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- Andersson, Cristina, 1969, et al.
(författare)
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Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
- 2006
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Ingår i: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany. - 9781424405527 ; 1, s. 152-160
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Konferensbidrag (refereegranskat)abstract
- The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224°C. The tensile behavior of the eutectic Sn-0.4Co-0.7Cu bulk samples was studied under three different conditions of strain rates (10 -6 , 10 -4 and 10 -3 /s) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu alloys. The evaluation of the tensile results showed that the effect of strain rate played an important roll on the tensile properties of these alloys, and it is clearly observed that the tensile strength increases as the strain rate increases. Furthermore, Sn-4.0Ag-0.5Cu alloy shows better Ultimate Tensile Strength (UTS) followed by Sn-37P and Sn-0.4Co-0.7Cu system. © 2006 IEEE.
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- Liu, Johan, 1960, et al.
(författare)
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Stem Cell Growth and Migration on Nanofibrous Polymer Scaffolds and Micro-Fluidic Channels on Silicon-Chip
- 2009
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Ingår i: Proceedings of the 2009 Electronic Components and Technology Conference. - 0569-5503. - 9781424444762 ; , s. 1080-1085
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Konferensbidrag (refereegranskat)abstract
- Stem cell growth and migration on nanofibrous scaffolds and micro-fluidic channels on Silicon-Chip were studied by using neural stem cells isolated from adult rats' brain. Electrospinning and lithographic technique were used for developing nanofibrous-polylactic acid (PLA) and polyurethane (PU) based-scaffolds and micro-fluidic channels on Si-Chips respectively. Immunocytochemical and morphological analysis showed better cell-matrix interaction with profound adhesion, proliferation and migration on the developed scaffolds. Cell culture assay with microfluidic channel revealed the ability of developed channel system in guiding neuronal stem cell growth towards specified directions. These studies extend the possibility of using developed nanofibrous scaffolds and micro-fluidic channel system for future electrical signal transmission based on living neural stem cells.
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- Wang, Teng, 1983, et al.
(författare)
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Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
- 2006
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Ingår i: 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 9781424405527 ; 2, s. 892-895
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Konferensbidrag (refereegranskat)abstract
- Since 1991, carbon nanotubes have been considered for successful applications in various fields due to their unique properties. In the present work, carbon nanotubes are applied in integrated circuit packaging, as the bump interconnection for flip chip. The reason for choosing carbon nanotubes as the bump material is their special electrical, mechanical and thermal properties, which may promote both the performance and reliability of the flip chip packaging. Moreover, carbon nanotubes can be formed according to a precisely predefined small-scale pattern, which makes extremely high density interconnection possible. Vertically aligned carbon nanotubes are grown on silicon in the form of square arrays of different sizes, heights and pitches. Attempts to use thermal compression and anisotropic conductive adhesive to bond chips carrying carbon nanotube bumps with ceramic substrates are also executed. Mechanical testing is performed afterward to determine the strength of the bonding interfaces. The strength of the bonding by thermal compression is very weak, in the range from 1.9 to 7.0 g/mm2. The bonding by anisotropic conductive adhesive is much stronger, indicating a possible approach to bond chips carrying carbon nanotube bumps.
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