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Sökning: WFRF:(Wei Yong jie) > Chalmers tekniska högskola

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1.
  • 2019
  • Tidskriftsartikel (refereegranskat)
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2.
  • Meng, Long, et al. (författare)
  • Dynamic Response of 6MW Spar Type Floating Offshore Wind Turbine by Experiment and Numerical Analyses
  • 2020
  • Ingår i: China Ocean Engineering. - : Springer Science and Business Media LLC. - 0890-5487 .- 2191-8945. ; 34:5, s. 608-620
  • Tidskriftsartikel (refereegranskat)abstract
    • The floating offshore wind turbine (FOWT) is widely used for harvesting marine wind energy. Its dynamic responses under offshore wind and wave environment provide essential reference for the design and installation. In this study, the dynamic responses of a 6MW Spar type FOWT designed for the water depth of 100 m are investigated by means of the wave tank experiment and numerical analysis. A scaled model is manufactured for the experiment at a ratio of 65.3, while the numerical model is constructed on the open-source platform FAST (Fatigue, Aerodynamics, Structures, and Turbulence). Still water tests, wind-induced only tests, wave-induced only tests and combined wind-wave-current tests are all conducted experimentally and numerically. The accuracy of the experimental set-up as well as the loading generation has been verified. Surge, pitch and heave motions are selected to analyze and the numerical results agree well with the experimental values. Even though results obtained by using the FOWT calculation model established in FAST software show some deviations from the test results, the trends are always consistent. Both experimental and numerical studies demonstrate that they are reliable for the designed 6MW Spar type FOWT.
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3.
  • Sun, Shuangxi, 1986, et al. (författare)
  • Cooling hot spots by hexagonal boron nitride heat spreaders
  • 2015
  • Ingår i: Proceedings - Electronic Components and Technology Conference. - 0569-5503. - 9781479986095 ; http://www.grapchina.com/Fhzt/view/id/96.html
  • Konferensbidrag (refereegranskat)abstract
    • As the electronic systems become smaller and faster, a thinner and higher-efficiency heat spreader is demanded to meet the thermal dissipation requirement. In this work, we proposed a layered hBN film based heat spreader to dissipate the thermal energy generated by hot spots on high power chips. The liquid phase exfoliation method was employed to synthesize hBN flakes. Different layers of hBN film were characterized using SEM, TEM and Raman spectroscopy. Afterwards, the films were directly attached onto the target power chips. The power chips were integrated with temperature sensor and hot spot in order to analyze the thermal performance of the hBN heat spreader. IR Camera was used to capture the heat spreading effect of the hBN heat spreader and monitor the temperature distribution around the hot spot. The temperature at the hot spot driven by a heat flux of around 600W/cm2 was decreased by about 20% compared to the sample without the BN film. The potential of using hBN heat spreader for cooling hot spots was demonstrated in this work.
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