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Träfflista för sökning "WFRF:(Liu Johan 1960) ;pers:(Cheng Zhaonian 1942)"

Sökning: WFRF:(Liu Johan 1960) > Cheng Zhaonian 1942

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  • Chen, Liu, 1973, et al. (författare)
  • Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
  • 2006
  • Ingår i: Journal of Electronic Packaging, Transactions of the ASME. - : ASME International. - 1528-9044 .- 1043-7398. ; 128:3, s. 177-183
  • Tidskriftsartikel (refereegranskat)abstract
    • Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM) simulation. Viscoelastic models for adhesives and underfill materials were employed, and the comparison with an elastic model was made. Calculated equivalent stresses S eqv and shear stress σ xy fitted well with the experimental lifetime measurement, thus a lifetime relationship similar to the Coffin-Manson formula was established to predict the thermal fatigue life of an encapsulated ICA flip chip. Furthermore, the influences of underfill properties on the ICA reliability were discussed. Copyright © 2006 by ASME.
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  • Zhang, Yan, 1976, et al. (författare)
  • Homogenization Model Based on Micropolar Theory for the Interconnection Layer in Microsystem Packaging
  • 2006
  • Ingår i: Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06). - 1424404886 ; , s. 166-170
  • Konferensbidrag (refereegranskat)abstract
    • The increase in microsystem packaging density sets the requiement for component sizes in the system to become smaller and smaller. The scale decrease makes the analysis more complicated as the corresponding resolution should be improved to a great extent. Interconnection in the system is a typical interface structure that widely appear in the packaing system, in which periodic microstructures may be included inside. A homogenization model is developed in this paper, which focuses on the interface behavior. The interface model based on micropolar theory provides a natural way to include the characteristic scale that can reflect the size effect of the considered structure. Computations are carried out as the numerical example of the model, and comparisons of this model with those of the convertional method show its validity and efficiency.
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  • Bailey, C., et al. (författare)
  • Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint
  • 2006
  • Ingår i: Soldering and Surface Mount Technology. - : Emerald. - 1758-6836 .- 0954-0911. ; 18:2, s. 4-11
  • Tidskriftsartikel (refereegranskat)abstract
    • Purpose To determine the Coffin-Manson (CM) equation constants for fatigue life estimation of Sn-8Zn-3Bi solder joints, since Sn-8Zn-3Bi solder has a melting temperature of around 199°C which is close to that of the conventional Sn-Pb solder which has previously been used in the electronics assembly industry. Design/methodology/approach Three dimensional finite element (FE) simulation analysis was used for comparison with the experimentally measured data and to determine the CM constants. Low cycle fatigue tests and FE simulations were carried out for these lead-free solder joints, and eutectic Sn-37Pb solder was used as a reference. Findings The CM equation for Sn-8Zn-3Bi solder joints was fitted to the lifetimes measured and the shear strains simulated. The constants were determined to be 0.0294 for C, the proportional constant, and for the fatigue exponent, β, −2.833. Originality/value The CM equation can now be used to predict the reliability of Sn-8Zn-3Bi solder joints in electronics assembly and the knowledge base for the properties of the Sn-Zn solder system has been increased.
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  • Resultat 1-10 av 37

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