| 1. |
- Wang, Nan, et al.
(author)
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Highly Thermal Conductive and Light -weight Craphene-based Heatsink
- 2019
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In: 2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC). - 2165-2341. - 9780956808660
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Conference paper (peer-reviewed)abstract
- With the developing trend ofminiaturization and integration of modem electronic devices, commercial hearsinks ivaterigh, like copper and ii iv are facing mare and mare challenges, such as inefficient cooling performance, large size turd heavy weight. Here, we salve the probletn by developing a novel highly thermal conductive and 11Mo-weight graphene heatsink. Cornposed by vertically-aligned and continUOUS graphene structures, heat transport was highly efficiero from the base 1o fin Ii: ininside the heatsink, The maximum through-platre thermal catuluctivity ofgraphene heatsink can be up to 1000 1500 Ward( which is over 7 times higher than aluminum, and even outperforms copper about 4 times_ Gmphene heatsink demonstrated outstanding cooling perffrmance which wm superior to copper heatsink with the same dimension and same power input. Noticeably, the graphene hearsink also has anportant advantagas of light-weight and high emissions,. The measured density (1 1 g cmli is only onroeighth of copper and lam than hoor of aluminum and emissivity is about ten times hiher than pure rapper and aluminum. The resulting graphene heatsink thus opertS rim opportunities for addressing large heat dissMatMn issues in weight' driven electronics and othm high power smions.
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| 2. |
- Bao, Jie, et al.
(author)
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Synthesis and Applications of Two-Dimensional Hexagonal Boron Nitride in Electronics Manufacturing
- 2016
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In: Electronic Materials Letters. - : Springer Science and Business Media LLC. - 1738-8090 .- 2093-6788. ; 12:1, s. 1-16
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Research review (peer-reviewed)abstract
- In similarity to graphene, two-dimensional (2D) hexagonal boron nitride (hBN) has some remarkable properties, such as mechanical robustness and high thermal conductivity. In addition, hBN has superb chemical stability and it is electrically insulating. 2D hBN has been considered a promising material for many applications in electronics, including 2D hBN based substrates, gate dielectrics for graphene transistors and interconnects, and electronic packaging insulators. This paper reviews the synthesis, transfer and fabrication of 2D hBN films, hBN based composites and hBN-based van der Waals heterostructures. In particular, this review focuses on applications in manufacturing electronic devices where the insulating and thermal properties of hBN can potentially be exploited. 2D hBN and related composite systems are emerging as new and industrially important materials, which could address many challenges in future complex electronics devices and systems.
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| 3. |
- Fu, Yifeng, 1984, et al.
(author)
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Carbon nanotube growth on different underlayers for thermal interface material application
- 2016
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In: IMAPS Nordic Annual Conference 2016 Proceedings. - 9781510827226
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Conference paper (peer-reviewed)abstract
- Thermal interface material (TIM) is a critical component in thermal management of high density packaging systems since both the reliability and lifetime of microsystems are dependent on how the heat is dissipated. Carbon nanotubes (CNTs) are promising candidate for development of TIMs due to their excellent thermal and mechanical properties. The thermal conductivity of CNTs can be up to 3000 W/mK in the longitudinal direction which acts as ideal heat transfer path. However, the huge interfacial thermal resistance between CNTs and contact surface hinders the exploitation of CNTs as TIMs. In this paper, we will focus on the growth of CNTs on various substrates and underlayers and analyze the interaction between catalyst and underlayer materials. Microscopic analysis is performed to characterize the quality of the CNT materials and monitor the diffusion of Fe particles into different barrier layers. Thermal conductivity of the CNT TIMs will be measured to examine the performance of the materials.
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| 4. |
- Hansson, Josef, 1991, et al.
