| 1. |
- Chen, Si, 1981, et al.
(författare)
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A High Performance Ag Alloyed Nano-scale n-type Bi2Te3 Based Thermoelectric Material
- 2015
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Ingår i: Materials Today: Proceedings. - : Elsevier BV. - 2214-7853. ; 2:2, s. 610-619
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Konferensbidrag (refereegranskat)abstract
- A silver alloyed n-type bismuth telluride (Bi2Te3) thermoelectric (TE) bulk material with nano crystalline structure was studied and characterized in this paper. The Bi2Te3 nanopowders used in this study were first fabricated via a patented explosion based process. Then, the various concentrations of Ag nanoparticles (0-20 wt. %) were added into the Bi2Te3 nanopowders in order to increase the electrical conductivity. Combining the benefits of high electrical conductivity (1.51x10(5) S.m(-1)) and low thermal conductivity (0.441 W.m(-1).K-1), the dimensionless figure of merit (ZT value) of 1.48 for this n-type Bi2Te3 TE material is achieved at 300 K temperature.
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| 2. |
- Chen, Si, 1981, et al.
(författare)
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Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced With Bi2Te3 Nanoparticles
- 2015
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Ingår i: IEEE Transactions on Components, Packaging and Manufacturing Technology. - : Institute of Electrical and Electronics Engineers (IEEE). - 2156-3985 .- 2156-3950. ; 5:8, s. 1186-1196
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Tidskriftsartikel (refereegranskat)abstract
- Nanocomposite solders are regarded as one of the most promising interconnect materials for the high-density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. The compatibility issue will lead to a huge loss of nanoparticles from the solder matrix after the reflow soldering process. The thermal fatigue resistance of solder joint will also become degraded. Therefore, aiming to solve this problem, a novel nanocomposite solder consisting of Bi2Te3 semiconductor nanoparticles and Sn-3.0Ag-0.5Cu (SAC305) solder is presented. The effect of nanoparticles on the viscosity of solder paste and the void content of solder bump was first studied. Then, a series of analysis on the composition and microstructure of the solder bump were completed using transmission electron microscopy, X-ray diffraction, inductively coupled plasma-mass spectrometry, scanning electron microscopy, and energy dispersive X-ray spectroscopy. The survival rate of nanoparticles in the solder bump after reflow soldering process reaches as high as 80%. The refined microstructure was observed from the cross section of the nanocomposite solders. The shear test showed that the average mechanical strength of SAC305 solder after the addition of Bi2Te3 nanoparticles was higher. Meanwhile, no thermal fatigue resistance degradation was detected in the nanocomposite solder after 1000 thermal cycles in the range of -40 degrees C to 115 degrees C.
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| 3. |
- Jeong, Seung Hee, et al.
(författare)
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Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment
- 2015
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Ingår i: Scientific Reports. - : Springer Science and Business Media LLC. - 2045-2322. ; 5
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Tidskriftsartikel (refereegranskat)abstract
- Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.
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| 4. |
- Jeong, Seung Hee, 1978-, et al.
(författare)
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Stretchable Thermoelectric Generators Metallized with Liquid Alloy
- 2017
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Ingår i: ACS Applied Materials & Interfaces. - : American Chemical Society (ACS). - 1944-8252 .- 1944-8244. ; 9:18, s. 15791-15797
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Tidskriftsartikel (refereegranskat)abstract
- Conventional thermoelectric generators (TEGs) are normally hard, rigid, and flat. However, most objects have curvy surfaces, which require soft and even stretchable TEGs for maximizing efficiency of thermal energy harvesting. Here, soft and stretchable TEGs using conventional rigid Bi2Te3 pellets metallized with a liquid alloy is reported. The fabrication is implemented by means of a tailored layer-by-layer fabrication process. The STEGs exhibit an output power density of 40.6 ?W/cm2 at room temperature. The STEGs are operational after being mechanically stretched-and-released more than 1000 times, thanks to the compliant contact between the liquid alloy interconnects and the rigid pellets. The demonstrated interconnect scheme will provide a new route to the development of soft and stretchable energy-harvesting avenues for a variety of emerging electronic applications.
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| 5. |
- Jeong, Seung Hee, et al.
