| 1. |
- Fałat, T., et al.
(författare)
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Experimental results versus numerical simulations of In/Cu intermetallic compounds growth
- 2014
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Ingår i: Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Marina Bay Sands, Singapore, 3-5 December 2014. - 9781479969944 ; , s. 797-800
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Konferensbidrag (refereegranskat)abstract
- Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the parabolic low, which indicates that the growth was mainly controlled by volume diffusion.
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| 2. |
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| 3. |
- Liu, Johan, 1960, et al.
(författare)
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1. Thermal Characterization of Power Devices Using Graphene-based Film
- 2014
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Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781479924073 ; , s. 459 - 463
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Konferensbidrag (refereegranskat)abstract
- Due to its atomic structure with sp2 hybrid orbitals and unique electronic properties, graphene has an extraordinarily high thermal conductivity which has been reported to be up to 5000 W/mK. As a consequence, the use of graphene-based materials for thermal management has been subject to substantial attention during recent years in both academia and industry. In this paper, the development of a new type of graphene-based thin film for heat dissipation in power devices is presented. The surface of the developed graphene based film is primarily composed of functionalized graphene oxide, that can be bonded chemically to the device surface and thus minimize the interface thermal resistance caused by surface roughness. A very high in-plane thermal conductivity with a maximum value of 1600 W/mK was detected by laser flash machine regarding to the graphene-based films. To investigate the structure of the graphene-based films, scanning electron microscopy (SEM) and raman spectroscopy were carried out. Finally, LED demonstrators were built to illustrate the thermal performance of graphene-based film and the functional layers. IR camera recorded a 5°C lower temperature of a LED demonstrator with SHT G1000 as the binding layer instead of a commercial thermal conductive adhesive.
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| 4. |
- Liu, Johan, 1960, et al.
(författare)
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A new solder matrix nano polymer composite for thermal management and die attach applications
- 2014
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Ingår i: Composites Science and Technology. - 0266-3538. ; 94, s. 54-61
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Tidskriftsartikel (refereegranskat)abstract
- The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupling and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn–Ag–Cu matrix into a silver nanoparticle coated electrospun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn–Ag–Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications.
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| 5. |
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| 6. |
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| 7. |
- Luo, Xin, 1983, et al.
(författare)
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Boron nitride nanofiber and indium composite based thermal interface materials for electronics heat dissipation applications
- 2014
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Ingår i: Journal of Materials Science: Materials in Electronics. - 1573-482X .- 0957-4522. ; 25:5, s. 2333-2338
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Tidskriftsartikel (refereegranskat)abstract
- With increased power density and continued miniaturization, effective thermal dissipation is of significant importance for operational lifetime and reliability of electronic system. Advanced thermal interface materials (TIMs) with excellent thermal performance need to be designed and developed. Here we report novel TIMs consisted of boron nitride (BN) nanofibers and pure indium (In) solder for heat dissipation applications. The BN nanofibers are fabricated by electrospinning process and nitridation treatment. After surface metallization by sputtering, the porous BN film is infiltrated with liquid indium by squeeze casting to form the final solid composites. The new composites show the in-plane and through-plane thermal conductivity respectively of 60 and 20 W/m K. The direction dependence thermal properties of the TIM are due to the anisotropic thermal performance of BN nanofibers in the composite. A low thermal contact resistance of 0.2 K mm2/W is also achieved at the interface between this new composite and copper substrate. These competent thermal properties demonstrate the great potential of the BN–In TIMs in thermal management for electronic system.
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| 8. |
- Luo, Xin, 1983, et al.
(författare)
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Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications
- 2014
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Ingår i: Journal of Materials Science: Materials in Electronics. - : Springer Science and Business Media LLC. - 1573-482X .- 0957-4522. ; 25:5, s. 2333-2338
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Tidskriftsartikel (refereegranskat)abstract
- With increased power density and continued miniaturization, effective thermal dissipation is of significant importance for operational lifetime and reliability of electronic system. Advanced thermal interface materials (TIMs) with excellent thermal performance need to be designed and developed. Here we report novel TIMs consisted of boron nitride (BN) nanofibers and pure indium (In) solder for heat dissipation applications. The BN nanofibers are fabricated by electrospinning process and nitridation treatment. After surface metallization by sputtering, the porous BN film is infiltrated with liquid indium by squeeze casting to form the final solid composites. The new composites show the in-plane and through-plane thermal conductivity respectively of 60 and 20 W/m K. The direction dependence thermal properties of the TIM are due to the anisotropic thermal performance of BN nanofibers in the composite. A low thermal contact resistance of 0.2 K mm(2)/W is also achieved at the interface between this new composite and copper substrate. These competent thermal properties demonstrate the great potential of the BN-In TIMs in thermal management for electronic system.
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| 9. |
- Murugesan, Murali, 1979, et al.
(författare)
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Carbon fiber solder matrix composite for thermal management of high power electronics
- 2014
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Ingår i: Journal of Materials Chemistry. - : Royal Society of Chemistry (RSC). - 1364-5501 .- 0959-9428 .- 2050-7534 .- 2050-7526. ; 2:35, s. 7184-7187
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Tidskriftsartikel (refereegranskat)abstract
- A carbon fiber based tin–silver–copper alloy matrix composite (CF-TIM) was developed via electrospinning of a mesophase pitch with polyimide and carbonization at 1000 °C, followed by sputter coating with titanium and gold, and alloy infiltration. The carbonized fibers, in film form, showed a thermal conductivity of [similar]4 W m−1 K−1 and the CF-TIM showed an anisotropic thermal conductivity of 41 ± 2 W m−1 K−1 in-plane and 20 ± 3 W m−1 K−1 through-plane. The thermal contact resistance of the CF-TIM was estimated to be below 1 K mm2 W−1. The CF-TIM showed no reduction in effective through-plane thermal conductivity after 1000 temperature cycles, which indicates the potential use of CF-TIM in thermal management applications.
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| 10. |
- Peng, Wangli, et al.
(författare)
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Mechanical properties of a novel Nano-Thermal Interface Material
- 2013
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Ingår i: Proceedings of the IEEE Conference on Nanotechnology. - 1944-9399 .- 1944-9380. - 9781479906758 ; , s. 942-945
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Konferensbidrag (refereegranskat)abstract
- Continued miniaturization in combination with increased performance in microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability in systems and devices. Thermal interface materials play a key role in the development of solutions for thermal management in microelectronics. In this paper, mechanical properties of a nanotechnology enhanced thermal interface material (Nano-TIM) were studied. The material is based on Sn-Ag-Cu based alloy reinforced with nano scale fiber matrix. Tensile tests were used to investigate and compare the elastic modulus at room temperature and mechanical strength between 20 to 100°C. Scanning Electron Microscopy (SEM) analysis techniques were used to investigate the morphology of the fracture section after tensile tests as well as the internal structure of the samples. The results show that the Nano-TIM can have a significantly lower elastic modulus compared to the pure alloy phase of SnAgCu due to its fiber phase. A lower elastic modulus of the solder joint can be important since it will reduce the stress transfer across the interface. This is particular important when the joint substrates have mismatching coefficients of thermal expansion. The findings of this study thus indicate that the Nano-TIM may provide a useful alternative to improve the thermomechanical reliability compared to pure solder joints. © 2013 IEEE.
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