(author)
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Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications
- 2018
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In: Proceedings - Electronic Components and Technology Conference. - 0569-5503. ; 2018-May
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Conference paper (peer-reviewed)abstract
- Hybrid films based on vertically aligned carbon nanotubes (CNTs) on graphene or graphite sheets have been proposed for application as thermal interface materials and micro heat sinks. However, the fabrication of these materials are limited to small scale, expensive and complicated chemical vapor deposition (CVD) for CNT synthesis. We present a new method for direct growth of CNTs on one or both sides of a thin graphene film (GF) using joule self-heating of the graphene film to provide the necessary heat for the thermal breakdown of carbon feedstock in a CVD process. The resulting CNT forests show good density and alignment consistent with regular CVD synthesis processes on silicon surfaces. The resulting double sided GF/CNT hybrid film is directly applicable as a thermal pad. The CNT forest has a thermal conductivity of 30 W/mK, measured by pulsed photothermal reflectance, and the total thermal interface resistance between aluminum blocks was measured to be 60 Kmm 2 /W using an ASTM D5470 compliant 1-D measurement setup. This method of directly synthesizing CNTs on graphene films is more energy efficient and capable of larger volume production compared to traditional CVD methods. It is also compatible with scaling up towards continuous roll-to-roll production for large scale commercial production, one of the major limitations preventing CVD-grown CNTs from commercial applications
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| 5. |
- Huang, Shirong, et al.
(author)
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Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging
- 2016
-
In: 6th Electronic System-integration Technology Conference (ESTC 2016). - 9781509014026 ; , s. Article no 7764696-
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Conference paper (peer-reviewed)abstract
- Vertically-aligned multiwall carbon nanotubes were deposited on silicon substrate by low pressure chemical vapor deposition (LPCVD), which can be utilized as heat spreaders in high power electronic packaging due to their remarkable thermal conductivity. The infrared emissivity of the vertically aligned multiwall carbon nanotubes was then characterized based on the FLIR SC600 infrared imaging system. The average infrared emissivity of the multiwall carbon nanotubes sample was about 0.92, which agrees well with experimental results reported before. Scanning electron microscopy (SEM) images of the multiwall carbon nanotubes were further analyzed to explain its high emissivity, and the reason can be attributed to the homogeneous sparseness and aligned structure of the vertically aligned multiwall carbon nanotubes
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| 6. |
- Huang, Shirong, et al.
(author)
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Reliability of Graphene-based Films Used for High Power Electronics Packaging
- 2015
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In: 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015. - 9781467379991 ; , s. 852-855
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Conference paper (peer-reviewed)abstract
- Graphene-base film was fabricated with chemical conversion process, including graphene oxide (GO) prepared by Hummer's method, graphene oxide reduced with L-ascorbic acid (LAA), graphene based film deposited by vacuum filtration process. Meanwhile, the functionalization of the graphene-based film was performed to decrease the thermal interface resistance between the graphene-based film and substrate. Characterization data showed that the graphene-based film possessed high reliability after 500 hours under 85°C aging test. In summary, the graphene-based film can be a promising solution in thermal management of high power electronics.
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| 7. |
- Huang, Shirong, et al.
(author)
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The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
- 2016
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In: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. - 9781509013968 ; , s. Art no 7583272; Pages 889-892
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Conference paper (peer-reviewed)abstract
- Graphene-based films (GBF) were fabricated using a chemical conversion process including graphene oxide (GO) preparation by use of Hummer’s method, graphene oxide reduction using L-ascorbic acid (LAA), and finally film formation by vacuum filtration. GBF is considered as a candidate material for thermal management, i.e. for removing heat from hotspots in power electronic packaging, due to its high thermal conductivity. In this work, the GBF heat spreading performance in 3D TSV packaging was analysed using finite element methods (FEM) implemented in the COMSOL software. Both size effects and the influence of the thermal conductivity of the GBF heat spreader on the thermal performance of the 3D TSV package were evaluated. Furthermore, the size effects of the thermal conductive adhesive (TCA) underfill between the chip and the printed circuit board (PCB) were analysed. The results obtained are critical for proper design of graphene-based lateral heat spreaders in high power electronic packaging.
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| 8. |
- Kabiri Samani, Majid, 1976, et al.
