| 1. |
- Li, Mengxiong, et al.
(författare)
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Highly Oriented Graphite Aerogel Fabricated by Confined Liquid-Phase Expansion for Anisotropically Thermally Conductive Epoxy Composites
- 2020
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 12:24, s. 27476-27484
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Tidskriftsartikel (refereegranskat)abstract
- Graphene-based thermally conductive polymer composites are of great importance for the removal of the excess heat generated by electronic devices. However, due to the orientation of graphene sheets in the polymer matrix, the through-plane thermal conductivity of polymer/graphene composites remains far from satisfactory. We here demonstrate a confined liquid-phase expansion strategy to fabricate highly oriented confined expanded graphite (CEG) aerogels. After being incorporated into epoxy resin (EP), the resulting EP/CEG composites exhibit a high through-plane thermal conductivity (4.14 ± 0.21 W m-1 K-1) at a quite low filler loading of 1.75 wt % (0.91 vol %), nearly 10 times higher than that of neat EP resin and 7.5 times higher than the in-plane thermal conductivity of the composite, indicating that the CEG aerogel has a high through-plane thermal conductivity enhancement efficiency that outperforms those of many graphite/graphene-based fillers. The facile preparation method holds great industrial application potential in fabricating anisotropic thermally conductive polymer composites.
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| 2. |
- Wang, Teng, 1983, et al.
(författare)
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Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive
- 2007
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Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 91:9
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Tidskriftsartikel (refereegranskat)abstract
- This letter demonstrates the transfer and formation of aligned carbon nanotube (CNT) arrays at low temperature by imprinted conductive adhesive. A thermoplastic isotropic conductive adhesive is patterned by an imprint and heat transfer process. The CNTs grown by thermal chemical vapor deposition are then transferred to another substrate by the conductive adhesive, forming predefined patterns. The current-voltage response of the transferred CNT bundles verifies that good electrical connection has been established. This process can enable the integration of CNTs into various temperature-sensitive processeses and materials.
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| 3. |
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| 4. |
- Manchili, Swathi Kiranmayee, 1987, et al.
(författare)
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Effect of Nanopowder Addition on the Sintering of Water-Atomized Iron Powder
- 2020
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Ingår i: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. - : Springer Science and Business Media LLC. - 1073-5623. ; 51:9, s. 4890-4901
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Tidskriftsartikel (refereegranskat)abstract
- A promising method of improving the densification of powder metallurgical steel components is to blend nanopowder with the otherwise typically used micrometre-sized powder. The higher surface-to-volume ratio of nanopowder is hypothesized to accelerate the sintering process and increase the inter-particle contact area between the powder particles. This is supposed to enhance the material transport and improve the densification. In the present investigation, water-atomized iron powder (− 45 μm) was mixed separately with pure iron and low-carbon steel nanopowder, each at a ratio of 95 to 5 pct. These powder mixes were compacted at different pressures (400, 600 and 800 MPa) and then sintered at 1350 °C in a pure hydrogen atmosphere. The sintering behavior of the powder blend compacts was compared to that of the compact with micrometre-sized powder only. Densification commenced at much lower temperatures in the presence of nanopowder. To understand this, sintering at intermittent temperatures such as 500 °C and 700 °C was conducted. The fracture surface revealed that the nanopowder was sintered at between 500 °C and 700 °C, which in turn contributed to the densification of the powder mix at the lower temperature range. Based on the sintering experiments, an attempt was made to calculate the activation energy and identify the associated sinter mechanism using two different approaches. It was shown that the first approach yielded values in agreement with the grain-boundary diffusion mechanism. As the nanopowder content increased, there was an increase in linear shrinkage during sintering.
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| 5. |
- Wang, Nan, et al.
(författare)
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Highly thermal conductive and electrically insulated graphene based thermal interface material with long-term reliability
- 2019
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Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; 2019-May, s. 1564-1568
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Konferensbidrag (refereegranskat)abstract
- High density packaging in combination with increased transistor integration inevitably leads to challenging power densities in terms of thermal management. The conventional TIMs that are widely used in the microelectronic industry today are experiencing more and more stress due to their limited thermal performance and poor reliability. Composed by particle laden polymer matrix, thermal conductivity (K) of conventional TIMs is generally limited to 5 W/mK, and such values can be even lower for electrically insulated TIMs. Conventional TIMs also suffer from severe pump-out and dry-out failures, which brought great threat to the performance and lifetime of the electronic devices. Here, we solve these problems by applying a novel highly thermal conductive, electrically insulated and reliable graphene based TIMs (I-GTs). Composed by vertical graphene structures, I-GTs provide a continuous heat pathway from top to bottom, which enables superfast heat dissipation at through-plane direction. The highest bulk through-plane thermal conductivity of the conductive body can reach up to 1000 W/mK, which is orders of magnitude higher than conventional TIMs, and even outperforms the pure indium TIMs by over ten times. The highly flexible and foldable nature of I-GT enables at least 100% compressibility upon small applied pressures. As excellent gap fillers, I-GT can provide complete physical contact between two surfaces and thereby minimize the contact resistance to heat flow. The measured minimum thermal resistance for I-GTs reaches about 30 Kmm2/W. Such values are significantly higher than the randomly dispersed composites presented above. To ensure fully electrical insulation, a smooth and soft adhesive layer with a thickness of few microns was coated on the surface of I-GT. The breakdown voltage of I-GT reaches up to 950 V. Thermal cycling test shows the highly stable nature of I-GT. The good compressibility and elasticity of I-GT ensures continued proper TIM contact with substrates, which counteracts the effect of internal stress induced by the mismatch of coefficient of thermal expansion (CTE) during temperature cycling. In addition, the I-GTs have the advantages of low density and good maintainability. The resulting I-GTs thus opens new opportunities for addressing large heat dissipation issues for form-factor driven electronics and other high power driven systems.
