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- Zhang, Yan, 1976, et al.
(författare)
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Experimental and Numerical Investigations on the Performance and Reliability of CNT Fins for Micro-Cooler
- 2012
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Ingår i: Proceedings of IEEE CPMT 2012 International Conference on Electronic Packaging Technology & High Density Packaging. - 9781467316804 ; , s. 1573-1577
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Konferensbidrag (refereegranskat)abstract
- The current development of electronic products towards miniaturization and multifunction is leading to an increase in the power density of chip and IC. The high power consumption and corresponding heat dissipation are two of the most serious limitations for high performance electronics. The combination of the carbon nanotube (CNT) with outstanding thermal properties with an air jet cooling provides a promising option for the heat dissipation of high-powered components and devices. In the present paper, the CNTs are utilized to manufacture the pin-fins for the micro-cooler, and the performance and evaluation of this CNT-based micro-pin-fin cooler are investigated both experimentally and numerically. The effects of various parameters, such as the jet velocity and height, the fin size and shape, and so on, on the flow field and temperature distribution characteristics are comprehensively considered and analyzed. The obtained results indicate that the CNT-fins are of quite good strength and thermal performance in the jet impingement cooling environment. © 2012 IEEE.
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| 2. |
- Zhang, Y., et al.
(författare)
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Experimental measurements for mechanical and electrical conductive properties of CNT bundles
- 2013
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Ingår i: 6th International Conference on Nonlinear Mechanics, ICNM 2013; Shanghai; China; 12 August 2013 through 15 August 2013. - 9781605951096 ; , s. 454-457
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Konferensbidrag (refereegranskat)abstract
- With the miniaturization and multifunction trend in consumer electronics and other numerous applications, the characteristic sizes of chips, components and devices become smaller and smaller while the power dissipation and the associated heat flux density increase constantly. Carbon nanotube (CNT) has become a promising material due to its mechanical and conductive properties. In this paper, the CNT bundles on silicon chip have been experimentally investigated with respect to both the mechanical behavior under loading and the electrical conductivity as flip-chip interconnects.
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| 3. |
- Zhang, Y., et al.
(författare)
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Study on the bimodal filler influence on the effective thermal conductivity of thermal conductive adhesive
- 2011
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Ingår i: Microsystem Technologies. - : Springer Science and Business Media LLC. - 0946-7076 .- 1432-1858. ; 17:1, s. 93-99
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Tidskriftsartikel (refereegranskat)abstract
- The thermal management for electronics systems becomes more crucial to the overall system performance as the packaging density becomes much higher and the IC power increases at the same time. Thermal conductive adhesives (TCAs) have been widely adopted in electronics systems. As an epoxy matrix with conductive fillers, it is essential to figure out the effective thermal conductivity of this composite material. In the present paper, a parameterized cubic cell model (CCM) is developed and then implemented by the finite element method to investigate the effects of the bimodal fillers on the effective thermal conductivity. In addition, a series of bimodal TCA samples are prepared and the thermal conductivities in the in-plane and vertical directions are measured experimentally. An obvious anisotropy with respect to the thermal conductivities has been observed for the bimodal filler loading under consideration. A good agreement between the numerical results and the experimental data is obtained.
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