| 1. |
- Huang, Shirong, et al.
(författare)
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Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging
- 2016
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Ingår i: 6th Electronic System-integration Technology Conference (ESTC 2016). - 9781509014026 ; , s. Article no 7764696-
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Konferensbidrag (refereegranskat)abstract
- Vertically-aligned multiwall carbon nanotubes were deposited on silicon substrate by low pressure chemical vapor deposition (LPCVD), which can be utilized as heat spreaders in high power electronic packaging due to their remarkable thermal conductivity. The infrared emissivity of the vertically aligned multiwall carbon nanotubes was then characterized based on the FLIR SC600 infrared imaging system. The average infrared emissivity of the multiwall carbon nanotubes sample was about 0.92, which agrees well with experimental results reported before. Scanning electron microscopy (SEM) images of the multiwall carbon nanotubes were further analyzed to explain its high emissivity, and the reason can be attributed to the homogeneous sparseness and aligned structure of the vertically aligned multiwall carbon nanotubes
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| 2. |
- Huang, Shirong, et al.
(författare)
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The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging
- 2016
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Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. - 9781509013968 ; , s. Art no 7583272; Pages 889-892
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Konferensbidrag (refereegranskat)abstract
- Graphene-based films (GBF) were fabricated using a chemical conversion process including graphene oxide (GO) preparation by use of Hummer’s method, graphene oxide reduction using L-ascorbic acid (LAA), and finally film formation by vacuum filtration. GBF is considered as a candidate material for thermal management, i.e. for removing heat from hotspots in power electronic packaging, due to its high thermal conductivity. In this work, the GBF heat spreading performance in 3D TSV packaging was analysed using finite element methods (FEM) implemented in the COMSOL software. Both size effects and the influence of the thermal conductivity of the GBF heat spreader on the thermal performance of the 3D TSV package were evaluated. Furthermore, the size effects of the thermal conductive adhesive (TCA) underfill between the chip and the printed circuit board (PCB) were analysed. The results obtained are critical for proper design of graphene-based lateral heat spreaders in high power electronic packaging.
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| 3. |
- Zhang, Yong, 1982, et al.
(författare)
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2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS
- 2016
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Ingår i: China Semiconductor Technology International Conference 2016, CSTIC 2016. - 9781467388047
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Konferensbidrag (refereegranskat)abstract
- The need for faster and smaller, as well as more reliable and efficient consumer electronic products has resulted in microelectronic components that produce progressively more heat. The resultant reliability issues from the increased heat flux are serious and hinder technological development. One solution for microelectronics cooling applications is 2D materials applied as heat spreaders and these include monolayer graphene, graphene based films, and monolayer hexagonal boron nitride and BN based films. In addition, thermal performances of the graphene heat spreader were also studied under different packaging structures, including wire bonding, cooling fins and flip chips. Finally, 2D hexagonal Boron nitride (h-BN) heat spreaders, fabricated by different methods, had their heat dissipation performances characterized by different thermal characterization methods, such as resistance temperature detector (RTD) and Infrared (IR) methods. In conclusion, these new novel 2D materials developed show great potential for microelectronics cooling applications.
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| 4. |
- Zhang, Yan, et al.
(författare)
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Experimental investigation of paraffin wax with graphene enhancement as thermal management materials for batteries
- 2016
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Ingår i: 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016. - 9781509013968 ; , s. 1401-1405
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Konferensbidrag (refereegranskat)abstract
- Battery packs have been widely used as the power source in many fields, such as pure or hybrid electric vehicles, because of the advantages of high energy density, long cycle life, low self-discharge rate, no memory effect and so on. The heat dissipation is a key issue in the reliability of the batteries, especially for high power applications. Paraffin waxes are commonly used phase change materials in the thermal management of Li-ion battery packs. In order to improve the thermal performance, graphene powders are utilized as additives to increase the thermal conductivity of paraffin waxes. A series of graphene-enhanced paraffin wax samples are prepared, and then the prepared samples are applied to power sources for experimental evaluation. The results show an improved heat dissipation of paraffin waxes with graphene enhancement. Temperature rise in the heat source can be decreased, and the effect is more obvious for higher power case.
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