(författare)
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Thermal Elastomer Composites for Soft Transducers
- 2015
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Ingår i: 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. - : IEEE conference proceedings. - 9781479989553 ; , s. 1873-1876
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Konferensbidrag (refereegranskat)abstract
- There is a need for thermal elastomer composites (TEC) which are stretchable, electrically insulating and easily processablefor soft and stretchable sensor or actuator systems as a thermal conductor or heat spreader at an interface or in a package.A novel TEC was made by embedding a gallium based liquid alloy (Galinstan) as a droplet in polydimethylsiloxane (PDMS,Elastosil RT 601) matrix with a high speed mechanical mixing process.
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| 6. |
- Jiang, Di, 1983, et al.
(författare)
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Vertically stacked carbon nanotube-based interconnects for through silicon via application
- 2015
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Ingår i: IEEE Electron Device Letters. - 0741-3106 .- 1558-0563. ; 36:5, s. 499-501
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Tidskriftsartikel (refereegranskat)abstract
- Stacking of silicon chips with carbon nanotube (CNT)-based through-silicon vias (TSVs) is experimentally demonstrated. Polymer filling is used to improve the transfer quality of CNTs into pre-etched silicon holes. Special hexagonal CNTs are designed to achieve high aspect ratio (10:1) CNT vias. TSVs filled with closely packed CNTs show a highly linear dc I - V response. The proposed process works at room temperature, which makes it compatible with existing device fabrication flow.
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| 7. |
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| 8. |
- Sun, Shuangxi, 1986, et al.
(författare)
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Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging
- 2016
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Ingår i: Microelectronics and Reliability. - : Elsevier BV. - 0026-2714. ; 56, s. 129-135
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Tidskriftsartikel (refereegranskat)abstract
- This paper presents a novel nanocomposite thermal interface material (Nano-TIM) consisting of a silver coated polyimide network and the indium matrix. One of the potential applications of this Nano-TIM is for heat dissipation in integrated circuits and electronic packaging. The shear strength of the Nano-TIM was investigated with DAGE-4000PSY shear tester. The shear strength of Nano-TIM is 4.5 MPa, which is 15% higher than that of the pure indium thermal interface material. The microstructure of cross-section and fracture surface was studied using Scanning Electron Microscopy (SEM). SEM pictures show a uniform polymer fiber distribution and solid interface between silver coated fibers and indium matrix. The thermal fatigue resistance of the Nano-TIM was evaluated by monitoring the variation of thermal interface resistance during the thermal cycling test (-40 to 125 degrees C). The thermal interface resistance was measured with a commercial xenon flash instrument after 100, 200, 300, 400, 500, and 1000 temperature cydes. The results-of thermal cycling test show that Nano-TIM presented consistent reliability performance with pure indium. Furthermore, the tooling effect of Nano-TIM was demonstrated through measuring the power chip temperature in the die attached structure by using an Infrared Camera. In the test, the Nano-TIM shows a comparable cooling effect to pure indium TIM for die attach applications in electronics packaging.
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| 9. |
- Ye, Lilei, et al.
(författare)
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Mechanical characterization ofnanoparticleenhancedSn-3.0Ag-0.5Cu solder
- 2016
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Ingår i: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Konferensbidrag (refereegranskat)abstract
- Solder plays an important role as interconnect in the electronics assembly, which provide the necessary electrical, mechanical and thermal continuity. In recent years, miniaturization of the portable products demands better solder-joint performance and conventional solder technology can not guarantee device reliability. The particle reinforced solder alloy is considered as the potentially available method to enhance the solder joints. The particle size should be small enough to hinder the grain boundary sliding and suppress the growth of intermetallic compound. Nanocomposite solders are regarded as one of the most promising interconnect materials for the high density electronic packaging due to their high mechanical strength and fine microstructure. However, the developments of nanocomposite solders have been limited by the inadequate compatibility between nanoparticles and solder matrix with respect to density, hardness, coefficient of thermal expansion, and surface activity. In order to solve this problem, carbon nanotube (CNT) was selected as reinforcement materials in Sn-3.0Ag-0.5Cu solder in this work. The effect of the nanoparticle on void content of solder bump was studied. The microstructure and shear strength of nanosocomposite solders were also investigated.
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