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Träfflista för sökning "WFRF:(Liu Johan 1960) srt2:(2005-2009);pers:(Campbell Eleanor E B 1960)"

Sökning: WFRF:(Liu Johan 1960) > (2005-2009) > Campbell Eleanor E B 1960

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1.
  • Wang, Teng, 1983, et al. (författare)
  • Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
  • 2006
  • Ingår i: 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 9781424405527 ; 2, s. 892-895
  • Konferensbidrag (refereegranskat)abstract
    • Since 1991, carbon nanotubes have been considered for successful applications in various fields due to their unique properties. In the present work, carbon nanotubes are applied in integrated circuit packaging, as the bump interconnection for flip chip. The reason for choosing carbon nanotubes as the bump material is their special electrical, mechanical and thermal properties, which may promote both the performance and reliability of the flip chip packaging. Moreover, carbon nanotubes can be formed according to a precisely predefined small-scale pattern, which makes extremely high density interconnection possible. Vertically aligned carbon nanotubes are grown on silicon in the form of square arrays of different sizes, heights and pitches. Attempts to use thermal compression and anisotropic conductive adhesive to bond chips carrying carbon nanotube bumps with ceramic substrates are also executed. Mechanical testing is performed afterward to determine the strength of the bonding interfaces. The strength of the bonding by thermal compression is very weak, in the range from 1.9 to 7.0 g/mm2. The bonding by anisotropic conductive adhesive is much stronger, indicating a possible approach to bond chips carrying carbon nanotube bumps.
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2.
  • Wang, Teng, 1983, et al. (författare)
  • Low temperature transfer and formation of carbon nanotube arrays by imprinted conductive adhesive
  • 2007
  • Ingår i: Applied Physics Letters. - : AIP Publishing. - 0003-6951 .- 1077-3118. ; 91:9
  • Tidskriftsartikel (refereegranskat)abstract
    • This letter demonstrates the transfer and formation of aligned carbon nanotube (CNT) arrays at low temperature by imprinted conductive adhesive. A thermoplastic isotropic conductive adhesive is patterned by an imprint and heat transfer process. The CNTs grown by thermal chemical vapor deposition are then transferred to another substrate by the conductive adhesive, forming predefined patterns. The current-voltage response of the transferred CNT bundles verifies that good electrical connection has been established. This process can enable the integration of CNTs into various temperature-sensitive processeses and materials.
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3.
  • Wang, Teng, 1983, et al. (författare)
  • Through silicon vias filled with planarized carbon nanotube bundles
  • 2009
  • Ingår i: Nanotechnology. - : IOP Publishing. - 0957-4484 .- 1361-6528. ; 20:48
  • Tidskriftsartikel (refereegranskat)abstract
    • The feasibility of using carbon nanotube (CNT) bundles as the fillers of through silicon vias (TSVs) has been demonstrated. CNT bundles are synthesized directly inside TSVs by thermal chemical vapor deposition (TCVD). The growth of CNTs in vias is found to be highly dependent on the geometric dimensions and arrangement patterns of the vias at atmospheric pressure. The CNT-Si structure is planarized by a combined lapping and polishing process to achieve both a high removal rate and a fine surface finish. Electrical tests of the CNT TSVs have been performed and their electrical resistance was found to be in the few hundred ohms range. The reasons for the high electrical resistance have been discussed and possible methods to decrease the electrical resistance have been proposed.
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