| 1. |
- Fałat, T., et al.
(author)
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Experimental results versus numerical simulations of In/Cu intermetallic compounds growth
- 2014
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In: Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Marina Bay Sands, Singapore, 3-5 December 2014. - 9781479969944 ; , s. 797-800
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Conference paper (peer-reviewed)abstract
- Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the parabolic low, which indicates that the growth was mainly controlled by volume diffusion.
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| 2. |
- Hansson, Josef, 1991, et al.
(author)
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Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications
- 2016
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In: 2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano). - 9781509014934 ; , s. 371-374
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Conference paper (peer-reviewed)abstract
- Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at the interface between two materials, greatly increasing the thermal conductance when solid surface are attached together. The last decade has provided significant development on high-performing TIMs, and this paper makes a summarized review on recent progress on the topic. Current state of the art commercial TIM types are presented, and discussed in regards to their advantages and disadvantages. Two main categories of TIMs with high interest are then reviewed: continuous metal phase TIMs and carbon nanotube array TIMs.
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| 3. |
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| 4. |
- Liu, Johan, 1960, et al.
(author)
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1. Thermal Characterization of Power Devices Using Graphene-based Film
- 2014
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In: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781479924073 ; , s. 459 - 463
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Conference paper (peer-reviewed)abstract
- Due to its atomic structure with sp2 hybrid orbitals and unique electronic properties, graphene has an extraordinarily high thermal conductivity which has been reported to be up to 5000 W/mK. As a consequence, the use of graphene-based materials for thermal management has been subject to substantial attention during recent years in both academia and industry. In this paper, the development of a new type of graphene-based thin film for heat dissipation in power devices is presented. The surface of the developed graphene based film is primarily composed of functionalized graphene oxide, that can be bonded chemically to the device surface and thus minimize the interface thermal resistance caused by surface roughness. A very high in-plane thermal conductivity with a maximum value of 1600 W/mK was detected by laser flash machine regarding to the graphene-based films. To investigate the structure of the graphene-based films, scanning electron microscopy (SEM) and raman spectroscopy were carried out. Finally, LED demonstrators were built to illustrate the thermal performance of graphene-based film and the functional layers. IR camera recorded a 5°C lower temperature of a LED demonstrator with SHT G1000 as the binding layer instead of a commercial thermal conductive adhesive.
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| 5. |
- Liu, Johan, 1960, et al.
(author)
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A new solder matrix nano polymer composite for thermal management and die attach applications
- 2014
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In: Composites Science and Technology. - 0266-3538. ; 94, s. 54-61
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Journal article (peer-reviewed)abstract
- The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupling and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn–Ag–Cu matrix into a silver nanoparticle coated electrospun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn–Ag–Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications.
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| 6. |
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| 7. |
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| 8. |
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| 9. |
- Luo, Xin, 1983, et al.
(author)
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Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications
- 2014
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In: Journal of Materials Science: Materials in Electronics. - 1573-482X .- 0957-4522. ; 25:5, s. 2333-2338
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Journal article (peer-reviewed)abstract
- With increased power density and continued miniaturization, effective thermal dissipation is of significant importance for operational lifetime and reliability of electronic system. Advanced thermal interface materials (TIMs) with excellent thermal performance need to be designed and developed. Here we report novel TIMs consisted of boron nitride (BN) nanofibers and pure indium (In) solder for heat dissipation applications. The BN nanofibers are fabricated by electrospinning process and nitridation treatment. After surface metallization by sputtering, the porous BN film is infiltrated with liquid indium by squeeze casting to form the final solid composites. The new composites show the in-plane and through-plane thermal conductivity respectively of 60 and 20 W/m K. The direction dependence thermal properties of the TIM are due to the anisotropic thermal performance of BN nanofibers in the composite. A low thermal contact resistance of 0.2 K mm2/W is also achieved at the interface between this new composite and copper substrate. These competent thermal properties demonstrate the great potential of the BN–In TIMs in thermal management for electronic system.
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| 10. |
- Luo, Xin, 1983, et al.
(author)
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Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications
- 2014
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In: Journal of Materials Science: Materials in Electronics. - : Springer Science and Business Media LLC. - 1573-482X .- 0957-4522. ; 25:5, s. 2333-2338
-
Journal article (peer-reviewed)abstract
- With increased power density and continued miniaturization, effective thermal dissipation is of significant importance for operational lifetime and reliability of electronic system. Advanced thermal interface materials (TIMs) with excellent thermal performance need to be designed and developed. Here we report novel TIMs consisted of boron nitride (BN) nanofibers and pure indium (In) solder for heat dissipation applications. The BN nanofibers are fabricated by electrospinning process and nitridation treatment. After surface metallization by sputtering, the porous BN film is infiltrated with liquid indium by squeeze casting to form the final solid composites. The new composites show the in-plane and through-plane thermal conductivity respectively of 60 and 20 W/m K. The direction dependence thermal properties of the TIM are due to the anisotropic thermal performance of BN nanofibers in the composite. A low thermal contact resistance of 0.2 K mm(2)/W is also achieved at the interface between this new composite and copper substrate. These competent thermal properties demonstrate the great potential of the BN-In TIMs in thermal management for electronic system.
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