SwePub
Sök i SwePub databas

  Utökad sökning

Träfflista för sökning "WFRF:(Liu Johan 1960) srt2:(2010-2014);pers:(Wang Ling)"

Sökning: WFRF:(Liu Johan 1960) > (2010-2014) > Wang Ling

  • Resultat 1-3 av 3
Sortera/gruppera träfflistan
   
NumreringReferensOmslagsbildHitta
1.
  •  
2.
  • Huang, Shirong, et al. (författare)
  • Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology
  • 2013
  • Ingår i: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013). - 9781479928330 ; , s. 347-352
  • Konferensbidrag (refereegranskat)abstract
    • Monolayer graphene was synthesized through thermal chemical vapor deposition (TCVD) as heat spreader for chip cooling. Platinum (Pt) serpentine functioned as hot spot on the thermal testing chip. The thermal testing chip with monolayer graphene film attached was bonded using flip-chip technology. The temperature at the hot spot with a monolayer graphene film as heat spreader was decreased by about 12°C and had a more uniform temperature compared to those without graphene heat spreader when driven by a heat flux of about 640W/cm 2 . Further improvements to the cooling performance of graphene heat spreader could be made by optimizing the synthesis parameters and transfer process of graphene films. © 2013 IEEE.
  •  
3.
  • Zhang, Yan, 1976, et al. (författare)
  • Experimental Study on the Mechanical Reliability of Carbon Nanotubes
  • 2013
  • Ingår i: Proceedings of the 14 th International Conference on Electronics Packaging (ICEPT). - 9781479904990 ; , s. 105-108
  • Konferensbidrag (refereegranskat)abstract
    • Robust and reliable interconnect and effective heat management are two major concerns in the high-speed and high-power integrated circuit. Carbon nanotube (CNT) exhibits amazing mechanical, thermal and electronic properties due to the unique structure. Those superior features make CNTs preferable and promising for application in electronic components and devices. In the present paper, carbon nanotube bundles with an array pattern are fabricated, and then their mechanical strength and reliability are investigated experimentally. Different pressure loadings are applied on the surfaces of the CNT bundles and their deformation during loading process are observed. Furthermore, the responses of the CNT bundles under airflow impingement are studied. Various damage modes occur in the different loading conditions.
  •  
Skapa referenser, mejla, bekava och länka
  • Resultat 1-3 av 3
Typ av publikation
konferensbidrag (3)
Typ av innehåll
refereegranskat (3)
Författare/redaktör
Liu, Johan, 1960 (3)
Sun, Shuangxi, 1986 (2)
Fu, Yifeng, 1984 (2)
Huang, Shirong (2)
Zhang, Yong, 1982 (2)
visa fler...
Fan, X. (2)
Zhang, Yan, 1976 (2)
Zhang, Yan (1)
Fan, Jingyu (1)
visa färre...
Lärosäte
Chalmers tekniska högskola (3)
Språk
Engelska (3)
Forskningsämne (UKÄ/SCB)
Teknik (3)
År

Kungliga biblioteket hanterar dina personuppgifter i enlighet med EU:s dataskyddsförordning (2018), GDPR. Läs mer om hur det funkar här.
Så här hanterar KB dina uppgifter vid användning av denna tjänst.

 
pil uppåt Stäng

Kopiera och spara länken för att återkomma till aktuell vy