(author)
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Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds
- 2018
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In: Advanced Materials Interfaces. - : Wiley. - 2196-7350. ; 5:15
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Journal article (peer-reviewed)abstract
- Graphene and carbon nanotubes have received much attention for thermal management application due to their unique thermal performance. Theoretical work suggests that a covalent bond can combine 1D carbon nanotubes with 2D graphene together to extend the excellent thermal property to three dimensions for heat dissipation. This paper experimentally demonstrates the high heat dissipation capability of a freestanding 3D multiwall carbon nanotube (MWCNT) and graphene hybrid material. Using high-resolution transmission electron microscopy and pulsed photothermal reflection measurement method, the covalent bonds between MWCNT and planar graphene are microscopically and numerically demonstrated. Thermal resistance at the junction with covalent bonds is 9×10^−10 Kelvin square meter per watt, which is three orders of magnitude lower than van der Waals contact. Joule heating method is used to verify the extra cooling effect of this 3D hybrid material compared to graphite film. A demonstrator using high power chip is developed to demonstrate the applicability of this hybrid material in thermal application. Temperature at hot spots can be decreased by around 10°C with the assistance of this hybrid material. These findings are very significant for understanding the thermal conduction during combining 1D and 2D carbon material together for future thermal management application.
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| 9. |
- Li, Qi, 1990, et al.
(author)
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Compact and low loss electrochemical capacitors using a graphite / carbon nanotube hybrid material for miniaturized systems
- 2019
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In: Journal of Power Sources. - : Elsevier BV. - 0378-7753. ; 412, s. 374-383
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Journal article (peer-reviewed)abstract
- With the establishment of the internet of things (IoT) and the rapid development of advanced microsystems, there is a growing demand to develop electrochemical capacitors (ECs) to replace bulky electrolytic capacitors on circuit boards for AC line filtering, and as a storage unit in energy autonomous systems. For this purpose, ECs must be capable of handling sufficiently high signal frequencies, display minimum energy loss through self-discharge and leakage current as well as maintaining an adequate capacitance. Here, we demonstrate ECs based on mechanically flexible, covalently bonded graphite/vertically aligned carbon nanotubes (graphite/VACNTs) hybrid materials. The ECs employing a KOH electrolyte exhibit a phase angle of −84.8°, an areal capacitance of 1.38 mF cm−2 and a volumetric capacitance (device level) of 345 mF cm−3 at 120 Hz, which is among the highest values for carbon based high frequency ECs. Additionally, the performance as a storage EC for miniaturized systems is evaluated. We demonstrate capacitive charging/discharging at μA current with a gel electrolyte, and sub-μA leakage current reached within 50 s, and 100 nA level equilibrium leakage within 100 s at 2.0 V floating with an ionic liquid electrolyte.
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| 10. |
- Long, Xu, et al.
(author)
-
Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation
- 2018
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In: International Journal of Applied Mechanics. - 1758-8251 .- 1758-826X. ; 10:10
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Journal article (peer-reviewed)abstract
- Finite element (FE) simulation is adopted as a fundamental tool to evaluate the mechanical reliability of packaging structures for electronic devices. Nevertheless, the determination of mechanical properties of sintered silver nanoparticles (AgNP) remains challenging as the traditional tensile test is difficult to be performed at a limited size. In the current study, spherical nanoindentation is utilized to measure the applied load-penetration depth responses of sintered AgNP reinforced by SiC microparticles at various weight ratios (0.0, 0.5, 1.0 and 1.5 wt.%). To describe the elasto-plastic behavior of this heterogeneous material, FE analysis is performed to simulate the indentation behavior and determine the parameters in the modified power-law model by fitting the average applied load-penetration depth responses. To overcome the uniqueness problem, the Young's modulus is directly determined by continuous stiffness measurement technique and the proposed constitutive model can provide a reasonably accurate mechanical estimation of sintered AgNP. The effect of SiC content on sintered AgNP is discussed by correlating the morphology observed by scanning electron microscope (SEM) and the constitutive parameters obtained from the FE simulations.
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