| 1. |
- Chen, Shujing, et al.
(author)
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Manufacturing Graphene-Encapsulated Copper Particles by Chemical Vapor Deposition in a Cold Wall Reactor
- 2019
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In: ChemistryOpen. - : Wiley. - 2191-1363. ; 8:1, s. 58-63
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Journal article (peer-reviewed)abstract
- Functional fillers, such as Ag, are commonly employed for effectively improving the thermal or electrical conductivity in polymer composites. However, a disadvantage of such a strategy is that the cost and performance cannot be balanced simultaneously. Therefore, the drive to find a material with both a cost efficient fabrication process and excellent performance attracts intense research interest. In this work, inspired by the core-shell structure, we developed a facile manufacturing method to prepare graphene-encapsulated Cu nanoparticles (GCPs) through utilizing an improved chemical vapor deposition (CVD) system with a cold wall reactor. The obtained GCPs could retain their spherical shape and exhibited an outstanding thermal stability up to 179 degrees C. Owing to the superior thermal conductivity of graphene and excellent oxidation resistance of GCPs, the produced GCPs are practically used in a thermally conductive adhesive (TCA), which commonly consists of Ag as the functional filler. Measurement shows a substantial 74.6 % improvement by partial replacement of Ag with GCPs.
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| 2. |
- Wang, Nan, et al.
(author)
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Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
- 2018
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In: 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). - 9781538663868 - 9781538663868 ; , s. 1588-1592
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Conference paper (peer-reviewed)abstract
- A light-weight, robust and highly thermal conductive copper/graphene film laminated structure was developed as novel heat spreading materials for thermal management applications. The advantages of the copper/graphene film laminated structure lie in its ability to combine both good mechanical properties of metals and excellent thermal properties of graphene film. Graphene films (GFs) were fabricated via self-assembly of graphene oxide (GO) sheets and post-treated by high temperature graphitization and mechanical pressing. The resulted GFs show excellent flexibility and greatly improved tensile strength which is over 3 times higher than commercial PGS. The successful lamination between copper and GFs was realized by indium bonding. Thin indium layers can provide complete physical contact between copper and GFs, and thereby, minimize the contact resistance induced by surface roughness. The measured contact thermal resistance between copper and GFs bonded by indium is in the range of 2-5 Kmm(2)/W for a working temperature between 20 degrees C to 100 degrees C. This value is orders magnitude lower than other bonding methods, including direct hot pressing of copper and GFs, tape bonding and thermal conductive adhesive (TCA) bonding. By tailoring the thickness of GFs, desirable laminated composites with optimized thermal conductivity can be obtained, which offers an efficient heat dissipation solution for power driven systems.
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| 3. |
- Wang, Nan, et al.
(author)
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Vertically Aligned Graphene-based Thermal Interface Material with High Thermal Conductivity
- 2018
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In: THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. - 9781538667590 ; , s. 285-288
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Conference paper (peer-reviewed)abstract
- High density packaging in combination with increased transistor integration inevitably leads to challenging power densities in terms of thermal management. Here, a novel highly thermal conductive and lightweight graphene based thermal interface materials (GT) was developed for thermal management in power devices. Composed by vertically graphene structures, GTs provide a continuous high thermal conductivity phase along the path of thermal transport, which lead to outstanding thermal properties. The highest through-plane thermal conductivity GTs reaches to 1000 W/mK, which is orders of magnitude higher than conventional TIMs, and even outperforms the pure indium by over ten times. In addition, a thin layer of indium metal that coated on the surface of GTs can easily form alloys with many other metals at a relatively low reflow temperature. Therefore, GTs, as an excellent TIM, can provide complete physical contact between two surfaces with minimized the contact resistance. The measured total thermal resistance and effective thermal conductivity by using 300 mu m thick GTs as TIM between two copper blocks reaches to similar to 3.7 Kmm(2)/W and similar to 90 W/mK, respectively. Such values are significantly higher than the randomly dispersed composites presented above, and show even better thermal performance than pure indium bonding. In addition, GTs has more advantages than pure indium bonding, including low weight (density < 2 g/cm(3)), low complexity during assembly and maintainability. The resulting GTs thus opens new opportunities for addressing large heat dissipation issues in form-factor driven electronics and other high power driven systems.
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