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| 6. |
- Zhang, Q., et al.
(författare)
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Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
- 2019
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Ingår i: Soldering and Surface Mount Technology. - 1758-6836 .- 0954-0911. ; 31:4, s. 193-202
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Tidskriftsartikel (refereegranskat)abstract
- © 2019, Emerald Publishing Limited. Purpose: This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated. Design/methodology/approach: Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively. Findings: Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles. Originality/value: Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.
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| 7. |
- Zhang, Yan, 1976, et al.
(författare)
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Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
- 2008
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Ingår i: Electrically Conductive Adhesives. - 9789004187825 ; 22:14, s. 1717-1731
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Bokkapitel (övrigt vetenskapligt/konstnärligt)abstract
- A conductive adhesive is a promising interconnection material for microsystem packaging. The interconnect features are of great importance to system responses under various loading conditions. The flip-chip packaging system with anisotropic conductive film (ACF) joint under thermal loadings has been investigated both experimentally and theoretically. The displacement distributions have been measured by an interferometer, which could provide the in-plane whole-field deformation observation. The interconnection is of much smaller scales compared with the neighbouring components such as the chip and substrate, and there are even finer internal structures involved in the joint. The wide scale range makes both experimental observation and conventional simulation difficult. A micropolar model is thus developed. Utilizing the homogenization, this model requires low computation resource. Combination of this model with a secondorder model was able to produce a highly efficient and valid prediction of the packaging system response under thermal and mechanical loadings. Comparison of the micropolar model simulation and experimental data shows good agreement.
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| 8. |
- Zhang, Yong, 1982, et al.
(författare)
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Transparent heaters based on CVD grown few-layer graphene
- 2022
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Ingår i: Journal of Materials Science: Materials in Electronics. - : Springer Science and Business Media LLC. - 1573-482X .- 0957-4522. ; 33:7, s. 3586-3594
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Tidskriftsartikel (refereegranskat)abstract
- The outstanding thermal and optical properties of graphene make it tremendously interesting as heating elements. In this work, we demonstrate few-layer graphene as heating elements on glass substrate by chemical vapor deposition (CVD) method combined with a layer-by-layer transfer process. The electrothermal performance was studied in terms of applied voltage, heating/cooling rate and input power density. The results show that a three-layer graphene film heater can reach an equilibrium temperature up to 102 °C and a maximum heating rate of 1.8 °C/s when 60 V voltage was applied. Simulations were further performed to rationalize the experimental results, in which the effect of heat transfer coefficient, electric conductivity, and the effective stress distribution was discussed. It was found that the adhesion between graphene and substrate is very important for the heat performance, especially at high temperatures. Our results indicate that graphene-based films are promising candidate materials for the next generation of transparent heating elements.
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| 9. |
- Liu, Ya, 1991, et al.
(författare)
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Graphene based thermal management system for battery cooling in electric vehicles
- 2020
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Ingår i: Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020.
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Konferensbidrag (refereegranskat)abstract
- In this work, a graphene assembled film integrated heat sink and water cooling technology was used to build an experimental set-up of a thermal management system to demonstrate the possibility to achieve efficient cooling of the propulsion battery in electric vehicles. The experimental results showed that the temperature decrease of a Li-ion battery module can reach 11°C and 9 °C under discharge rates as of 2C and 1C, respectively. The calculated thermal resistance of the graphene based cooling system is about 76% of a similar copper based cooling system. Surface modification was carried out on the graphene sheet to achieve a reliable bonding between the graphene sheet and the battery cell surface. This work provides a proof of concept of a new highly efficient approach for electric vehicle battery thermal management using the light-weight material graphene.
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| 10. |
- Zhang, Xia, 1980, et al.
(författare)
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Design of Printed Monopole Antennas on Liquid Crystal Polymer Substrates
- 2010
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Ingår i: Journal of Infrared, Millimeter, and Terahertz Waves. - : Springer Science and Business Media LLC. - 1866-6892 .- 1866-6906. ; 31:4, s. 469-480
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Tidskriftsartikel (refereegranskat)abstract
- In this paper, a compact printed monopole antenna with an extremely wide bandwidth has been realized on Liquid Crystal Polymer (LCP) substrates by using standard processing technology. Both laminated and directed metalized LCP substrates were used in this experiment. The antenna made on the direct metalized LCP substrate performed well compared to on the laminated LCP substrate. To improve the adhesion, the surface of the LCP was further roughened and a certain adhesion layer was used prior to the deposition of Cu. The measured antenna on a metalized LCP substrate could cover this frequency band with an impedance bandwidth from 0.51 GHz to 14.4 GHz (28.2:1) for VSWRa parts per thousand currency sign2. Moreover, the antenna exhibits a nearly omni-directional radiation pattern. The size of this antenna is only about 0.18 lambda(1) x 0.13 lambda(1), where lambda(1) is the wavelength of the lowest operating frequency. The results show that LCP is a promising candidate for high frequency applications.
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