| 2. |
- Hu, Zhili, 1983, et al.
(författare)
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Molecular Gun Composed of Carbon Nanotube
- 2011
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Ingår i: Journal of Computational and Theoretical Nanoscience. - : American Scientific Publishers. - 1546-1955 .- 1546-1963. ; 8:9, s. 1716-1719
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Tidskriftsartikel (refereegranskat)abstract
- Using molecular simulation, this paper predicts that by bending one end of the outer carbon nanotube (CNT) of a double-wall CNT (DWCNT), the inner CNT could possibly be shot out with a speed of several 100 m/s, and a kinetic energy of several eV from either left or the right end of the outer CNT, depending on the length of inner CNT. Analysis in this paper suggests that the outer CNT is a supplier of the CNT bullet's kinetic energy and the bullet can be shot out only if the outer CNT buckles while the inner CNT does not. Noticeably, such molecular gun could be practical in experiment environment since the bending of a CNT could be obtained by applying external electrical field.
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| 3. |
- Hu, Zhili, 1983, et al.
(författare)
-
The effect of modulus on the performance of thermal conductive adhesives
- 2010
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Ingår i: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010. - 9781424481422 ; :Article number 5582884, s. 648-651
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Konferensbidrag (refereegranskat)abstract
- By analyzing the effect of modulus of epoxy and modulus of filler particles on the thermal conductivity of thermal conductive adhesives (TCA), this paper concludes, in contrast to intuition, that the stiffer epoxy will generate a larger contact area, and the "soft" epoxy with modulus of 0.5GPa will create the largest contact area, hence the highest thermal conductivity. Therefore, it is advisable to adopt softer epoxy in TCA. On the other hand, this paper finds that if the shrinkage of epoxy is low, i.e. 1% linear shrinkage, fillers composed of a mixture of Ag flakes and certain high stiffness material will cause a higher thermal conductivity, i.e. 7% larger than that of pure Ag fillers. This suggests that with low shrinkage epoxy, it is advisable to mix Ag flakes with high stiffness particles, e.g. Diamond or SiC. However, when linear shrinkage of epoxy is high, i.e. 3%, the highest thermal conductivity is achieved by using pure Ag fillers. Therefore, in such cases it is not advisable to use Bi-model. © 2010 IEEE.
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