Conference paper (peer-reviewed)abstract
- The development of integrated circuitry has resulted in cheaper and more efficient computers being available every year. Unfortunately, this development comes at the expense of an exponential increase of power density that scales with miniaturisation of transistors. To counteract the hot spot issue that arises and results in poor reliability and reduced lifetime of microsystems, thermal interface materials (TIMs) can be used. TIMs play a key role in thermal management of microsystems by providing efficient thermal pathways between surfaces. Vertically aligned carbon nanotubes (CNT) have been suggested as a potential material for such TIM applications due to the combination of their high thermal conductivity, which has been reported to reach over 3000 W/mK, and unique mechanical properties. However, due to the poor interaction between individual CNT strands and the contact surface, large contact resistances are commonly measured in these interfaces. One solution to this issue is to anchor the CNT by covalent bonding using chemical functionalization which allows phonon propagation through the interface. In this paper various chemical functionalization solutions from recent literature for CNT in TIM applications will be summarized. By comparing the results from these studies to other TIM systems, CNT array based TIM hold some promise with thermal interface resistance values reaching as low as 0.6mm2K/W. However, experimental results regarding the reliability of these solutions are still uncommon and should be a suitable area for further investigations.
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