| 1. |
- Chen, Shujing, et al.
(författare)
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Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
- 2019
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Ingår i: ChemistryOpen. - : Wiley. - 2191-1363. ; 8:1, s. 58-63
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Tidskriftsartikel (refereegranskat)abstract
- Functional fillers, such as Ag, are commonly employed for effectively improving the thermal or electrical conductivity in polymer composites. However, a disadvantage of such a strategy is that the cost and performance cannot be balanced simultaneously. Therefore, the drive to find a material with both a cost efficient fabrication process and excellent performance attracts intense research interest. In this work, inspired by the core-shell structure, we developed a facile manufacturing method to prepare graphene-encapsulated Cu nanoparticles (GCPs) through utilizing an improved chemical vapor deposition (CVD) system with a cold wall reactor. The obtained GCPs could retain their spherical shape and exhibited an outstanding thermal stability up to 179 degrees C. Owing to the superior thermal conductivity of graphene and excellent oxidation resistance of GCPs, the produced GCPs are practically used in a thermally conductive adhesive (TCA), which commonly consists of Ag as the functional filler. Measurement shows a substantial 74.6 % improvement by partial replacement of Ag with GCPs.
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| 2. |
- Cometto, O., et al.
(författare)
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Control of Nanoplane Orientation in voBN for High Thermal Anisotropy in a Dielectric Thin Film: A New Solution for Thermal Hotspot Mitigation in Electronics
- 2017
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:8, s. 7456-7464
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Tidskriftsartikel (refereegranskat)abstract
- High anisotropic thermal materials, which allow heat to dissipate in a preferential direction, are of interest as a prospective material for electronics as an effective thermal management solution for hot spots. However, due to their preferential heat propagation in the in-plane direction, the heat spreads laterally instead of vertically. This limitation makes these materials ineffective as the density of hot spots increases. Here, we produce a new dielectric thin film material at room temperature, named vertically ordered nanocrystalline h-BN (voBN). It is produced such that its preferential thermally conductive direction is aligned in the vertical axis, which facilitates direct thermal extraction, thereby addressing the increasing challenge of thermal crosstalk. The uniqueness of voBN comes from its h-BN nanocrystals where all their basal planes are aligned in the direction normal to the substrate plane. Using the 3 omega method, we show that voBN exhibits high anisotropic thermal conductivity (TC) with a 16-fold difference between through-film TC and in-plane TC (respectively 4.26 and 0.26 W.m(-1).K-1). Molecular dynamics simulations also concurred with the experimental data, showing that the origin of this anisotropic behavior is due to the nature of voBN's plane ordering. While the consistent vertical ordering provides an uninterrupted and preferred propagation path for phonons in the through-film direction, discontinuity in the lateral direction leads to a reduced in-plane TC. In addition, we also use COMSOL to simulate how the dielectric and thermal properties of voBN enable an increase in hot spot density up to 295% compared with SiO2, without any temperature increase.
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| 3. |
- Jing, Lin, et al.
(författare)
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Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays
- 2017
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:17, s. 14555-14560
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Tidskriftsartikel (refereegranskat)abstract
- We demonstrate the thermal conductivity enhancement of the vertically aligned carbon nanotube (CNT) arrays (from ?15.5 to 29.5 W/mK, ?90% increase) by encapsulating outer boron nitride nanotube (BNNT, 0.97 nm-thick with ?3-4 walls). The heat transfer enhancement mechanism of the coaxial C@BNNT was further revealed by molecular dynamics simulations. Because of their highly coherent lattice structures, the outer BNNT serves as additional heat conducting path without impairing the thermal conductance of inner CNT. This work provides deep insights into tailoring the heat transfer of arbitrary CNT arrays and will enable their broader applications as thermal interface material.
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| 4. |
- Liu, Ya, 1991, et al.
(författare)
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Egg albumen templated graphene foams for high-performance supercapacitor electrodes and electrochemical sensors
- 2018
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Ingår i: Journal of Materials Chemistry A. - : Royal Society of Chemistry (RSC). - 2050-7488 .- 2050-7496. ; 6:37, s. 18267-18275
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Tidskriftsartikel (refereegranskat)abstract
- We demonstrate a simple and scalable strategy to obtain N, S and Si co-doped biocompatible graphene foams (GFs) with different shapes using egg albumen as the template. The unique porous structure and element doping endow the GFs with a high charge-discharge rate and good wettability, which largely improve the electrochemical performance of the electrodes, including ultrahigh specific capacitance (534 F g-1at 1 A g-1), and excellent rate capability (308 F g-1at 100 A g-1) and cycling performance (96.1% retention of the initial capacitance after 10000 cycles at a high current density of 10 A g-1). Besides, when used as an electrochemical sensor for dopamine, the GF exhibits a detection limit as low as 1.2 μM with a linear response up to 70 μM, due to the low equivalent series resistance. These reveal great potential for promoting the application of 3D graphene in energy storage and electrochemical sensors.
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| 5. |
- Liu, Ya, 1991, et al.
(författare)
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Surface modification of graphene for use as a structural Fortifier in water-borne epoxy coatings
- 2019
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Ingår i: Coatings. - : MDPI AG. - 2079-6412. ; 9:11
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Tidskriftsartikel (refereegranskat)abstract
- Graphene, the typical two-dimensional sp2 hybridized carbon allotrope, is widely used as a filler for improving the mechanical performance of polymers. However, its superhydrophobic surface makes it a big challenge to obtain stable graphene dispersions, especially in water-borne systems. On the contrary, graphene oxide (GO) shows excellent dispersibility in water, but strong oxidants and acids destroy its structure and degrade its mechanical properties. This largely limits its application in water-borne coatings. In this work, graphene from mechanical exfoliation was surface modified by p-aminophenol derived diazonium salt to achieve a homogenous dispersion. Moreover, the hydroxyl groups in p-aminophenol are able to combine with epoxy resins during the curing process to improve mechanical performance of the final coatings. The result shows that functionalized graphene shows a lower coefficient of friction and better abrasion resistance compared to GO.
