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Träfflista för sökning "WFRF:(Liu Johan 1960) srt2:(2010-2014);pers:(Yuan Zhichao)"

Sökning: WFRF:(Liu Johan 1960) > (2010-2014) > Yuan Zhichao

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1.
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2.
  • Hu, Zhili, 1983, et al. (författare)
  • Influence of substrate on electrical conductivity of isotropic conductive adhesive
  • 2011
  • Ingår i: Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011. - 1550-5723. - 9781467301480 ; , s. 330 - 335
  • Konferensbidrag (refereegranskat)abstract
    • Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.
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3.
  • Li, Dongsheng, et al. (författare)
  • A highly conductive bimodal isotropic conductive adhesive and its reliability
  • 2011
  • Ingår i: ECS Transactions. ; 34:1, s. 583 - 588
  • Konferensbidrag (refereegranskat)abstract
    • In this paper, micro silver flakes and micro spherical particles were incorporated into the matrix resin of isotropic conductive adhesives (ICAs). Their electrical properties were investigated. The total weight ratio of silver fillers was kept at 75 wt% for all samples. When the content of micro spherical particles was 8 wt%, the bulk resistivity of the bimodal ICAs reduced dramatically to as low as 1.26×10-4 Ω.cm and its viscosity was 24,289 cP under 5rpm at 25°. Scanning electronic microscopy (SEM) images of the bimodal ICAs showed silver fillers well distributed in the matrix resin. In addition, the lap shear strength of different metal surfaces, and the bulk resistivity shifts during aging time under85°/85% RH for more than 500 hours were also measured. The results showed that bulk resistivity shifts of bimodal ICAs remained stable after further cured and the bond strength on the copper surface was the greatest among the three metal surfaces tested.
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4.
  • Tang, X., et al. (författare)
  • Development and characterisation of nanofiber films with high adhesion
  • 2011
  • Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; , s. 673-677
  • Konferensbidrag (refereegranskat)abstract
    • With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronic packaging. This paper reports the study on fabrication of a nanofiber films used for nano-thermal interface material (nano-TIM) with the adhesive function. The nano-TIM with high thermal conductivity and low thermal resistivity has been fabricated by electrospinning process. In the present work, hotmelt was added into the electrospinning solution to improve the adhesion properties of the film. The morphology of the film was observed by Scanning Electrical Microscope (SEM). The nanofiber films have a nano-scale structure with hotmelt randomly attached into the fiber matrix. Shear tests were conducted to measure the bonding strength of nanofiber films. The results show that the nanofiber films reached a 6.52 MPa in terms of average shear strength, more than 2 times better than the case without the hotmelt addition. © 2011 IEEE.
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  • Resultat 1-4 av 4
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konferensbidrag (4)
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refereegranskat (4)
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Liu, Johan, 1960 (4)
Ye, Lilei (3)
Chen, Si, 1981 (2)
Du, Wenhui (2)
Cui, Huiwang (2)
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Tang, X. (1)
Lu, Xiuzhen (1)
Ye, L (1)
Fan, Q (1)
Cui, H (1)
Hu, Zhili, 1983 (1)
Yue, Cong (1)
Li, Dongsheng (1)
Fan, Qiong (1)
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Chalmers tekniska högskola (4)
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