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Träfflista för sökning "WFRF:(Hu Zhili 1983) srt2:(2009);mspu:(conferencepaper)"

Search: WFRF:(Hu Zhili 1983) > (2009) > Conference paper

  • Result 1-3 of 3
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  • Nabiollahi, Nabi, 1983, et al. (author)
  • FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives
  • 2009
  • In: 2009 9th IEEE Conference on Nanotechnology, IEEE NANO 2009; Genoa; Italy; 26 July 2009 through 30 July 2009. - 9789810836948 ; , s. 422-425
  • Conference paper (peer-reviewed)abstract
    • A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction and heat transfer between two surfaces. The results show that the conductivity dependency is relatively high for different filler shape and alignment. Discussed models are bimodal, Ag flakes and Ag spherical micro particles and trimodal with Multi-WallCNT nano particles.
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  • Result 1-3 of 3
Type of publication
Type of content
peer-reviewed (3)
Author/Editor
Liu, Johan, 1960 (3)
Hu, Zhili, 1983 (3)
Yue, Cong (3)
Cheng, Zhaonian, 194 ... (2)
Zhang, Yan, 1976 (2)
Carlberg, Björn, 198 ... (1)
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Guo, Xingming (1)
Inoue, Masahiro (1)
Nabiollahi, Nabi, 19 ... (1)
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University
Chalmers University of Technology (3)
Language
English (3)
Research subject (UKÄ/SCB)
Engineering and Technology (3)
Year

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