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- Anisi, David A., 1977-
(författare)
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Online trajectory planning and observer based control
- 2006
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Licentiatavhandling (övrigt vetenskapligt/konstnärligt)abstract
- The main body of this thesis consists of four appended papers. The first two consider different aspects of the trajectory planning problem, while the last two deal with observer design for mobile robotic and Euler-Lagrange systems respectively. The first paper addresses the problem of designing a real time, high performance trajectory planner for aerial vehicles. The main contribution is two-fold. Firstly, by augmenting a novel safety maneuver at the end of the planned trajectory, this paper extends previous results by having provable safety properties in a 3D setting. Secondly, assuming initial feasibility, the planning method is shown to have finite time task completion. Moreover, in the second part of the paper, the problem of simultaneous arrival of multiple aerial vehicles is considered. By using a time-scale separation principle, one is able to adopt standard Laplacian control to this consensus problem, which is neither unconstrained, nor first order. Direct methods for trajectory optimization are traditionally based on a priori temporal discretization and collocation methods. In the second paper, the problem of adaptive node distribution is formulated as a constrained optimization problem, which is to be included in the underlying nonlinear mathematical programming problem. The benefits of utilizing the suggested method for online trajectory optimization are illustrated by a missile guidance example. In the third paper, the problem of active observer design for an important class of non-uniformly observable systems, namely mobile robotics systems, is considered. The set of feasible configurations and the set of output flow equivalent states are defined. It is shown that the inter-relation between these two sets may serve as the basis for design of active observers. The proposed observer design methodology is illustrated by considering a unicycle robot model, equipped with a set of range-measuring sensors. Finally, in the fourth paper, a geometrically intrinsic observer for Euler-Lagrange systems is defined and analyzed. This observer is a generalization of the observer recently proposed by Aghannan and Rouchon. Their contractivity result is reproduced and complemented by a proof that the region of contraction is infinitely thin. However, assuming a priori bounds on the velocities, convergence of the observer is shown by means of Lyapunov's direct method in the case of configuration manifolds with constant curvature.
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- Borregales, L. D., et al.
(författare)
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Response to Takahashi
- 2022
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Ingår i: Journal of the National Cancer Institute. - : Oxford University Press (OUP). - 1460-2105 .- 0027-8874. ; 114:11, s. 1557-1558
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Tidskriftsartikel (övrigt vetenskapligt/konstnärligt)
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- Hsu, Li-Han, 1981, et al.
(författare)
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Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
- 2010
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Ingår i: IEEE Transactions on Microwave Theory and Techniques. - 0018-9480 .- 1557-9670. ; 58:8, s. 2244-2250
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Tidskriftsartikel (övrigt vetenskapligt/konstnärligt)abstract
- This study demonstrates a flip-chip interconnect with epoxy-based underfill (epsilon(r) = 3.5 and tan delta = 0.02 at 10 MHz) for packaging applications up to V-band frequencies. To achieve the best interconnect performance, both the matching designs on GaAs chip and Al2O3 substrate were adopted with the underfill effects taken into consideration. The optimized flip-chip interconnect showed excellent performance from dc to 67 GHz with return loss below -20 dB and insertion loss less than 0.6 dB. Furthermore, the dielectric loss induced by the underfill was extracted from measurement and compared with the simulation results. The reliability tests including 85 degrees C/85 % relative humidity test, thermal cycling test, and shear force test were performed. For the first time, the S-parameters measurement was performed to check the flip-chip reliability, and no performance decay was observed after 1000 thermal cycles. Moreover, the mechanical strength was improved about 12 times after the underfill was applied. The results show that the proposed flip-chip architecture has excellent reliability and can be applied for commercial applications.
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