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| 6. |
- Liu, Ya, 1991, et al.
(författare)
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Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
- 2019
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Ingår i: Advancing Microelectronics. - 2222-8748. ; 2019:NOR, s. 1-5
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Tidskriftsartikel (refereegranskat)abstract
- Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.
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| 7. |
- Middeldorp, Christel M., et al.
(författare)
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The Early Growth Genetics (EGG) and EArly Genetics and Lifecourse Epidemiology (EAGLE) consortia : design, results and future prospects
- 2019
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Ingår i: European Journal of Epidemiology. - : Springer Science and Business Media LLC. - 0393-2990 .- 1573-7284. ; 34:3, s. 279-300
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Tidskriftsartikel (refereegranskat)abstract
- The impact of many unfavorable childhood traits or diseases, such as low birth weight and mental disorders, is not limited to childhood and adolescence, as they are also associated with poor outcomes in adulthood, such as cardiovascular disease. Insight into the genetic etiology of childhood and adolescent traits and disorders may therefore provide new perspectives, not only on how to improve wellbeing during childhood, but also how to prevent later adverse outcomes. To achieve the sample sizes required for genetic research, the Early Growth Genetics (EGG) and EArly Genetics and Lifecourse Epidemiology (EAGLE) consortia were established. The majority of the participating cohorts are longitudinal population-based samples, but other cohorts with data on early childhood phenotypes are also involved. Cohorts often have a broad focus and collect(ed) data on various somatic and psychiatric traits as well as environmental factors. Genetic variants have been successfully identified for multiple traits, for example, birth weight, atopic dermatitis, childhood BMI, allergic sensitization, and pubertal growth. Furthermore, the results have shown that genetic factors also partly underlie the association with adult traits. As sample sizes are still increasing, it is expected that future analyses will identify additional variants. This, in combination with the development of innovative statistical methods, will provide detailed insight on the mechanisms underlying the transition from childhood to adult disorders. Both consortia welcome new collaborations. Policies and contact details are available from the corresponding authors of this manuscript and/or the consortium websites.
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| 8. |
- Zhang, Q., et al.
(författare)
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Mechanical property and reliability of bimodal nano-silver paste with Ag-coated SiC particles
- 2019
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Ingår i: Soldering and Surface Mount Technology. - 1758-6836 .- 0954-0911. ; 31:4, s. 193-202
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Tidskriftsartikel (refereegranskat)abstract
- © 2019, Emerald Publishing Limited. Purpose: This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated. Design/methodology/approach: Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively. Findings: Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles. Originality/value: Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.
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| 9. |
- Banerjee, Debashree, et al.
(författare)
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Elevated thermoelectric figure of merit of n-type amorphous silicon by efficient electrical doping process
- 2018
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Ingår i: Nano Energy. - : Elsevier BV. - 2211-2855 .- 2211-3282. ; 44, s. 89-94
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Tidskriftsartikel (refereegranskat)abstract
- The currently dominant thermoelectric (TE) materials used in low to medium temperature range contain Tellurium that is rare and mild-toxic. Silicon is earth abundant and environment friendly, but it is characterized by a poor TE efficiency with a low figure of merit, ZT. In this work, we report that ZT of amorphous silicon (a-Si) thin films can be enhanced by 7 orders of magnitude, reaching ∼0.64 ± 0.13 at room temperature, by means of arsenic ion implantation followed by low-temperature dopant activation. The dopant introduction employed represents a highly controllable doping technique used in standard silicon technology. It is found that the significant enhancement of ZT achieved is primarily due to a significant improvement of electrical conductivity by doping without crystallization so as to maintain the thermal conductivity and Seebeck coefficient at the level determined by the amorphous state of the silicon films. Our results open up a new route towards enabling a-Si as a prominent TE material for cost-efficient and environment-friendly TE applications at room temperature.
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| 10. |
- Bao, Jie, et al.
(författare)
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Application of two-dimensional layered hexagonal boron nitride in chip cooling
- 2016
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Ingår i: Yingyong Jichu yu Gongcheng Kexue Xuebao/Journal of Basic Science and Engineering. - 1005-0930. ; 24:1, s. 210-217
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Tidskriftsartikel (refereegranskat)abstract
- © 2016, The Editorial Board of Journal of Basic Science and Engineering. All right reserved.Research into layered hexagonal boron nitride(h-BN)has recently intensified, due to its superior physicochemical properties compared to that of a typical two-dimensional material. H-BN can be utilized in power chips as both an insulating layer as well as a heat spreader for local hotspots with high heat flux. Single layer h-BN film grown by CVD and h-BN microparticles are respectively transferred onto the surfaces of the thermal evaluation chips, where the influence of h-BN on the heat dissipation performance of the chips can be observed at different power values. The resistance-temperature curve method and infrared thermal imager are both used to measure the temperature of hotspots on the thermal evaluation chips, which can be reduced by between 3~5℃ at 1W after the transfer of h-BN. The cooling efficiency is improved and it can be found that single layer h-BN film shows better heat dissipation ability.
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