| 1. |
- Fan, Q., et al.
(author)
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The effect of functionalized silver on properties of conductive adhesives
- 2011
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In: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 423-425
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Conference paper (peer-reviewed)abstract
- This research used low molecular surface modifiers and observed that chemisorptions took place through the formation of a bond between silver surface and an adsorbed molecule, which improved the dispersion of silver flakes in the organic resin. Results of shear viscosity, bulk resistivity etc. showed that by using these low molecular organic functionalizers, isotropic conductive adhesives (ICAs) with lower shear viscosity and better electrical conductivity at high silver fillers content were obtained. Different processing methods and different matrixes were compared.
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| 2. |
- Hu, Zhili, 1983, et al.
(author)
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Influence of substrate on electrical conductivity of isotropic conductive adhesive
- 2011
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In: Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011. - 1550-5723. - 9781467301480 ; , s. 330 - 335
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Conference paper (peer-reviewed)abstract
- Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.
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| 3. |
- Hu, Zhili, 1983, et al.
(author)
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Molecular Gun Composed of Carbon Nanotube
- 2011
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In: Journal of Computational and Theoretical Nanoscience. - : American Scientific Publishers. - 1546-1955 .- 1546-1963. ; 8:9, s. 1716-1719
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Journal article (peer-reviewed)abstract
- Using molecular simulation, this paper predicts that by bending one end of the outer carbon nanotube (CNT) of a double-wall CNT (DWCNT), the inner CNT could possibly be shot out with a speed of several 100 m/s, and a kinetic energy of several eV from either left or the right end of the outer CNT, depending on the length of inner CNT. Analysis in this paper suggests that the outer CNT is a supplier of the CNT bullet's kinetic energy and the bullet can be shot out only if the outer CNT buckles while the inner CNT does not. Noticeably, such molecular gun could be practical in experiment environment since the bending of a CNT could be obtained by applying external electrical field.
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| 4. |
- Zhang, Y., et al.
(author)
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Molecular dynamics simulation for the bonding energy of metal-SWNT interface
- 2011
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In: Proceedings - 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, 8-11 August 2011. - 9781457717680 ; , s. 506-509
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Conference paper (peer-reviewed)abstract
- For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.
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