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- Chen, Liu, 1973, et al.
(författare)
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Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
- 2006
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Ingår i: Journal of Electronic Packaging, Transactions of the ASME. - : ASME International. - 1528-9044 .- 1043-7398. ; 128:3, s. 177-183
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Tidskriftsartikel (refereegranskat)abstract
- Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM) simulation. Viscoelastic models for adhesives and underfill materials were employed, and the comparison with an elastic model was made. Calculated equivalent stresses S eqv and shear stress σ xy fitted well with the experimental lifetime measurement, thus a lifetime relationship similar to the Coffin-Manson formula was established to predict the thermal fatigue life of an encapsulated ICA flip chip. Furthermore, the influences of underfill properties on the ICA reliability were discussed. Copyright © 2006 by ASME.
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- Wang, Teng, 1983, et al.
(författare)
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Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive
- 2007
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Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 91:9
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Tidskriftsartikel (refereegranskat)abstract
- This letter demonstrates the transfer and formation of aligned carbon nanotube (CNT) arrays at low temperature by imprinted conductive adhesive. A thermoplastic isotropic conductive adhesive is patterned by an imprint and heat transfer process. The CNTs grown by thermal chemical vapor deposition are then transferred to another substrate by the conductive adhesive, forming predefined patterns. The current-voltage response of the transferred CNT bundles verifies that good electrical connection has been established. This process can enable the integration of CNTs into various temperature-sensitive processeses and materials.
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- Wang, Teng, 1983, et al.
(författare)
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Through silicon vias filled with planarized carbon nanotube bundles
- 2009
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Ingår i: Nanotechnology. - : IOP Publishing. - 0957-4484 .- 1361-6528. ; 20:48
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Tidskriftsartikel (refereegranskat)abstract
- The feasibility of using carbon nanotube (CNT) bundles as the fillers of through silicon vias (TSVs) has been demonstrated. CNT bundles are synthesized directly inside TSVs by thermal chemical vapor deposition (TCVD). The growth of CNTs in vias is found to be highly dependent on the geometric dimensions and arrangement patterns of the vias at atmospheric pressure. The CNT-Si structure is planarized by a combined lapping and polishing process to achieve both a high removal rate and a fine surface finish. Electrical tests of the CNT TSVs have been performed and their electrical resistance was found to be in the few hundred ohms range. The reasons for the high electrical resistance have been discussed and possible methods to decrease the electrical resistance have been proposed.
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- Zhang, Yan, 1976, et al.
(författare)
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Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load
- 2008
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Ingår i: Journal of Electronic Packaging, Transactions of the ASME. - : ASME International. - 1528-9044 .- 1043-7398. ; 130:2, s. 0210101-0210107
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Tidskriftsartikel (refereegranskat)abstract
- A plastic ball grid array component interconnect has been experimentally investigated and modeled on the basis of micropolar theory. The experimental results were analyzed, and the data also provided the verification for the micropolar interface model. Two different interconnect cross sections, namely, one near the component boundary and the other in the center region beneath the chip, have been measured. The effects of thermal cycling on the interconnect deformation have been considered. The deformation fields, due to the mismatch of the material properties of the constituents in the assembly system, have been observed by means of a multifunction macro-micro-moiré interferometer, whereby the displacement distributions have been obtained and analyzed for the different specimens. The interconnect layer is usually of smaller size as compared to the neighboring component, and there are even finer internal structures included in the interconnect. The scale difference makes conventional methods time consuming and of low efficiency. An interface model based on the micropolar theory has been developed, cf. Zhang, Y., and Larsson, R., 2007, "Interface Modelling of ACA Flip-Chip Interconnects Using Micropolar Theory and Discontinuous Approximation," Comput. Struct., 85, pp. 1500-1513, Larsson, R., and Zhang, Y., 2007, "Homogenization of Microsystem Interconnects Based on Micropolar Theory and Discontinuous Kinematics, " J. Mech. Phys. Solids, 55, pp. 819-841, aiming at predicting the interconnect behavior under thermal load, especially when there exist internal structures in the interface and the component/ structure sizes vary in a wide range. Numerical simulations, using the micropolar interface model, show a fairly good agreement between the experimental data and the numerical simulations.
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